WAVE FOOTPRINT Search Results

SD3502

Abstract: ZM5101
Contextual Info: ZM5101 General Purpose Z-Wave SiP Module The ZM5101 combines a Z-Wave SD3502 SoC with a built-in microcontroller and Z-Wave RF transceiver , crystal, and passive RF components within a single 8mm x 8mm module. This makes the ZM5101 ideal for small-footprint, single microcontroller products, such

Z-Wave Application Programming Guide

Abstract: ZW0301 Application Programming Guide APL10045 ins10247 APL10312 Z-Wave Guide INS10247 Z-Wave Programming Guide Zensys, INS10247 ZW0301 Zensys, APL10312, Application Note, Programming the 200 and 300 Series Z-Wave Single Chip Flash
Contextual Info: Datasheet ZM3102N Z-Wave Module Datasheet Document No: DSH10756 Version: 6 Description: Datasheet for the ZM3102N Z-Wave Module based on the ZW0301 Z-Wave Single Chip. Written By: SDH;TCA Date: 2007-10-01 Reviewed By: DCL Restrictions: None Approved by: Date

ZW0301

Abstract: ZM3102 ZW0401 ZW0402 ZW0102 z-wave ZENSYS wireless door BELL automatic door bell ZW0201
Contextual Info: Z-Wave 300-Series Single Chip – Overview – November 2006 Zensys Inc., 2006 – Confidential Z-Wave P300 Overview - 17 November 2006 - 1 Z-Wave evolution ZW0102 ZW0201 0.35um 0.18um ZW0301 … ZW0301XXXX XXXX … Static Controllers SUC / SIS 40 kbit/s

Contextual Info: Wave soldering footprint Footprint information for wave soldering of hermetically sealed glass surface-mounted package; 2 connectors SOD80C 6.30 4.90 2.70 1.90 2.90 1.70 solder land solder resist occupied area Dimensions in mm www.nxp.com 2010 NXP B.V.

sot363 wave soldering

Contextual Info: Wave soldering footprint Footprint information for wave soldering of plastic surface-mounted package; 6 leads SOT363 1.5 0.3 2.5 4.5 1.5 1.3 1.3 2.45 5.3 preferred transport direction during soldering solder land solder resist occupied area Dimensions in mm

3h32

Abstract: H32 Package 25H32 5h32 208E 213B 3H32-AT-16 22496
Contextual Info: CLOCK OSCILLATORS Logic: HCMOS “H32” series 3.2x2.5x1.1 mm; Wave Form: Square wave MERCURY Since 1973 ● Suitable for light weight and compact consumer electronic devices ● Ideal for high density boards ● Mercury’s smallest footprint clock oscillators.

Contextual Info: Wave soldering footprint Footprint information for wave soldering of plastic surface-mounted package; 4 leads SOT143B 4.45 2.2 1.2 3x 1.425 (3×) 4.6 2.575 preferred transport direction during soldering 1.425 solder land 1 solder resist 1.2 occupied area

Contextual Info: Wave soldering footprint Footprint information for wave soldering of plastic surface-mounted package with increased heatsink; 4 leads SOT223 8.9 6.7 1.9 4 6.2 8.7 preferred transport direction during soldering 1 2 3 1.9 3x solder land 2.7 solder resist

Contextual Info: Wave soldering footprint Footprint information for wave soldering of plastic surface-mounted package; 3 leads SOT23 2.2 1.2 2x 1.4 (2×) 4.6 2.6 preferred transport direction during soldering 1.4 solder land 2.8 solder resist 4.5 occupied area www.nxp.com

sod323 wave soldering

Contextual Info: Wave soldering footprint Footprint information for wave soldering of plastic surface-mounted, 2 leads package SOD323 5 2.9 1.5 2x 2.75 1.2 (2×) preferred transport direction during soldering solder land solder resist occupied area Dimensions in mm www.nxp.com

wave footprint

Contextual Info: Wave soldering footprint Footprint information for wave soldering of plastic surface-mounted package; 3 leads SOT323 4.6 2.575 1.425 3x 1.8 3.65 2.1 09 (2×) preferred transport direction during soldering solder land solder resist occupied area Dimensions in mm

ZM5202

Abstract: SD3502
Contextual Info: ZM5202 General Purpose Z-Wave Module The ZM5202 module combines a Z-Wave® SD3502 SoC with a built-in microcontroller and Z-Wave RF transceiver , crystal, and passive RF components. This makes the ZM5202 ideal for single microcontroller products, such as lighting control and sensors. The

Contextual Info: Wave soldering footprint Footprint information for wave soldering of SO20 package SOT163-1 1.20 2x enlarged solder land 0.3 (2×) 1.50 8.00 11.00 11.40 0.60 (18×) 1.27 (18×) 13.40 preferred transport direction during soldering solder land solder resist

Contextual Info: Wave soldering footprint Footprint information for wave soldering of plastic surface-mounted package; 5 leads SOT353 4.9 2.25 1.5 1 0.85 2.5 4.5 0.85 1 1.5 1.3 1.3 1.225 solder land solder resist occupied area Dimensions in mm www.nxp.com 2010 NXP B.V.

Contextual Info: Wave soldering footprint Footprint information for wave soldering of TSOP6 package SOT457 5.3 1.5 4x 1.475 0.45 (2×) 5.05 1.475 1.45 (6×) 2.85 solder land solder resist occupied area Dimensions in mm www.nxp.com 2010 NXP B.V. preferred transport direction during soldering

Contextual Info: Crystal oscillator Product Number please contact us VOLTAGE -CONTROLLED SAW OSCILLATOR (VCSO) LV-PECL: X1M000242xxxxxx Sine wave: X1M000262xxxxxx OUTPUT : LV-PECL, Sine wave LOW-JITTER, LOW PHASE NOISE EV - 9100JG •Frequency range : 800 MHz to 2500 MHz

TO-220 footprint

Abstract: Heat Sinks 288-1AB 750 271
Contextual Info: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 288 SERIES Compact Wave-Solderable Low-Cost Heat Sinks Standard P/N Height Above PC Board in. mm Maximum Footprint in. (mm) 288-1AB ̆ 1.250 (31.8) 0.875 (22.2) x 0.215 (5.5) Mounting tabs are pre-tinned to ensure excellent wave-solder bond and good

ins10247

Abstract: APL10312 Z-Wave Application Programming Guide APL10045 ZM2102 Z-Wave Guide INS10247 Z-Wave Programming Guide ZW0102 8051 zero crossing dimmer C code programming the 200-series z-wave single chip flash
Contextual Info: ZM2102 Datasheet Integrated Z-Wave RF Module The ZM2102 Z-Wave Module is a fully integrated RF communication module that uses the unlicensed Short-RangeDevice SRD frequency band of 868.42MHz in Europe and 908.42MHz in US. The ZM2102 is dedicated for wireless control

Contextual Info: OFF-GRID TRUE SINE WAVE SPLIT PHASE, STACKABLE INVERTER/CHARGER The TSW TrueSineWaveTM Inverter / Charger TSW3224 The Apollo Solar TSW3224 includes a DC to AC true sine wave inverter, battery charger, and AC transfer switch in a compact modular housing. Providing 3200W

LQFP32

Abstract: LQFP48 LQFP64 LQFP80 QFP100 QFP160 QFP52 SSOP16 SSOP20 TQFP64
Contextual Info: Philips Semiconductors Package information Soldering INTRODUCTION SURFACE MOUNTED PACKAGES There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when though-hole and surface mounted components are mixed on one printed-circuit board. However, wave

TQFP100 footprint

Abstract: TQFP80 footprint SMD CODE databook HDIP TQFP 44 PACKAGE footprint diode databook package outline SMD Packages TQFP80 package LQFP32 LQFP48
Contextual Info: Philips Semiconductors Package information Soldering INTRODUCTION SURFACE MOUNTED PACKAGES There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is

LQFP64. footprint

Abstract: dual infrared transistor TQFP80 footprint QFP package weight diode databook package outline SMD Packages TQFP100 footprint LQFP32 LQFP48 LQFP64
Contextual Info: Philips Semiconductors Package information Soldering INTRODUCTION SURFACE MOUNTED PACKAGES There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is

Contextual Info: SC3033B 1000.00 MHz Differential Sine-Wave Clock Quartz SAW Frequency Stability Fundamental Fixed Frequency Very Low Jitter and Power Consumption Rugged, Miniature, Surface-Mount Case Low-Voltage Power Supply 3.3 VDC • • • • • p pi SMC-8 Case inis digital clock is designed lor use witn mgn-speed timing systems, fundamentalmode oscillation is made possible by surface-acoustic-wave (SAW) technology. The

SC3011B

Contextual Info: SC3011B 600.00 MHz Differential Sine-Wave Clock • Quartz SAW Frequency Stability • Fundamental Fixed Frequency • Very Low Jitter and Power Consumption • Rugged, Miniature, Surface-Mount Case • Low-Voltage Power Supply 3.3 VDC SMC-8 Case This digital clock is designed for use with high-speed CPUs and digitizers. Fundamental-mode oscillation is made possible by surface-acoustic-wave (SAW) technology. The