csp defects
Abstract: handling damage LGA socket MANUAL PCB Samsung MCP 1mm pitch BGA socket air handling unit CRACK pcb substrate HCFC141B
Contextual Info: USER’S MANUAL Chip Scale Package • To make a win-win situation for CSP products supplier and customer, Samsung provides the information of CSP package’s characteristics and manuals to maintain high quality so that the problems of customer process can be minimized or prevented
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150um20milsx20milcsp defects+9handling damagelga socketmanual pcbsamsung mcp1mm pitch bga socketair handling unitcrackpcb substratehcfc141b
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