WAVE FOOTPRINT Search Results

SD3502

Abstract: ZM5101
Contextual Info: ZM5101 General Purpose Z-Wave SiP Module The ZM5101 combines a Z-Wave SD3502 SoC with a built-in microcontroller and Z-Wave RF transceiver , crystal, and passive RF components within a single 8mm x 8mm module. This makes the ZM5101 ideal for small-footprint, single microcontroller products, such

Contextual Info: Wave soldering footprint Footprint information for wave soldering of hermetically sealed glass surface-mounted package; 2 connectors SOD80C 6.30 4.90 2.70 1.90 2.90 1.70 solder land solder resist occupied area Dimensions in mm www.nxp.com 2010 NXP B.V.

sot363 wave soldering

Contextual Info: Wave soldering footprint Footprint information for wave soldering of plastic surface-mounted package; 6 leads SOT363 1.5 0.3 2.5 4.5 1.5 1.3 1.3 2.45 5.3 preferred transport direction during soldering solder land solder resist occupied area Dimensions in mm

Contextual Info: Wave soldering footprint Footprint information for wave soldering of plastic surface-mounted package; 4 leads SOT143B 4.45 2.2 1.2 3x 1.425 (3×) 4.6 2.575 preferred transport direction during soldering 1.425 solder land 1 solder resist 1.2 occupied area

Contextual Info: Wave soldering footprint Footprint information for wave soldering of plastic surface-mounted package with increased heatsink; 4 leads SOT223 8.9 6.7 1.9 4 6.2 8.7 preferred transport direction during soldering 1 2 3 1.9 3x solder land 2.7 solder resist

Contextual Info: Wave soldering footprint Footprint information for wave soldering of plastic surface-mounted package; 3 leads SOT23 2.2 1.2 2x 1.4 (2×) 4.6 2.6 preferred transport direction during soldering 1.4 solder land 2.8 solder resist 4.5 occupied area www.nxp.com

sod323 wave soldering

Contextual Info: Wave soldering footprint Footprint information for wave soldering of plastic surface-mounted, 2 leads package SOD323 5 2.9 1.5 2x 2.75 1.2 (2×) preferred transport direction during soldering solder land solder resist occupied area Dimensions in mm www.nxp.com

wave footprint

Contextual Info: Wave soldering footprint Footprint information for wave soldering of plastic surface-mounted package; 3 leads SOT323 4.6 2.575 1.425 3x 1.8 3.65 2.1 09 (2×) preferred transport direction during soldering solder land solder resist occupied area Dimensions in mm

ZM5202

Abstract: SD3502
Contextual Info: ZM5202 General Purpose Z-Wave Module The ZM5202 module combines a Z-Wave® SD3502 SoC with a built-in microcontroller and Z-Wave RF transceiver , crystal, and passive RF components. This makes the ZM5202 ideal for single microcontroller products, such as lighting control and sensors. The

Contextual Info: Wave soldering footprint Footprint information for wave soldering of plastic surface-mounted package; 5 leads SOT353 4.9 2.25 1.5 1 0.85 2.5 4.5 0.85 1 1.5 1.3 1.3 1.225 solder land solder resist occupied area Dimensions in mm www.nxp.com 2010 NXP B.V.

Contextual Info: Wave soldering footprint Footprint information for wave soldering of SO8 package SOT96-1 1.20 2x enlarged solder land 0.3 (2×) 0.60 (6×) 1.30 4.00 6.60 7.00 1.27 (6×) 5.50 preferred transport direction during soldering solder land solder resist occupied area

Contextual Info: Wave soldering footprint Footprint information for wave soldering of TSOP6 package SOT457 5.3 1.5 4x 1.475 0.45 (2×) 5.05 1.475 1.45 (6×) 2.85 solder land solder resist occupied area Dimensions in mm www.nxp.com 2010 NXP B.V. preferred transport direction during soldering

TO-220 footprint

Abstract: Heat Sinks 288-1AB 750 271
Contextual Info: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 288 SERIES Compact Wave-Solderable Low-Cost Heat Sinks Standard P/N Height Above PC Board in. mm Maximum Footprint in. (mm) 288-1AB ̆ 1.250 (31.8) 0.875 (22.2) x 0.215 (5.5) Mounting tabs are pre-tinned to ensure excellent wave-solder bond and good

LQFP32

Abstract: LQFP48 LQFP64 LQFP80 QFP100 QFP160 QFP52 SSOP16 SSOP20 TQFP64
Contextual Info: Philips Semiconductors Package information Soldering INTRODUCTION SURFACE MOUNTED PACKAGES There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when though-hole and surface mounted components are mixed on one printed-circuit board. However, wave

LQFP64. footprint

Abstract: dual infrared transistor TQFP80 footprint QFP package weight diode databook package outline SMD Packages TQFP100 footprint LQFP32 LQFP48 LQFP64
Contextual Info: Philips Semiconductors Package information Soldering INTRODUCTION SURFACE MOUNTED PACKAGES There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is

Contextual Info: SC3033B 1000.00 MHz Differential Sine-Wave Clock Quartz SAW Frequency Stability Fundamental Fixed Frequency Very Low Jitter and Power Consumption Rugged, Miniature, Surface-Mount Case Low-Voltage Power Supply 3.3 VDC • • • • • p pi SMC-8 Case inis digital clock is designed lor use witn mgn-speed timing systems, fundamentalmode oscillation is made possible by surface-acoustic-wave (SAW) technology. The

SC3011B

Contextual Info: SC3011B 600.00 MHz Differential Sine-Wave Clock • Quartz SAW Frequency Stability • Fundamental Fixed Frequency • Very Low Jitter and Power Consumption • Rugged, Miniature, Surface-Mount Case • Low-Voltage Power Supply 3.3 VDC SMC-8 Case This digital clock is designed for use with high-speed CPUs and digitizers. Fundamental-mode oscillation is made possible by surface-acoustic-wave (SAW) technology. The

6316 optocoupler

Contextual Info: SFH6315 SFH6316 SFH6343 SIEMENS HIGH SPEED OPTOCOUPLER FEATURES Surface Mountable Industry Standard SOIC-8 Footprint Com patible with Infrared Vapor Phase Reflow and Wave Soldering Processes Isolation Voltage, 2500 VRMS Very High Common M odeTransient Immunity:

6343 opto

Abstract: SFH6316-HCPL0501 SFH6343-HCPL0453 HCPL0453 HCPL0500 HCPL0501 SFH6315 SFH6316 SFH6343 6316 opto
Contextual Info: SFH6315 SFH6316 SFH6343 High Speed Optocoupler FEATURES • Surface Mountable • Industry Standard SOIC-8 Footprint • Compatible with Infrared Vapor Phase Reflow and Wave Soldering Processes • Isolation Voltage, 3000 VRMS • Very High Common Mode Transient Immunity:

6343 opto

Abstract: HCPL0453 HCPL0500 HCPL0501 SFH6315T SFH6316T SFH6343 SFH6343T
Contextual Info: SFH6315T SFH6316T SFH6343T High Speed Optocoupler FEATURES • Surface Mountable • Industry Standard SOIC-8 Footprint • Compatible with Infrared Vapor Phase Reflow and Wave Soldering Processes • Isolation Voltage, 3000 VRMS • Very High Common Mode Transient Immunity:

67968-002

Abstract: 66476-001
Contextual Info: • Connect electronic telephone sets, data processing systems or any other equipment needing small versatile interconnection systems. • Meet FCC requirements. • Housing material withstands wave soldering. • Jack-to-board footprint is the popular 2.04x2.54 mm 0.080x0.100 in.

led 3mm red standard

Abstract: H13XCBWD H13XCGD H13XCGD5V H13XCGDL H13XCHDL H13XCYD H13XCYD5V H13XCYDL
Contextual Info: 90˚led assemblies T-1 3mm Variable Centerline Assemblies • 4 Centerlines Available • Standard Footprint • Design Your Own LED Assembly (see page 136) LED Assy. No. Peak Wave Emitted Length Color H13XCBWD 430 H13XCGD H13XCYD Lens Appearance Electro-Optical

Optocoupler 721

Contextual Info: VOM452T, VOM453T Vishay Semiconductors Analog High Speed Optocoupler, 1 MBd, Transistor Output, SOP-5 Package FEATURES • Surface mountable A 1 • Industry standard SOP-5 footprint 6 VCC • Compatible with infrared vapor phase reflow and wave soldering processes

H101CBC

Abstract: H-101CBC H178CBC H-178CBC
Contextual Info: 90˚led assemblies Bi-Color, Single Level Assemblies • Interlocking Versions Available • Additional Configurations • Low Cost and Space Saving Design • Standard Footprint H-101CBC Series T-1 3mm 90˚ Assembly. LED Assy. No. Peak Wave Emitted Length