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underfill

Abstract: SILICON CONTROL RECTIFIER DETAILS AN-1050 Aluminum alloys physical properties Ablestik underfill SN62 PB36 ag2 Copper SN62 PB36 ag2 alsic 105 alsic
Contextual Info: AN-1050 DirectFET TM Technology Materials and Practices Application Note page Factors causing thermal fatigue 2 Summarized test results 2 Use of underfill beneath devices 3 Use of lead-free solder alloys 3 Use of insulated metal substrates 4 Use of conformal coatings

Contextual Info: DATA SHEET SE4110S: GPS Receiver IC Applications Product Description • The SE4110S is a highly integrated GPS receiver offering high performance and low power operation in a wide range of low-cost applications. It is particularly well suited to cellphone and high sensitivity L1-band GPS /

Contextual Info: Freescale Semiconductor MPC8560EC Rev. 3, 07/2004 Technical Data MPC8560 Integrated Processor Hardware Specifications The MPC8560 contains a PowerPC processor core. The MPC8560 integrates a processor that implements the PowerPC architecture with system logic required for networking, storage,

Bandpass filter SAW 2.4 GHz 50 Ohm

Contextual Info: DATA SHEET SE4110S: GPS Receiver IC Applications • •  Product Description High sensitivity / low power GPS and A-GPS applications Portable navigation devices, mobile phones and GPS peripheral devices Telematics equipment Features     

uart 16450 timing

Abstract: MPC8260 MPC8544EEC MPC860T PC16550D REQ64 RGMII Layout Guide
Contextual Info: Freescale Semiconductor Technical Data Document Number: MPC8544EEC Rev. 4, 09/2010 MPC8544E PowerQUICC III Integrated Processor Hardware Specifications 1 MPC8544E Overview This section provides a high-level overview of MPC8544E features. Figure 1 shows the major functional units within

Contextual Info: DATA SHEET SE4110S: GPS Receiver IC Applications Product Description • The SE4110S is a highly integrated GPS receiver offering high performance and low power operation in a wide range of low-cost applications. It is particularly well suited to cellphone and high sensitivity L1-band GPS /

MPC8260

Abstract: MPC860T PC16550D REQ64 MPC8533
Contextual Info: Freescale Semiconductor Technical Data Document Number: MPC8533EEC Rev. 4, 09/2010 MPC8533E PowerQUICC III Integrated Processor Hardware Specifications 1 MPC8533E Overview This section provides a high-level overview of MPC8533E features. Figure 1 shows the major functional units within

201654C

Abstract: Loctite hysol
Contextual Info: DATA SHEET SE2600S: 2.4 GHz WLAN Switch/Low-Noise Amplifier Front-End Applications • IEEE802.11b DSSS WLAN • IEEE802.11g/n OFDM WLAN • Embedded systems Features • Integrates an SP3T switch and LNA with bypass mode • Gain: 12 dB • Noise Figure: 1.8 dB

Contextual Info: PRELIMINARY DATA SHEET SKY85606-11: 5 GHz, 802.11ac Switch/Low-Noise Amplifier Front-End VDD Applications • WiFi-enabled handsets, tablets, and mobile systems  System-in-Package SiP modules for embedded systems  802.11n/ac smartphones and tablets

mpc7448

Abstract: C10G2
Contextual Info: Freescale Semiconductor MPC7448EC Rev. 0, 9/2005 Advance Information MPC7448 RISC Microprocessor Hardware Specifications This document is primarily concerned with the PowerPC MPC7448. The MPC7448 is an implementation of the PowerPC microprocessor family of reduced instruction set computer RISC

EB62

Abstract: AMCC PART MARKING Chronos P1 metrowerks codetest MPC8560 tier fence high voltage high voltage tier fence generator MPC85xx tsec MPC8560PX667LB primer p19
Contextual Info: Freescale Semiconductor MPC8560EC Rev. 3, 07/2004 Technical Data MPC8560 Integrated Processor Hardware Specifications The MPC8560 contains a PowerPC processor core. The MPC8560 integrates a processor that implements the PowerPC architecture with system logic required for networking, storage,

motorola diode marking B12

Contextual Info: Advance Information MPC7447AEC Rev. 0, 2/2004 MPC7447A RISC Microprocessor Hardware Specifications This document is primarily concerned with the PowerPC MPC7447A; however, unless otherwise noted, all information here also applies to the MPC7447. The MPC7447A is an

201676B

Contextual Info: APPLICATION NOTE Wafer Level Chip Scale Packages: SMT Process Guidelines and Handling Considerations Introduction The Skyworks Wafer Level Chip Scale Package WLCSP is a bumped die solution that can be used for in-module and/or standalone applications. WLCSP packaging technology is applied

Contextual Info: PRELIMINARY DATA SHEET SKY85202-11: 2.4 GHz, 802.11ac Switch/Low-Noise Amplifier Front-End Applications VBATT BT • WiFi-enabled handsets, tablets, and mobile systems  System-in-Package SiP modules for embedded systems  802.11n/ac smartphones and tablets

AD14

Abstract: MPC107 DNA 1001 DL
Contextual Info: Advance Information MPC107EC/D Rev. 0.6, 12/2001 MPC107 PCI Bridge /Memory Controller Hardware Specifications This document provides an overview of the MPC107 PCI bridge/memory controller PCIB/MC for high-performance embedded systems. The MPC107 is a cost-effective,

Contextual Info: PRELIMINARY DATA SHEET SKY85606-11: 5 GHz, 802.11ac Switch/Low-Noise Amplifier Front-End VDD Applications • WiFi-enabled handsets, tablets, and mobile systems  System-in-Package SiP modules for embedded systems  802.11n/ac smartphones and tablets

Contextual Info: Si8473EDB Vishay Siliconix P-Channel 20-V D-S MOSFET FEATURES PRODUCT SUMMARY VDS (V) RDS(on) () - 20 ID (A)a, e 0.041 at VGS = - 4.5 V - 7.1 0.055 at VGS = - 2.5 V - 6.1 • Halogen-free According to IEC 61249-2-21 Definition • TrenchFET Power MOSFET

Contextual Info: Si8475EDB Vishay Siliconix P-Channel 20-V D-S MOSFET FEATURES PRODUCT SUMMARY VDS (V) RDS(on) () - 20 ID (A)a, e 0.032 at VGS = - 4.5 V - 7.7 0.051 at VGS = - 2.5 V - 6.1 • Halogen-free According to IEC 61249-2-21 Definition • TrenchFET Power MOSFET

Contextual Info: Si8473EDB Vishay Siliconix P-Channel 20-V D-S MOSFET FEATURES PRODUCT SUMMARY VDS (V) RDS(on) () - 20 ID (A)a, e 0.041 at VGS = - 4.5 V - 7.1 0.055 at VGS = - 2.5 V - 6.1 • Halogen-free According to IEC 61249-2-21 Definition • TrenchFET Power MOSFET

Contextual Info: Si8475EDB Vishay Siliconix P-Channel 20-V D-S MOSFET FEATURES PRODUCT SUMMARY VDS (V) RDS(on) () - 20 ID (A)a, e 0.032 at VGS = - 4.5 V - 7.7 0.051 at VGS = - 2.5 V - 6.1 • Halogen-free According to IEC 61249-2-21 Definition • TrenchFET Power MOSFET

Contextual Info: Si8473EDB Vishay Siliconix P-Channel 20-V D-S MOSFET FEATURES PRODUCT SUMMARY VDS (V) RDS(on) () - 20 ID (A)a, e 0.041 at VGS = - 4.5 V - 7.1 0.055 at VGS = - 2.5 V - 6.1 • Halogen-free According to IEC 61249-2-21 Definition • TrenchFET Power MOSFET

Contextual Info: Freescale Semiconductor, Inc. Advance Information MPC7447AEC Rev. 0, 2/2004 Freescale Semiconductor, Inc. MPC7447A RISC Microprocessor Hardware Specifications This document is primarily concerned with the PowerPC MPC7447A; however, unless otherwise noted, all information here also applies to the MPC7447. The MPC7447A is an

Contextual Info: Si8487DB Vishay Siliconix P-Channel 30-V D-S MOSFET FEATURES PRODUCT SUMMARY (A)a, e VDS (V) RDS(on) () Max. 0.031 at VGS = - 10 V - 7.7 - 30 0.035 at VGS = - 4.5 V - 7.3 0.045 at VGS = - 2.5 V - 6.4 ID • Halogen-free According to IEC 61249-2-21 Definition

AS4DDR264M72PBG

Abstract: H11M1
Contextual Info: iPEM 4.8 Gb SDRAM-DDR2 AS4DDR264M72PBG1 64Mx72 DDR2 SDRAM w/ SHARED CONTROL BUS iNTEGRATED Plastic Encapsulated Microcircuit FEATURES BENEFITS DDR2 Data rate = 667, 533, 400 Available in Industrial, Enhanced and Military Temp Package: • Proprietary Enchanced Die Stacked iPEM