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CCD143A

Contextual Info: Linear Image Sensor Selection Guide CCD Device Maximum Number Pixel Size Pixel Pitch Data Rate of Pixels pm (MHz) 0*m) CCD111 256 13 x 17 13 10.0 CCD112- 256 13 x 17 13 10.0 CCD153A 512 13 x 13 13 20.0 CCD133A 1024 13 x 13 13 20.0 CCD134 1024 13 x 13 13

Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 5, 06/2013 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch

Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 6, 08/2013 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch

Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 3, 11/2012 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch

Samsung eMMC 4.51

Abstract: samsung eMMC 4.5
Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 2, 05/2012 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch

samsung eMMC 4.5

Abstract: Samsung eMMC 4.41 lpddr2 emmc emmc 4.41 spec emmc 4.5 spec 153 ball eMMC memory Samsung eMMC 4.51 samsung* lpddr2* pop package emmc Pin assignment eMMC 4.4
Contextual Info: Freescale Semiconductor Data Sheet: Advanced Information Document Number: IMX50CEC Rev. 2, 04/2012 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch

samsung eMMC 4.5

Abstract: emmc 4.4 standard jedec Samsung eMMC 4.41 153 ball eMMC memory emmc 4.5 spec emmc spec emmc 4.41 spec 50 50 mfd CAPACITOR USB_OTG Samsung eMMC 4.51
Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 4, 1/2013 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch

spec RG-179

Abstract: spec RG-178 59 8483 042
Contextual Info: Style M Connectors Board Layouts STYLE 1/2 M 48.3 1.902 7.62 (0.300) 13 x 2.54 = 33.02 (13 x 0.100 = 1.300) 7.62 (0.300) 7.62 (0.300) 12 x ø1.00 (12 x ø0.039) 2.54 (0.100) 2 x ø2.80 (2 x ø0.110) c 5.08 (0.200) b a 5.30 (0.209) 16 15 14 13 12 11 10 9 8

20 8484 024 001 025

Contextual Info: Style M Connectors Board Layouts STYLE 1/2 M 48.3 1.902 7.62 (0.300) 13 x 2.54 = 33.02 (13 x 0.100 = 1.300) 7.62 (0.300) 7.62 (0.300) 12 x ø1.00 (12 x ø0.039) 2.54 (0.100) 2 x ø2.80 (2 x ø0.110) c 5.08 (0.200) b a 5.30 (0.209) 16 15 14 13 12 11 10 9 8

Fuse 250V 2A G20

Abstract: weidmuller fuse 1.6A fuse 5AF10
Contextual Info: Fuse terminals 10 mm2 KSKM 1 10 mm2 KSKM 2 5 x 20 1 x 1/4 13 x 69 x 63 6.3 / 16 0.33 . 16 13 x 69 x 63 13 / 16 0.33 . 16 TS 32 / PA TS 32 / PA When using ATEX certified components in hazardous area applications the installation instructions and the rated data for

BXY10

Abstract: BXY13D BXY10C Z6 DIODE BXY13 BXY11 BXY10D BXY11E BXY13C DIODE G06
Contextual Info: B X Y 10 C, 10 D, 11 E, 13 C, 13 D, 14 E Charge storage varactors for frequency multiplication Epitaxial silicon mesa diodes in a ceramic microwave case T yp e B X Y 10 C BXY10D BXY11E BXY13C B X Y 13 D B X Y 14 E T h e rm a l r e s is t a n c e Junction to case

Contextual Info: IBM0325404 IBM0325804 IBM0325164 IBM03254B4 256Mb Synchronous DRAM - Die Revision A APPLICATION SPEC # 29L0000.E36980 Engineering Change Number 13 ROW /1 1 COL / 2 BS 16Mb x 4 I/O x 4 Bank 13 ROW /1 0 COL / 2 BS (8Mb x 8 I/O x 4 Bank) Date E36980 13 ROW / 9 COL / 2 BS (4Mb x 16 I/O x 4 Bank)

Contextual Info: 2.54 A Male headers soldering technique  0,635 mm, Sandwich B 2,54 3,3 2,8 L S = 6 mm C A 2,8 n x 2,54 2,5 11 S n - 1 x 2,54 0,635 art. no. D 13 13 13 13 13 071 097 122 147 187 . . . . . A 7.10 9.70 12.20 14.70 18.70 art. no. L 21.40 24.00 26.50

RDJ11

Abstract: FU633 of blown fuse indicator BJS131 FEM13U TH91 56102 PR30 0168 013.10
Contextual Info: T01089 020128 MU 10/13.SF2 Fuse holder terminal blocks for 6,35 x 25,4 mm 1/4 x 1 in. and 6,35 x 32 mm 1/4 x 1 1/4 in. fuses Compression clamp MU 10/14,5.SF2 Spacing 13 mm .512" Spacing 14,5 mm (.571") 13 mm block for blown fuse indicator (to be ordered separately).

MC1495L

Contextual Info: MC1495L IL00D FOUR-QUADRANT MULTIPLIER —TOP VIEW— RY RX 1 VCC OUT + 2 SCALE Y 3 Y IN (+) 4 VDD 14 OUT (_) 13 SCALE X 12 X IN (_) 9 12 10 RY 11 5 6 4 X IN (+) (+) Y IN (_) SCALE Y SCALE X 3 13 VEE 7 V_ 6 9 X IN (+) 7 VEE 8 Y IN (_) RL VCC (+) (_) 1 OUT

SFERNICE RW

Abstract: SFERNICE RW 16 sfernice RB
Contextual Info: Data sheet E 3/1.582 - 10497 RW fixed wirewound high power vitreous resistors – with terminal collars or bands 1-40 10 W to 80 W at 25°C NF C 93-214 RB 13 x 70 RB 20 x 117 SPECIAL FEATURES Table 2 RW STYLE 8 x 34 DESIGNATION NF C 93-214 10 x 50 13 x 70

Contextual Info: 4bûb2Eb DDD1375 flTH « I X Y O 6 Rectifier Bridges, 1~ il ! — w i - -wN — -N - Rectifier Bridges, 1 ~ with DCB-Ceram ic Base V RRM Type K E 72 873 (M) ► New VBO 13-16N02 • VBO 13-14N 02 VBO 13-12N02 VBO 13-08N02 VBO 13-16A 02 • VBO 13-14A 02

ML12040

Abstract: ML4044
Contextual Info: LANSDALE 12040 ML PHASE FREQUENCY DETECTOR P in C o n v e r s io n T a b te 14 PIN DIP 1 2 3 4 5 6 7 8 9 10 11 12 13 14 20 PIN P L C C 2 3 4 6 8 9 10 12 13 14 16 18 19 20 Outputs Inputs R V U D 1 1 1 1 X X X X X X X X X X X X X X X X 1 1 1 1 1 1 1 1 1 1 1

Contextual Info: 1575.42MHZ/1598~1606MHz, 13 x 13 x 4mm GPS+GLONASS Patch Antenna RoHS/RoHS II Compliant APAE1590R1340AKDB2-T MSL level: Not Applicable 13.0 x 13.0 x 4.0mm | | | | | | | | | | | | | | | FEATURES: • High Gain • Compact Size and Low Profile • Pin type • RoHS Compliance

Contextual Info: Automotive and Industrial Grade Ultra Miniature SMD VC/TCXO ASVTXAIG-13/ASTXAIG-13 series Pb RoHS/RoHS II Compliant 2.0 x 1.6 x 0.8mm | | | | | | | | | | | | | | | Moisture Sensitivity Level MSL – This product is Hermetically Sealed and not Moisture Sensitive - MSL = N/A: Not Applicable

VC-TCXO 19.2mhz

Contextual Info: ULTRA MINIATURE SMD VC/TCXO ASVTX-13/ASTX-13 Moisture Sensitivity Level MSL –1 FEATURES: • Industry smallest 2.0 x 1.6 x 0.8mm • Low current consumption 1.5mA at 26MHz • Vc function ideal for PLL application • Suitable for RoHS complaint reflow

VC-TCXO 19.2mhz

Contextual Info: ULTRA MINIATURE SMD VC/TCXO ASVTX-13/ASTX-13 Moisture Sensitivity Level MSL –1 FEATURES: • Industry smallest 2.0 x 1.6 x 0.8mm • Low current consumption 1.5mA at 26MHz • Vc function ideal for PLL application • Suitable for RoHS complaint reflow

D406

Contextual Info: Features - - W D - - - -L - - - - • Basic Protektive Pak tray • Great container for Kanban Item No. Size I.D. - L x W x D 37650 17-3/4 x 10-3/4 x 2-1/8 37651 17-7/8 x 13-5/8 x 2-1/8 37653 19-1/4 x 13-1/8 x 2-1/8

EP-7 N30

Abstract: B65844C1010D2 B65844A2000
Contextual Info: EP Cores Example of an assembly set Mounting dimensions of the assembly set mm Core type Length x width x h e ig h t11 Special features EP 7 7,5 x 10 x 10 1 2 ,8 x 9 ,2 x 8,5 SMD EP 1C 12,0 x 14,2 x 12,5 EP 13 15,0 x 16 x 13.7 19,5 x 13 x 12.5 EP 17 20,0 x 21.6 x 16,2