WS1M32 Search Results

WS1M32V-XG3X

Contextual Info: White Electronic Designs WS1M32V-XG3X PRELIMINARY* 1Mx32 SRAM 3.3V MODULE FEATURES Access Times of 17, 20, 25ns 3.3V Power Supply 84 lead, 28mm CQFP, Package 511 Low Power CMOS Organized as two banks of 512Kx32, User Configurable as 2Mx16 or 4Mx8 Built-in Decoupling Caps and Multiple Ground Pins

Contextual Info: WS1M32V-XG3X PRELIMINARY* 1Mx32 SRAM 3.3V MODULE FEATURES  Access Times of 17, 20, 25ns  3.3V Power Supply  84 lead, 28mm CQFP, Package 511  Low Power CMOS  Organized as two banks of 512Kx32, User Configurable as 2Mx16 or 4Mx8

WS1M32-XG3X

Contextual Info: WS1M32-XG3X 1Mx32 SRAM MODULE FEATURES • Access Times of 17, 20, 25ns ■ Low Power CMOS ■ 84 lead, 28mm CQFP, Package 511 ■ Built-in Decoupling Caps and Multiple Ground Pins for Low Noise Operation ■ Organized as two banks of 512Kx32, User Configurable as

Contextual Info: a WS1M32-XG3X WHITE /MICROELECTRONICS 1Mx32 SRAM MODULE FEATURES • A c c e s s T im e s of 17, 20, 25ns Low Pow er CM OS ■ 84 lead, 28mm CQFP, Packag e 511 Built-in Decoupling Caps and M u ltip le Ground Pins fo r Low Noise Operation ■ Organized as tw o banks of 5 1 2K x3 2 , U ser C o nfig urable as

WS1M32V-XG3X

Contextual Info: White Electronic Designs WS1M32V-XG3X PRELIMINARY* 1Mx32 SRAM 3.3V MODULE FEATURES Access Times of 17, 20, 25ns 3.3V Power Supply 84 lead, 28mm CQFP, Package 511 Low Power CMOS Organized as two banks of 512Kx32, User Configurable as 2Mx16 or 4Mx8 Built-in Decoupling Caps and Multiple Ground Pins

Contextual Info: WS1M32V-XG3X Hi-REUÄBiUTY PRODUCT 1Mx32 SRAM 3.3V MODULE ADVANCED* FEATURES • Access Tim es of 17, 20, 25ns Low Power CMOS ■ 84 lead, 28mm CQFP, Package 511 B uilt-in Decoupling Caps and M ultiple G round Pins for Low Noise O peration ■ O rganized as two banks of 512Kx32, User C onfigurable as

Contextual Info: a WS1M32-XG3X WHITE /MICROELECTRONICS 1Mx32 SRAM MODULE PRELIMINARY * FEATURES • A c c e s s Tim e of 70, 85, 100, 120ns T T L Com patible Inputs and Outputs ■ 84 lead, 28mm CQFP, Packag e 511 5 V o lt P ow er Supply ■ Organized as tw o banks of 5 1 2K x3 2 , U ser C o nfig urable as

Contextual Info: WS1M32V-XG3X HI-RELIABILITY PRODUCT 1Mx32 SRAM 3.3V MODULE ADVANCED* FEATURES • Access Times of 17, 20, 25ns ■ Low Power CMOS ■ 84 lead, 28mm CQFP, Package 511 ■ Built-in Decoupling Caps and Multiple Ground Pins for Low Noise Operation ■ Organized as two banks of 512Kx32, User Configurable as

WS1M32-XH2X

Contextual Info: White Electronic Designs WS1M32-XH2X 1Mx32 SRAM MODULE FEATURES  Access Times of 20, 25ns  5V Power Supply  Packaging  Low Power CMOS • 66 pin PGA Type, 1.385" sq., Hermetic Ceramic HIP Package 402 *  Built-in Decoupling Caps and Multiple Ground Pins

WS1M32V-XG3X

Contextual Info: WS1M32V-XG3X White Electronic Designs PRELIMINARY* 1Mx32 SRAM 3.3V MODULE FEATURES Access Times of 17, 20, 25ns 3.3V Power Supply 84 lead, 28mm CQFP, Package 511 Low Power CMOS Organized as two banks of 512Kx32, User Configurable as 2Mx16 or 4Mx8 Built-in Decoupling Caps and Multiple Ground Pins

Contextual Info: White Electronic Designs WS1M32-XH2X 1Mx32 SRAM MODULE FEATURES „ Access Times of 20, 25ns „ 5V Power Supply „ Packaging „ Low Power CMOS • 66 pin PGA Type, 1.385" sq., Hermetic Ceramic HIP Package 402 * „ Built-in Decoupling Caps and Multiple Ground Pins

511S

Abstract: WS1M32-XG3X ah55
Contextual Info: WS1M32-XG3X 1Mx32 SRAM MODULE PRELIMINARY* FEATURES • Access Time of 70, 85, 100, 120ns ■ TTL Compatible Inputs and Outputs ■ 84 lead, 28mm CQFP, Package 511 ■ 5 Volt Power Supply ■ Organized as two banks of 512Kx32, User Configurable as 1Mx16 or 2Mx8

WS1M32-XG3X

Abstract: S1M32
Contextual Info: WS1M32-XXX White Electronic Designs 1Mx32 SRAM MODULE FEATURES • Access Times of 17, 20, 25ns ■ Commercial, Industrial and Military Temperature Ranges ■ Packaging • 84 lead, 28mm CQFP, Package 511 ■ TTL Compatible Inputs and Outputs • 66 pin PGA Type, 1.385" sq., Hermetic Ceramic HIP

Contextual Info: White Electronic Designs WS1M32-XXX 1Mx32 SRAM MODULE FEATURES Access Times of 17, 20, 25ns TTL Compatible Inputs and Outputs Packaging 5V Power Supply • 84 lead, 28mm CQFP, Package 511 Low Power CMOS • 66 pin PGA Type, 1.385" sq., Hermetic Ceramic HIP (Package 402)*

Contextual Info: Z2 WS1M32-XG4TX WHITE /M ICROELECTRONICS 1Mx32 SRAM MODULE advanced* FEATURES • Access Times of 17, 20, 25ns ■ Low Power C M O S ■ 68 lead, 40mm Low Profile CQFP, 3.5mm 0.140" high (Package 502) ■ Built in Decoupling Caps and Multiple Ground Pins for Low

Contextual Info: a WS1M32-XG4DX WHITE /MICROELECTRONICS 1Mx32 SRAM MODULE ADVANCED* FEATURES • A cce ss Tim es of 25, 35, 45nS ■ L ow P ow er CMOS ■ ■ B u ilt in D ecoupling Caps and M u lt ip le Ground Pins fo r Low N oise O peration 68 lead, 4 0m m 1.560" square H erm e tic CQFP, 5.2m m

Contextual Info: WS1M32V-XG3X M/HITE /MICROELECTRONICS 1Mx32 SRAM 3.3V MODULE PRELIMINARY* FEATURES • A ccess Tim es o f 17, 20, 25ns ■ Low P o w e r CMOS ■ 84 lead, 28m m CQFP, Package 511 ■ B uilt-in D ecoupling Caps and M u lt ip le Ground Pins fo r Low N oise O peration

Contextual Info: a WS1M32-XG3X M/HITE /MICROELECTRONICS 1Mx32 SRAM MODULE FEATURES • A c c e s s T im e s of 17, 20, 25ns ■ Low Pow er CM OS ■ 84 lead, 28mm CQFP, Packag e 511 ■ Built-in Decoupling Caps and M u ltip le Ground Pins fo r Low Noise Operation ■ Organized as tw o banks of 512 K x 3 2 , U ser C o nfig urable as

Contextual Info: a WS1M32-XG3X WHITE /MICROELECTRONICS 1Mx32 SRAM MODULE FEATURES • A c c e s s T im e s of 17, 20, 25ns Low Pow er CM OS ■ 84 lead, 28mm CQFP, Packag e 511 B uilt-in Decoupling Caps and M u ltip le Ground Pins fo r Low N oise Operation ■ Organized as tw o banks of 5 1 2K x3 2 , U ser C o nfig urable as

WS1M32V-XG3X

Contextual Info: WS1M32V-XG3X HI-RELIABILITY PRODUCT 1Mx32 SRAM 3.3V MODULE PRELIMINARY* FEATURES • Access Times of 17, 20, 25ns ■ Low Power CMOS ■ 84 lead, 28mm CQFP, Package 511 ■ Built-in Decoupling Caps and Multiple Ground Pins for Low Noise Operation ■ Organized as two banks of 512Kx32, User Configurable as

Contextual Info: a WS1M32V-XG3X WHITE /MICROELECTRONICS 1Mx32 SRAM 3.3V MODULE PRELIMINARY* FEATURES • A ccess Tim es of 17, 20, 25ns ■ ■ 84 lead, 28m m CQFP, Package 511 ■ ■ B u ilt-in D ecoupling Caps and M u ltip le Ground Pins fo r Low N oise O peration O rganized as tw o banks of 512Kx32, User C o nfig ura ble as

WS1M32V-XG3X

Contextual Info: WS1M32V-XG3X HI-RELIABILITY PRODUCT 1Mx32 SRAM 3.3V MODULE PRELIMINARY* FEATURES n Access Times of 17, 20, 25ns n 3.3 Volt Power Supply n 84 lead, 28mm CQFP, Package 511 n Low Power CMOS n Organized as two banks of 512Kx32, User Configurable as 2Mx16 or 4Mx8

Contextual Info: WS1M32V-XG3X PRELIMINARY* 1Mx32 SRAM 3.3V MODULE FEATURES  Access Times of 17, 20, 25ns  3.3V Power Supply  84 lead, 28mm CQFP, Package 511  Low Power CMOS  Organized as two banks of 512Kx32, User Configurable as 2Mx16 or 4Mx8

WS1M32-XG3X

Contextual Info: White Electronic Designs WS1M32-XG3X PRELIMINARY* 1Mx32 SRAM MODULE FEATURES Access Time of 70, 85, 100, 120ns 5V Power Supply 84 lead, 28mm CQFP, Package 511 Low Power CMOS Organized as two banks of 512Kx32, User Configurable as 1Mx16 or 2Mx8 Weight - WS1M32-XG3X - 20 grams typical