X-GOLD 613 Search Results

infineon x-gold

Abstract: MIPI csi-2 x-gold eMMC X-GOLD613 MIPI CSI-2 Parallel MIPI csi ARM11 infineon gold arm1176 lpddr1
Contextual Info: Product Brief X-GOLD 613 TM 3G Low-Cost Solution for Mobile Internet Browsing & Messaging Main Features The Infineon X-GOLD 613 is a cellular System-on-Chip comprising of 2G/3G digital and analog baseband plus power management functionality, all monolithically integrated in 65nm CMOS technology. It is Infineon’s 3rd

Brass QQ-B-626

Abstract: 11C2 919-102P-51AX MIL-P-19468 QQ-B-613 qq-b-626
Contextual Info: 9 1 9 - 1 0 2P -5 1A X NDTESi REVISIONS DRAWING NO. 1. 2. 3. MATERIALS OF CONSTRUCTI ON: HDUSING = BRASS Q Q -B -6 2 6 , GOLD PLATED. BODY = BERYLLIUM COPPER, GUILD PLATED. CONTACT P IN = BRASS (Q Q -B -6 2 6 ), GOLD PLATED. COVER = BRASS <Q Q -B -613>, GOLD PLATED.

Contextual Info: Tin IDM ^ -C = 10m" 0,25pm Gold IDS (-T End Assembly Required) A -S T “ X” - S “ XX” : Stripped & Tinned : Daisy Chain Single Specify Suffix from table. All dimensions are ± 1/16". Not available in 28 positions and higher. “XX” ± 10p" (0,25pm) Gold IDM

Transistor S 40443

Contextual Info: bbS3T31 0024T37 flOO « A P X Philips Semiconductors NPN 7 GHz wideband transistor £ BFG197; BFG197/X; BFG197/XR AMER PHILIPS/ DIS CRETE FEATURES Product specification b?E D PINNING PIN • High power gain • Low noise figure • Gold metallization ensures

Contextual Info: r 1 I P R O D U C T N U M BER 2 9 3 9 2 2 -X 1 Y 8 3 .9 5 REF. i % Id sL a y PLATING IN CONTACT AREA THICKNESS PLATING CODE -1 Y Y 0 .8 um GOLD 2 .0 um GOLD —2YY —3YY 1.3 um GXT -9 Y Y 0 .8 um GXT UNDERPLATING 1.3 um Ni MIN. 2 .0 um Ni MIN. 2 .0 um Ni MIN.

11C2

Abstract: 20C5 QQ-B-613 30C7 07c17 39C10
Contextual Info: 9 1 9 - 1 0 4 P - 5 1 Al X NOTES; 2. 3. DRAWING NO. THIRD ANGLE PROJ. MATERIALS OF CONSTRUCTI DNi HOUSING = BRASS <Q Q -B-626>, NICKEL PLATED, BODY = BERYLLIUM COPPER, NICKEL PLATED. CONTACT P IN = BRASS Q Q -B -6 2 6 , GOLD PLATED. COVER = BRASS CQ Q -B-613 ), NICKEL PLATED.

31-5136-RFX

Abstract: QQ-B-613 RG-62
Contextual Info: 3 1 -5 1 3 6 -R F X NOTES- REVISIONS REV DRAWING NO. 1. MATERIALS OF CONSTRUCTION: SHELL, HEX BIDDY, RETAINER RING = BRASS Q Q -B -6 26 , NICKEL PLATED C.000100 MIN) INSULATDRS (2 ) = DELRIN, COLOR NATURAL CONTACT PIN = BRASS (Q Q -B -6 2 6 ), GOLD PLATED (.000003 MIN)

Contextual Info: TM E X T E N D E D L IF E P R O D U C T 0,50mm .01969 ' Mixed Rowing Gas with 50p* Gold Call Samtec fo r maximum cycles BTH SERIES BASIC BLADE & BEAM HEADER SPECIFICATIONS For complete specifications and recommended PCB layouts see www.samtec.com?BTH Insulator Material

Transistor S 40443

Abstract: C 5478 transistor msc 0645 MSC 1691 AI MSC 1691 Philips FA 291 msc 1699 msc 1697 MCD156 0280 130 085
Contextual Info: ^53^31 Philips Semiconductors IAPX 0024=137 Û00 NPN 7 GHz wideband transistor ^ BFG197; BFG197/X; BFG197/XR N AMER P H I L I P S / D I S C R E T E FEATURES • Product specification b?E D PINNING High power gain PIN • Low noise figure • Gold metallization ensures

Contextual Info: iamteo B T S -07 5 -0 1 -L -D -A E X T E N D E D L IF E P R O D U C T 0,635mm .025" C l 10 year Mixed Flowing Gas with 50p’ Gold Call Samtec for maximum cycles BTS, BSS SERIES BASIC BLADE & BEAM HEADER & SOCKET SPECIFICATIONS For complete specifications and

Contextual Info: Cl E X T E N D E D L IF E P R O D U C T 0,80mm .0315" BTE, BSE SERIES B T E -0 6 0 -0 2 -F -D -A 10 year Mixed Flov/ing Gas with 50p* Gold Call Sam tec for m axim um cycles i _ BASIC BLADE & BEAM HEADER & SOCKET SPECIFICATIONS For complete specifications and

Contextual Info: Technical Specifications ELCO Technical Data B asic grid 100 2 54 x 100(2,54) In s e rtio n Force Series 8251 8352 8275 8281 8381 1-6 oz per contact W ith d ra w a l force 75 oz mm. per contact C o n ta c t re s is ta n c e 12 millohms max for gold plating

IR 9512

Contextual Info: S L M -1 1 0 -0 1 -G -S S M S -12 0 -0 1 - S - S f T h ro u g h X JF 1,27mm) .050" SOCKET Insulator Material Black Glass Filled Polyester Contact Material: Phosphor Bronze Current Rating: 1A Operating Temp Range: -55°C to +125°C with Gold -55°C to +105°C with Tin

Contextual Info: TM M -110-01-T-D-SM T M M -112-01-G -S -S M E X T E N D E D LIFE P R O D U C T 2,00mm .0787" 10 year Mixed Flowing Gas with 30p’ Gold 1.000 cycles v/hen mated with SMM T M M SERIES LOW PROFILE SMT HEADER SPECIFICATIONS For complete specifications and recommended PCB layouts

Marking W36

Contextual Info: _ PRODUCT il_zi_ 3_L NO. 61372-* 6 3 .0 0 3 1 .5 0 1.00 I II °s H LEFT PEG L /S E E RIGHT PEG MARKING NOTE 4 / •" SEE TABLE a oJ |f l l h * § 3 if lia; l l i l 7 2 .9 REF. LATCH OPENING iti! 6 7 .9 Ji! fi !

Contextual Info: DRAWING No.:—M 2 2 -6 1 3 X X X X SHEET 2 OF 2 IF IN DOUBT - ASK NOT TO S C A L E THIRD ANGLE PROJECTION A L L DIMENSIONS IN mm -2,00 x No, OF WAYS PER ROW MAX. -2.00 x No. OF PITCHES PER ROW- ORDER CQDEi M22-613 NUMBER OF WAYS 03 TO 25 PLATING FIN ISH -06 = TIN /LEAD

BS3G210

Abstract: T5747
Contextual Info: Customer Information Shee DRAWING No.: M80-613XXXX SHEET 2 OF 2 I IF IN DOUBT - ASK j ç \ j NOT TO SCALE ALL DIMENSIONS IN mm THIRD ANGLE PROJECTION SPECIFICATION S: MATERIAL; MOULDING - HIGH TEMPERATURE POLYAMIDE 46, UL94V-0, BLACK CLIP = BERYLLIUM COPPER

C26000

Abstract: 56-LL
Contextual Info: PART NO. ENG. NO. 02-06-2131 1 8 5 4 - 0 0 1 02-06-2132 1854 — 9 0 l)L 02-06-2134 1 8 5 4 - 0 0 1)1 02-06-6137 18 54 - (5 9 1) 02-06-6136 1854-159 l)L 02-06-6138 18 5 4 - ( 5 6 1) 02-06-6139 l 8 5 4 - ( 5 6 l)L 02-06-6130 l854-(550) 02-06-6135 I854-(550)L

Contextual Info: REVISIONS NOTES: 1. 2. 3. FINISH PLATING THICKNESS IN MICRO-INICHES BRASS PER Q Q -B-626 BRASS PER Q Q -B-613 GOLD PL, 3 MIN. THICK OVER NICKEL PL. 100 MIN, THICK OVER COPPER STRIKE 4. BERYLLIUM COPPER PER QQ-C-530 5. GOLD PL. 00 MIN. THICK OVER NICKEL PL. 100 MIN. THICK

Contextual Info: REVISIONS ISS ZONE d e s c r ip t io n Xpep p e q u e s t / date RECOMMENDED MOUNTING HOLE NOTES: FINISH PLATING THICKN ESS 1 . MAX. PANEL THICKN ESS = 2.4m m IN M IC RO - IN C H ES 1. BRASS PER Q Q -B -626 2. BRASS PER Q Q -B -613 3 CONTACT PIN NOTE 1

Contextual Info: K » E eng 10 7 1 5 9 2 - 7 2 ¿ 2 M « FILE COP* 2950-6135 NOTES: 1. MATING: Interface Dimensions per Mil-C-39012/SMA Series and Solitron/Microwave MD-107. 2. MATERIALS: Body: Stainless Steel per QQ-S-764, Type 303, Cond. . Contact: Beryllium Copper per QQ-C-530, Cond.'

Ultem1000

Contextual Info: DESCRIPTION BY APPD DATE C REVISED PER ER042797 CY REV TZ 07/06/12 NOTES: UNLESS OTHERWISE SPECIFIED 1. MATERIAL SPECIFICATIONS: BODY: BRASS PER ASTM B16 CONTACT: BERYLLIUM COPPER PER ASTM B196 INSULATOR: TEFLON PER ASTM D1710 CE INSULATOR: ULTEM1000 OR LCP PER ZENITE 6130L X BK010

Contextual Info: K A C IO 7 1 9 5 2 - 7 2 2 2950-6136 EMÙ FILE C U ' . "OTES: 1. MATING: Interface Dimensions per Mil-C-39012/SMA Series and Solitron/Microwave MD-107. 2. MATERIALS: Body: Stainless Steel per QQ-S-764, Type 303, C o nd.A. Contact: Beryllium Copper per QQ-C-530y Cond.ti.

Ultem1000

Abstract: ultem1000 parts
Contextual Info: BY APPD DATE REVISED PER ER042797 CY B DESCRIPTION TZ 07/06/12 REV NOTES: UNLESS OTHERWISE SPECIFIED 1. MATERIAL SPECIFICATIONS: BODY, NUT, BKHD BUSHING: BRASS PER ASTM B16 CONTACT: BERYLLIUM COPPER PER ASTM B196 INSULATOR: TEFLON PER ASTM D1710 CE INSULATOR: ULTEM1000 OR LCP ZENITE 6130L X BK010