X 289 Search Results

Contextual Info: Zero Insertion Force PGA Test and Burn-in Sockets cont. * * * * * Grid Size 12 x 12 13 x 13 14 x 14 15 x 15 16 x 16 17 x 17 18 x 18 19 x 19 20 x 20 21 x 21 No. of Pins 144 169 196 225 256 289 324 361 400 441 Dim. “C” 1.100 [27.94] 1.200 [30.48] 1.300 [33.02]

PLM 54

Contextual Info: Zero Insertion Force PGA Test and Burn-in Sockets cont. * * * * * Grid Size 12 x 12 13 x 13 14 x 14 15 x 15 16 x 16 17 x 17 18 x 18 19 x 19 20 x 20 21 x 21 No. of Pins 144 169 196 225 256 289 324 361 400 441 Dim. “C” 1.100 [27.94] 1.200 [30.48] 1.300 [33.02]

Contextual Info: Zero Insertion Force PGA Test and Burn-in Sockets cont. * * * * * Grid Size 12 x 12 13 x 13 14 x 14 15 x 15 16 x 16 17 x 17 18 x 18 19 x 19 20 x 20 21 x 21 No. of Pins 144 169 196 225 256 289 324 361 400 441 Dim. “C ” 1.100 [27.94] 1.200 [30.48] 1.300 [33.02]

Contextual Info: Zero Insertion Force PGA Test and Burn-in Sockets cont. * * * * * Grid Size 12 x 12 13 x 13 14 x 14 15 x 15 16 x 16 17 x 17 18 x 18 19 x 19 20 x 20 21 x 21 No. of Pins 144 169 196 225 256 289 324 361 400 441 Dim. “C” 1.100 [27.94] 1.200 [30.48] 1.300 [33.02]

Contextual Info: Zero Insertion Force PGA Test and Burn-in Sockets cont. * * * * * Grid Size 12 x 12 13 x 13 14 x 14 15 x 15 16 x 16 17 x 17 18 x 18 19 x 19 20 x 20 21 x 21 No. of Pins 144 169 196 225 256 289 324 361 400 441 Dim. “C ” 1.100 [27.94] 1.200 [30.48] 1.300 [33.02]

footprint 8M1-A

Contextual Info: Zero Insertion Force PGA Test and Burn-in Sockets cont. Grid Size No. of Pins Dim. “C” 12 x 12* 144 1.100 [27.94] 13 x 13 169 1.200 [30.48] 14 x 14* 196 1.300 [33.02] 15 x 15 225 1.400 [35.56] 16 x 16* 256 1.500 [38.10] 17 x 17 289 1.600 [40.64] 18 x 18*

Contextual Info: 10-244 insert availability, identification, alternate positions G rom m et Insert Total Arrange­ C ontacts m ent C on tact Size Insert Pin Socket 4 1 X 8S-1 1 X 10S-2 X X 3 10SL-3 2 X X 10SL-4 X 2 X 12S-3 X X 4 14S-2 X X 5 14S-5 X 6 X 14S-6 X X 14S-7 3 2

7544-1

Contextual Info: 2 1 REVISION HISTORY AUTH - REV A DATE 1/18/2008 DESCRIPTION INITIAL RELEASE B B X-SMALL MOUNT SMALL MOUNT APPLICATIONS: APPLICATIONS: 650-440-X 430-440-X 340-440-X 340-441-X 284-440-X 284-441-X 229-440-X 229-441-X 187-440-X 187-441-X 187-442-X 159-440-X 159-441-X

MT9V111I99STC

Abstract: MT9P031I12STC MT9P031 iLCC 48 MT9V022IA7ATM MT9V032 MT9D131 MT9P401 MT9P401I12STC 48-ILCC
Contextual Info: CMOS Image Sensors Specifications KAC-9618 KAC-9619 KAC-9628 KAC-9647 Array Format Total H x V Active 664 x 504 648 x 488 664 x 504 648 x 488 664 x 504 648 x 488 672 x 488 648 x 488 Effective Image Area Total (H x V in mm) Total 4.98 x 3.78 4.86 x 3.66 4.98 x 3.78

eb 102H

Abstract: AT89 0345H
Contextual Info: Microcontroller Instruction Set For interrupt response time information, refer to the hardware description chapter. Instructions that Affect Flag Settings 1 Instruction Flag Instruction Flag C OV AC ADD X X X CLR C O ADDC X X X CPL C X SUBB X X X ANL C,bit

MVAX-XXX-XXXX-13X

Abstract: 4318J 112X16 X13B
Contextual Info: REV. |AC TABLE 1 B O D Y S PE CI FI CAT IO N SEE SHEET 4 THRU 7 FOR FIG. ( * : CUT TO "A” DIM IN BODY DETAIL) P A R T NU MB ER M H A X -X X X -X X X X - 0 8 MHAX—XXX—XXXX—09 MHAX—XXX—XXXX—10 M HAX-XXX-XXXX-11X MHA X-X XX- XXX X- 12X MHA X-X XX- XXX X- 13X

Contextual Info: SOLUTIONS Data Sheet PW Height Above PC Board in. mm 289-AB 289-AP 290-1 AB 290-2AB 0.500 (12.7) 0.500 (12.7) 0.500 (12.7) 0.500 (12.7) Standard Horizontal Mounting Maximum Footing in. (mm) 1.000 (25.4) x 0.710 1.000 (25.4) x 0.710 1.000 (25.4) x 1.180 1.000 (25.4) x 1.180

LPDDR2-1066

Abstract: micron lpddr2 lpddr2 DQ calibration LPDDR2 SDRAM micron MT42L128M64D4 lpddr2 MT42L64M64D2 micron LPDDR2 X32 LPDDR2 SDRAM mt42L128M64D
Contextual Info: 2Gb: x32 Mobile LPDDR2 SDRAM S4 Features Mobile LPDDR2 SDRAM MT42L64M64D2, MT42L128M64D4, MT42L96M64D3 Features Options Marking • VDD2: 1.2V • Configuration – 8 Meg x 32 x 8 banks x 2 die – 8 Meg x 32 x 8 banks x 3 die – 8 Meg x 32 x 8 banks x 4 die

Thomas & Betts 609-BX440-2

Abstract: 609-BX446 thomas betts 609 742J2 TRT16
Contextual Info: ThomasêBetts Electronics Division Full Line Catalog NUMERICAL INDEX CATALOG • 1 0 0 4 x x C - 0 x . 331 173-xx . 102 221-XX-XX8 .248 1 0 0 5 x x F - 0 x . 331 174-x x . 108 222-9xxx3-x058 . . . . 2 4 7

intel 8051 INSTRUCTION SET

Abstract: 8051 instruction set instruction set of 8051 AT89 R67D
Contextual Info: Instruction Set Microcontroller Instruction Set For interrupt response time information, refer to the hardware description chapter. 1 Instructions that Affect Flag Settings Instruction Flag Instruction Flag C OV AC ADD X X X CLR C O ADDC X X X CPL C X SUBB

MT42L32M32D2

Abstract: micron lpddr2 LPDDR2 SDRAM LPDDR2 SDRAM micron MT42L32M32
Contextual Info: Preliminary‡ 512Mb Automotive Mobile LPDDR2 SDRAM Features Automotive Mobile LPDDR2 SDRAM MT42L32M16D1, MT42L32M32D2, MT42L16M32D1 Features Options Marking • VDD2: 1.2V • Configuration – 4 Meg x 32 x 4 banks – 8 Meg x 16 x 4 banks – 2 x 8 Meg x 16 x 4 banks

Contextual Info: 512Mb Automotive Mobile LPDDR2 SDRAM Features Automotive Mobile LPDDR2 SDRAM MT42L32M16D1, MT42L32M32D2, MT42L16M32D1 Features Options • VDD2: 1.2V • Configuration – 4 Meg x 32 x 4 banks – 8 Meg x 16 x 4 banks – 2 x 8 Meg x 16 x 4 banks • Device type

Contextual Info: 512Mb Automotive Mobile LPDDR2 SDRAM Features Automotive Mobile LPDDR2 SDRAM MT42L32M16D1, MT42L32M32D2, MT42L16M32D1 Features Options • VDD2: 1.2V • Configuration – 4 Meg x 32 x 4 banks – 8 Meg x 16 x 4 banks – 2 x 8 Meg x 16 x 4 banks • Device type

Contextual Info: Datasheet | Switches X900-48 Enhanced Fast Ethernet Layer 3+ Switch x900-48FE 48 x 10/100BASE-T copper ports 4 x 1000BASE-X SFP uplinks x900-48FS 48 x 100BASE-X SFP ports Fiber only 4 x 1000BASE-X SFP uplinks Industry-leading Features The x900-48 offers performance, flexibility,

32Kx16

Abstract: Intel EEPROM 32kx8
Contextual Info: Alliance Semiconductor Memories SRAM 64K - 3 . 3 Volt All densities in bits 512K 1M 256K 32Kx8 A sy n ch ro no u s/ burst •5 Volt X 8Kx8 X 64KX8 1 32KX16 128KX8 X 32KX8 64KX8 X 32Kx9 i 32KX16 2M 4M 64KX32 512KX8 64KX16 X 32KX32 256KX16 X 128Kx8 X 256KX4

Contextual Info: Entstörkondensatoren EMI Suppression Capacitors •*l LS t Y2-Kondensatoren/Y2 capacitors B81122 10 1,0 nF 4,0 X 9 ,0x13,0 t 5 nF 40% y 0 > 13 0 2,2 nF 5 ,0 x 11,Ox 13,0 nF 4,7 nF 6,0 X 12,0 X 13,0 i - ö x t s o x 3 0 6,8 nF 6,0 X 12,0 X 13,0 15 10 nF *5x110x160

Contextual Info: M2F1G64CBH4B5P/ M2F1G64CBH4B9P M2F X 2G64CB88B7N / M2F(X)2G64CB88BHN M2F(X)4G64CB8HB5N / M2F(X)4G64CB8HB9N 1GB: 128M x 64 / 2GB: 256M x 64 / 4GB: 512M x 64 PC3-8500 / PC3-10600 / PC3-12800 Unbuffered DDR3 SDRAM DIMM Based on DDR3-1066/1333 128Mx16 (1GB) and DDR3-1066/1333/1600 256Mx8 (2GB/4GB) SDRAM B-Die

Contextual Info: B 2 0.191 04.9 f A LL DIMENSIONS ARE GIVEN INCHES B .289 7.3 i A .037 7.3 Fiber O ptics Division Downers Grove, Illinois RESTRICTED RELEASE DRAWING MAY CHANGE WITHOUT CUSTOMER NOTIFICATION _ ï TITLE: Drawing No. SC FIBER CHANNEL DUPLEX CONNECTOR 860 34-X X X 0 CD

Contextual Info: 5 X K o n t a k t a n o r d n u n g / contact arrangement 15 Kontakte 15 contacts 32 28 24 20 16 12 8 4 I 30 | 26 | 22 | 18 | U | 10 | 6 | IX I IX I X I X X I X X IX I ^1IX 13^ X 13^1 X I 13 X L ochbi I d / board drillings 32 I 7x 10,16 4 4 — d I (=71,12)