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    WLCSP39 Search Results

    WLCSP39 Datasheets (1)

    Part ECAD Model Manufacturer Description Datasheet Type PDF PDF Size Page count
    WLCSP39
    NXP Semiconductors Wafer level chip-scale package; 39 balls Original PDF 342.96KB 1

    WLCSP39 Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    Contextual Info: Package outline WLCSP39: wafer level chip-scale package; 39 balls; 2.66 x 3.765 x 0.38 mm B E NXH1501UK A ball A1 index area A A2 D A1 detail X e1 e3 e C C A B C Øv Øw b y e K J H G F E D C B A ball A1 index area e2 1 2 3 4 e4 X 3 mm scale Dimensions mm are the original dimensions


    Original
    WLCSP39: NXH1501UK wlcsp39 nxh1501uk NXH150155 PDF