WE512K8 Search Results

Contextual Info: I/M-IITE /M IC R O ELEC T R O N IC S WE512K8, WE256K8, WE128K8-XCX 512Kx8 CMOS EEPROM, WE512K8-XCX, SMD 5962-93091 512Kx8 BIT CMOS EEPROM MODULE FEATURES FIG. 1 P IN C O N F IG U R A T IO N T O P V IE W L 1 A16 r 2 A15 [7 3 32 A12 4 29 A7C 5 A6 [T 6 A5 E 7

smd A7t

Abstract: smd code A7t
Contextual Info: E g M/HITE / M IC R O E L E C T R O N IC S WE512K8, WE256K8, WE128K8-XCX 512Kx8 CMOS EEPROM, WE512K8-XCX, SMD 5962-93091 512Kx8 BIT CMOS EEPROM MODULE FEATURES FIG. 1 PIN CONFIGURATION • JEDEC Standard 32 Pin DIP, Hermetic Ceramic Package A18 [I 1 32 A16 C 2

Contextual Info: TT WHITE /M ICRO ELECTRO N ICS WE512K8, WE256K8, WE128K8-XCX 512Kx8 CMOS EEPROM, WE512K8-XCX, S M D 5962-93091 512Kx8 BIT CMOS EEPROM MODULE FEATURES FIG. 1 PIN C O N FIG U R A T IO N T O P VIEW A18Ü 1 32 □ v cc A16 C 2 31 □ W E A15 C 3 30 □ A 17 A12Ü 4

Contextual Info: M/HITE /M ICRO ELEC TR O N IC S WE512K8, WE256K8, WE128K8-XCX 512Kx8 CMOS EEPROM, WE512K8-XCX, SM D 5962-93091 512Kx8 BIT CMOS EEPROM MODULE FEATURES FIG. 1 PIN CONFIGURATION TO P V IEW A18C 1 A 16 C 2 32 □ V « 31 □ w e A 15 C 3 30 □ A17 A 12 C 4 29 □ A14

8 pin ceramic dip microsemi

Contextual Info: WE512K8, WE256K8, WE128K8-XCX 512Kx8 CMOS EEPROM, WE512K8-XCX, SMD 5962-93091 512Kx8 BIT CMOS EEPROM MODULE FEATURES  Automatic Page Write Operation  Read Access Times of 150, 200, 250, 300ns • Internal Address and Data Latches for  JEDEC Standard 32 Pin, Hermetic Ceramic DIP Package

WE512K8

Abstract: 128kx8 eeprom
Contextual Info: WE512K8, WE256K8, WE128K8-XCX White Electronic Designs 512Kx8 CMOS EEPROM, WE512K8-XCX, SMD 5962-93091 512Kx8 BIT CMOS EEPROM MODULE FIGURE 1 FEATURES „ Read Access Times of 150, 200, 250, 300ns „ JEDEC Standard 32 Pin, Hermetic Ceramic DIP Package 300

128kx8 eeprom

Contextual Info: WE512K8, WE256K8, WE128K8-XCX 512Kx8 CMOS EEPROM, WE512K8-XCX, SMD 5962-93091 512Kx8 BIT CMOS EEPROM MODULE FEATURES  Automatic Page Write Operation  Read Access Times of 150, 200, 250, 300ns • Internal Address and Data Latches for  JEDEC Standard 32 Pin, Hermetic Ceramic DIP Package

256Kx8bit

Contextual Info: M4HITE / M IC R O E L E C T R O N IC S WE512K8, WE256K8, WE128K8-XCX 512Kx8 CMOS EEPROM, WE512K8-XCX, SMD 5962-93091 512Kx8 BIT CMOS EEPROM MODULE FEATURES FIG. 1 A18C 1 • Read Access Times of 150, 200, 250, 300ns ■ JEDEC Standard 32 Pin, Hermetic Ceramic DIP Package 300

Contextual Info: WE512K8, WE256K8, WE128K8-XCX 512Kx8 CMOS EEPROM, WE512K8-XCX, SMD 5962-93091 512Kx8 BIT CMOS EEPROM MODULE FEATURES  Automatic Page Write Operation  Read Access Times of 150, 200, 250, 300ns • Internal Address and Data Latches for  JEDEC Standard 32 Pin, Hermetic Ceramic DIP Package

512 eeprom dip 32-pin

Abstract: WE512K8-XCX WE256K8-XCX WE128K8-XCX WE512K8 256KX8
Contextual Info: WE512K8, WE256K8, WE128K8-XCX 512Kx8 CMOS EEPROM, WE512K8-XCX, SMD 5962-93091 512KX8 BIT CMOS EEPROM MODULE FIG. 1 PIN CONFIGURATION TOP VIEW FEATURES • Read Access Times of 150, 200, 250, 300ns ■ JEDEC Standard 32 Pin, Hermetic Ceramic DIP Package 300

Contextual Info: WHITE M I C R O E L E C T R O N I C S WE512K8, WE256K8, WE128K8-XCX 512Kx8 CMOS EEPROM, WE512K8-XCX, SMD 5962-93091 512Kx8 BIT CM OS EEPROM MODULE FEATURES FIG. 1 PIN C O N F IG U R A T IO N T O P V IE W 32 □ V . 31 □ WE 30 □ A17 A18C 1 A16C 2 A15C 3

Contextual Info: T T WHITE M IC R O E LE C T R O N IC S WE512K8, WE256K8, WE128K8-XCX 512Kx8 CMOS EEPROM, WE512K8-XCX, SMD 5962-93091 512Kx8 BIT CMOS EEPROM MODULE FEATURES FIG. 1 PIN CONFIGURATION TOP VIEW A ieC A 16 C A 15 Ü A 12 C A7 C A6 C A5 Ü A4 C A3 C A2 C 1 2 3 4

512 eeprom dip 32-pin

Abstract: WE512K8
Contextual Info: WE512K8, WE256K8, WE128K8-XCX White Electronic Designs 512Kx8 CMOS EEPROM, WE512K8-XCX, SMD 5962-93091 512Kx8 BIT CMOS EEPROM MODULE FIGURE 1 FEATURES Pin Configuration Top View Read Access Times of 150, 200, 250, 300ns JEDEC Standard 32 Pin, Hermetic Ceramic DIP

128kx8 eeprom

Abstract: A16 SMD WE512K8 512 eeprom dip 32-pin
Contextual Info: WE512K8, WE256K8, WE128K8-XCX 512Kx8 CMOS EEPROM, WE512K8-XCX, SMD 5962-93091 512Kx8 BIT CMOS EEPROM MODULE FEATURES FIG. 1 PIN CONFIGURATION TOP VIEW A18 A16 A15 A12 A7 A6 A5 A4 A3 A2 A1 A0 I/O0 I/O1 I/O2 Vss 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17

5962-9309104HXC

Abstract: qml-38534 5962-9309101HYC 5962-9309101hya 5962-9309102HXC
Contextual Info: REVISIONS LTR DESCRIPTION DATE YR-MO-DA APPROVED A Added device types 02, 03, and 04. Made changes to tables I and II. 93-04-15 K. Cottongim B Added device type 05. Added case outline Y. Redrew entire document. 96-04-22 K. A. Cottongim C Changes in accordance with NOR 5962-R154-96.

B0580

Contextual Info: W W hite Technology, Inc MEMORY PRODUCTS PRELIMINARY W E-512K8-150 l/OO 1/01 I/0 2 V ss I I c [ c c : [ [ c 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 ] ] WE ] A17 ] A14 < [ [ c [ [ c O O A18 A16 A15 A12 A7 A6 A5

LE79Q2281

Abstract: 1N6761-1 2N2369AU 2N2907AUB BR17 datasheet transistor SI 6822 Dimming LED aplications Dimming LED Driver aplications GC4600 IC ZL70572
Contextual Info: Product Portfolio 2013-2014 ng-edge Embed Power Matters. About Microsemi Microsemi Corporation is a leading provider of semiconductor solutions differentiated by power, security, reliability and performance. The company concentrates on providing solutions for applications where power matters, security

29f040b

Abstract: teradyne catalyst Stacked 4MB Flash and 1MB SRAM WED3C755E8MC FLF14 kyocera 128 cqfp CERAMIC QUAD FLATPACK CQFP 95613 hac 132 BAG PACKAGE TOP MARK tms320c6
Contextual Info: White Electronic Designs Table Of Contents Product Overview . 2 Commitment . 3

transistor smd 5DW 73

Abstract: sipex 3232 BU-61588P3 SD-14621DX SD14621 sdc 7500 natel 09059 MPC 1298 V 5962-8952211YC 95003-01HXA
Contextual Info: Qualifications Validated Annually QUALIFIED MANUFACTURERS LIST OF CUSTOM HYBRID MICROCIRCUITS QUALIFIED UNDER MILITARY SPECIFICATION MIL-PRF-38534 CUSTOM HYBRID MICROCIRCUITS QML-38534-29 30-Jun-99 SUPERSEDING QML-38534-28 31-Mar-99 CUSTOM HYBRID MICROCIRCUITS

5962-XXXXXZZ

Abstract: QML-38534 qml-38535
Contextual Info: REVISIONS DESCRIPTION LTR DATE 93-04-15 Added device types 02, 03, and 04. Made changes to tables I and II._ APPROVED YR-MO-DA K. Cottongim REV SHEET REV SHEET 15 16 17 REV STATUS OF SHEETS PMIC N/A STANDARDIZED MILITARY DRAWING THIS DRAWING IS AVAILABLE

Contextual Info: BOIiinAR/UHITE TECHNOLOGY 4bE D • IShBtlfl TTW h ite Technology, Inc. 0 ■ BülT7=4SW?—«2-7 MEMORY PRODUCTS PRELIMINARY A1 8 C 1 A1 6 C 2 32 JV cc 31 H W E A1 5 C 3 A1 2 Ü 4 30 H A 17 A7 C 5 28 H A 13 A6 E 6 27 H A8 WE-512K8-150 29 H A 14 A5 C 7 26 H A9

E512

Contextual Info: WW hite Technology, Inc MEMORY PRODUCTS PRELIMINARY WE-512K8-150 A18 Í 1 A16 [ 2 A15 c 3 A12 [ 4 A7 A6 A5 A4 A3 A2 [ 5 c 6 I 7 Í 8 Í 9 Í 10 c 11 c 12 i/ o o : 13 1/01 [ 14 I/0 2 [ 15 V s s [ 16 A1 A0 32 ] V c c 31 ] WE 30 ] A17 512K x 8 BIT CMOS EEPROM

5962L0053605VYC

Abstract: 5962-9069204QXA ATMEL 302 24C16 UT9Q512E-20YCC MOH0268D UT54ACS164245SEIUCCR Z085810 5962-9762101Q2A UT28F256QLET-45UCC 5962R0250401KXA
Contextual Info: NOT MEASUREMENT SENSITIVE MIL-HDBK-103AJ 19 SEPTEMBER 2011 SUPERSEDING MIL-HDBK-103AH 28 MARCH 2011 DEPARTMENT OF DEFENSE HANDBOOK LIST OF STANDARD MICROCIRCUIT DRAWINGS This handbook is for guidance only. Do not cite this document as a requirement. AMSC N/A