ZIP DRAM Search Results

dram zip

Abstract: Z03 Series AK14Z-N AK16Z-N AK16Z-W AK20Z-N AK20Z-W AK24Z-W AK28Z-W
Contextual Info: Accutek Microcircuit Corporation ZIP Adapter Modules DESCRIPTION FEATURES The Accutek family of ZIP Adapter Modules is designed to convert any digital integrated circuit in SOIC package to side-mounted ZIP modules. The Accutek ZIP Modules can be used to save space on thru-hole boards or replace

Contextual Info: ZIP Adapter Modules ACCUTEK MICROCIRCUIT CORPORATION DESCRIPTION FEATURES The Accutek family of ZIP Adapter Modules is designed to convert any digital integrated circuit in SOIC package to side-mounted ZIP modules. The Accutek ZIP Modules can be used to save space on thru-hole boards or replace

AK14Z-N

Abstract: AK16Z-N AK16Z-W AK20Z-N AK20Z-QSOP AK20Z-QSOP-LH AK20Z-QSOP-WPC AK20Z-SOIC-WPC AK20Z-SOJ AK20Z-W
Contextual Info: ACCUTEK ZIP Adapter Modules MICROCIRCUIT CORPORATION DESCRIPTION FEATURES The Accutek family of ZIP Adapter Modules is designed to convert any digital integrated circuit in SOIC package to side-mounted ZIP modules. The Accutek ZIP Modules can be used to save space on thru-hole boards or replace

footprint soic

Abstract: AN-06 FCT244A
Contextual Info: AN-06: ZIP Packages for Logic Q ZIP Packages for Logic Provide High-Density and High-Speed Application Note AN-06 ZIP packages for high-speed logic such as the FCT family provide high packing density in a through-hole package coupled with superior speed and ground bounce performance. ZIP packages provide density

Contextual Info: Series 539 ZIP-DRAM to .300 [.76] DIP Adapter FEATURES: •Convert existing ZIP-DRAM device to .300 [.76] center DIP socket. •Designed especially to convert Mitsubishi, Fujitsu, etc., Dynamic RAMS. SPECIFICATIONS: •PCB is black FR-4, .062 [1.56] thick, with 1 ounce

LH64256CZ70

Contextual Info: DRAM Dynamic RAM Random Access Memory ZIP LH64256CZ70 CMOS 1M 256K x 4

20 pin socket zip dip

Abstract: amp zip socket 28
Contextual Info: Series 539 ZIP-DRAM to .300 [.76] DIP Adapter FEATURES: • Convert existing ZIP-DRAM device to .300 [.76] center DIP socket. • Designed especially to convert Mitsubishi, Fujitsu, etc., Dynamic RAMS. SPECIFICATIONS: • PCB is black FR-4, .062 [1.56] thick, with 1 ounce Copper traces

Contextual Info: Series 539 ZIP-DRAM to .300 [.76] DIP Adapter FEATURES: • Convert existing ZIP-DRAM device to .300 [.76] center DIP socket. • Designed especially to convert Mitsubishi, Fujitsu, etc., Dynamic RAMS. SPECIFICATIONS: • PCB is black FR-4, .062 [1.56] thick, with 1 ounce Copper

Contextual Info: M T4C4003J lEG X 4 DRAM M IC R O N 1 MEG DRAM X 4 DRAM DRAM STATIC COLUMN FEATURES PIN ASSIGNMENT (Top View OPTIONS 20-Pin ZIP (DC-1) (DB-2) DQ1 DQ2 WE RAS A9 MARKING • Timing 70ns access 80ns access • Packages Plastic SOJ (300 mil) Plastic ZIP (350 mil)

Contextual Info: MICRON TECHNOLOGY INC ' IME D B b i l l 5 Mi ÒaOOfl'H 2 PRELIMINARY T - y ¿ - 2 3 -1 5 4 MEG X 1 DRAM DRAM FAST PAGE MODE FEATURES OPTIONS 20 Pin DIP p[ • Packages Plastic DIP Ceramic DIP Plastic ZIP Plastic SOJ - A2Ü7 A3 [8 Vcc [9 8 20 Pin ZIP A9 18 ]Vss

AK62464

Abstract: AK62464Z
Contextual Info: Accutek Microcircuit Corporation AK62464Z 65,536 x 24 Bit CMOS/BiCMOS Static Random Access Memory DESCRIPTION 64-Pin ZIP The Accutek AK62464 SRAM Module consists of fast high performance SRAMs mounted on a low profile, 64 pin ZIP Board. The module utilizes four 28 pin 64K x 4 SRAMs in 300 mil SOJ packages

AK62464

Abstract: AK62464Z
Contextual Info: Accutek Microcircuit Corporation AK62464Z 65,536 x 24 Bit CMOS/BiCMOS Static Random Access Memory DESCRIPTION 64-Pin ZIP The Accutek AK62464 SRAM Module consists of fast high performance SRAMs mounted on a low profile, 64 pin ZIP Board. The module utilizes four 28 pin 64K x 4 SRAMs in 300 mil SOJ packages

AK62464

Abstract: AK62464Z
Contextual Info: Accutek Microcircuit Corporation AK62464Z 65,536 x 24 Bit CMOS/BiCMOS Static Random Access Memory DESCRIPTION 64-Pin ZIP The Accutek AK62464 SRAM Module consists of fast high performance SRAMs mounted on a low profile, 64 pin ZIP Board. The module utilizes six 28 pin 64K x 4 SRAMs in 300 mil SOJ packages

jedec bottom

Contextual Info: AK62464Z 65,536 x 24 Bit CMOS/BiCMOS Static Random Access Memory MICROCIRCUIT CORPORATION DESCRIPTION 64-Pin ZIP The Accutek AK62464 SRAM Module consists of fast high perfor­ mance SRAMs mounted on a low profile, 64 pin ZIP Board. The module utilizes four 28 pin 64K x 4 SRAMs in 300 mil SOJ packages

AK62464Z

Contextual Info: AK62464Z 65,536 x 24 Bit CMOS/BiCMOS Static Random Access Memory ACCUTEK MICROCIRCUIT CORPORATION 64-Pin ZIP DESCRIPTION Front View The Accutek AK62464 SRAM Module consists of fast high performance SRAMs mounted on a low profile, 64 pin ZIP Board. The module utilizes six 28 pin 64K x 4 SRAMs in 300 mil SOJ packages

Contextual Info: S ockets HIGH DENSITY ZIP Sockets ICZ Series * Zig-zag pattern allows higher board density than standard DIP sockets * Low profile allows tighter board-to-board spacing * Precision screw machine sockets provide high reliability and retention * Designed specifically for DRAM memory

Contextual Info: HIGH DENSITY ZIP Sockets ICZ Series * Zig-zag pattern allows higher board density than standard DIP sockets 9 Low profile allows tighter board-to-board spacing 9 Precision screw machine sockets provide high reliability and retention 9 Designed specifically for DRAM memory

DRAMs

Abstract: MSM5416258A MSM5432126 MSM54V32126 oki Package SOJ msm51v17405b MSM54 TSOP300 msm514260c
Contextual Info: OKI Semiconductor DRAMs 1-Meg DRAMs 5 V Part Number Description Organization Pins / Package Access Time Max (ns) MSM511664B-xx Fast page 64K x 16 40 / DIP 70, 80 MSM514256C-xx Fast page 256K x 4 60, 70, 80 MSM514256CL-xx Fast page, low-power 20 / DIP, ZIP

MARK W1 TSOP

Abstract: weight of SOP 16 package MSM548332 weight of SOP package
Contextual Info: O K I Semiconductor Packaging Multiport DRAM Products Packaging OKU Semiconductor Packaging Field Memory Products Package Name MSM514212 No. of Pins zs GS TS TS JS DIP ZIP SOP TSOP Typen TQFP SOJ O 28 r '\ 16 MSM514221B RS r o 20 O 26/20 o 16 MSM514222B o

AK631024

Abstract: AK6321024W AK6321024Z A1658
Contextual Info: DESCRIPTION Accutek Microcircuit Corporation AK6321024W / AK6321024Z 1,048,576 x 32 Bit CMOS/BiCMOS Static Random Access Memory Front View The Accutek AK631024 SRAM Module consists of fast high performance SRAMs mounted on a low profile, 72 pin SIM or ZIP PCB.

AK63232

Abstract: AK63264 AK631024 AK6321024W AK6321024Z
Contextual Info: DESCRIPTION Accutek Microcircuit Corporation AK6321024W / AK6321024Z 1,048,576 x 32 Bit CMOS/BiCMOS Static Random Access Memory Front View The Accutek AK631024 SRAM Module consists of fast high performance SRAMs mounted on a low profile, 72 pin SIM or ZIP PCB.

AK6321024W

Abstract: AK6321024Z
Contextual Info: AK6321024W / AK6321024Z 1,048,576 x 32 Bit CMOS/BiCMOS Static Random Access Memory ACCUTEK MICROCIRCUIT CORPORATION DESCRIPTION Front View The Accutek AK631024 SRAM Module consists of fast high performance SRAMs mounted on a low profile, 72 pin SIM or ZIP PCB.

AK631024

Abstract: AK6321024W AK6321024Z AK63232 AK63264 A1757
Contextual Info: DESCRIPTION Accutek Microcircuit Corporation AK6321024W / AK6321024Z 1,048,576 x 32 Bit CMOS/BiCMOS Static Random Access Memory Front View The Accutek AK631024 SRAM Module consists of fast high performance SRAMs mounted on a low profile, 72 pin SIM or ZIP PCB.

Contextual Info: Number Guide SIEM ENS Memory Components Memory Components 1 M & 4 M DRAMS HYB 51 xxxx B J L - 60 ! ¡ ¡ Speed 50 60 70 80 = = = = Power L = low power = standard Package J Z T 50 60 70 80 ns ns ns ns = DIP =SOJ = ZIP = TSOP Design Revision Sem iconductor Group