WAKEFIELD ENGINEERING Search Results

139-5K

Abstract: 1395B 139-5J SCR Saddle clamp SCR 214
Contextual Info: Wakefield Engineering Precision Clamp Systems Series 139 Wakefield Engineering compression pack heat sinks and clamp systems provide electrical and industrial equipment manufacturers with complete system solutions for proper installation and heat dissipation

Contextual Info: Micrel Semiconductor Designing With LDO Regulators Section 9. References Thermal Information Micrel Databook, Micrel Inc., San Jose, CA. Tel: + 1 408 944-0800 MIL-STD-275E: Printed Wiring for Electronic Equipment. (31 December 1984) Innovative Thermal Management Solutions, Wakefield Engineering, 60 Audubon Road, Wakefield,

B 8936

Contextual Info: 4 REVISIONS ALL INFORMATION DISCLOSED BY THIS DOCUMENT IS CONSIDERED CONFIDENTIAL AND PROPRIETARY BY WAKEFIELD ENGINEERING INC. ALL DESIGN/ MANUFACTURE, USE, REPRODUCTION AND SALE RIGHTS ARE RESERVED BY WAKEFIELD ENGINEERING INC. REV A B D DESCRIPTION EC*

Aham

Abstract: MIL-STD-275E
Contextual Info: Section 9. References Thermal Information Micrel Databook, Micrel Inc., San Jose, CA.Tel: + 1 408 944-0800 MIL-STD-275E: Printed Wiring for Electronic Equipment. (31 December 1984) Innovative Thermal Management Solutions, Wakefield Engineering, 60 Audubon Road, Wakefield,

95012N2

Abstract: connector "N" 60X60 40x40x10mm mmH2O
Contextual Info: DC Brushless Fans From Wakefield Engineering, Inc. Applying over 40 years experience in thermal management solutions, Wakefield Engineering, Inc. is offering a complete line of DC brushless fans. F E AT U R E S A N D B E N E F I T S • Compact hub enables exceptional air-flow

IN2222A

Abstract: transitron catalog TCR43 TM106 IN443 1n9448 sv4091 IN4868 diode 3N68 IN536
Contextual Info: ron Tro nsitron electronic corporation e I ron 168 Albion Street . Wakefield. Massachusetts 01881 WAKEFIELD, MASSACHUSE TTS BOSTON, MASSACHUSETTS MELROSE, MASSACHUSETTS NUEVO LAREDO, MEXICO BERKSHIRE, ENGLAND PARIS, FRANCE AMSTERDAM, THE NETHERLANDS ~ ciectl'onic corpOI'atioll

Wakefield Engineering

Abstract: Muffin
Contextual Info: CORPORATE HEADQUARTERS Wakefield Thermal Solutions 33 Bridge Street • Pelham NH 03076 T: 603-635-2800 • F: 603-635-1900 www.wakefield.com ISO 9001:2000 and QS 9000 REGISTERED Bonded Fin Heat Sinks CUSTOM BONDED FIN HEAT SINKS AND ASSEMBLIES Wakefield Engineering offers an extensive line of natural convection and forced convection custom bonded fin heat sinks

D146D

Abstract: C 9072 130-B 130-C 143e 146d 143H
Contextual Info: Precision Compression Clamp Systems PRECISION COMPRESSION MOUNTING CLAMP SYSTEMS Wakefield Engineering compression pack heat sinks and clamp systems provide electrical and industrial equipment manufacturers with complete system solutions for proper installation

amd Power and Thermal

Abstract: k5 amd Chomerics T710 amd catalog "electrical connector"
Contextual Info: THERMAL MANAGEMENT SOLUTIONS FOR AMD K5 and K6 Active heat sinks for high performance microprocessors PASSIVE Wakefield Engineering heat sinks are available for AMD’s K5 and K6 microprocessors. These processors are used in personal and networked computers

Intel Celeron Covington

Abstract: Chomerics T710 mxt212
Contextual Info: THERMAL MANAGEMENT SOLUTIONS FOR THE INTEL CELERON PROCESSORS Passive 866 Passive Crosscut 866X Active 866F COVINGTON/MENDOCINO Passive and active heat sinks for the Intel Celeron Microprocessors Wakefield Engineering’s Attachment Clip 866SC Celeron

ALPHA SEMICONDUCTOR 4459

Abstract: D146D 3000LB DATASHEET SCR 131-6 132119 139-5h 139-5L 130-B 130-C 132-10G
Contextual Info: Precision Compression Clamp Systems PRECISION COMPRESSION MOUNTING CLAMP SYSTEMS Wakefield Engineering compression pack heat sinks and clamp systems provide electrical and industrial equipment manufacturers with complete system solutions for proper installation and

heatsink

Abstract: 214-243-4321 3001 transistor diode 4151 Wakefield Engineering 4151 THERMALLOY Wakefield
Contextual Info: Support Components Heatsink Vendor List Heatsink Vendor List Intricast 2160 Walsh Avenue Santa Clara, CA 95050 Tel: 408 988-6200 Fax: (408) 988-0683 Wakefield Engineering 27901 Front Street Temucula, CA 92590 Tel: (909) 676-4151 Fax: (909) 676-3031 Thermalloy

Wakefield Engineering

Abstract: 647-15ABP AR285
Contextual Info: Wakefield Engineering m Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEATSINKS Labor-Saving SpeedClip Heat Sinks for Vertical Board Mounting 667 S E R IE S Standard P/N Standoff Pin Plain Pin Height Above PC Board “A” in. mm 667-1OABSP A

Wakefield Thermal Solutions TYPE 120

Abstract: ebonol 217-36CT6 218-40CT3 218-40CT5 MO-169 635-10B2 TO38 Laser TO-44 204sb
Contextual Info: STAMPED HEAT SINKS for Low Power Devices CORPORATE HEADQUARTERS WAKEFIELD THERMAL SOLUTIONS INC. 33 Bridge Street Pelham, NH 03076 Tel: 603 635-2800 Fax: (603) 635-1900 www.wakefield.com SUBSIDIARIES: LOCKHART INDUSTRIES Paramount, CA 90723-1430 SPECIALTY EXTRUSION

BERGQUIST softface

Abstract: 61995AB124D1
Contextual Info: Thermal Management Solution for BGA and Pow e r P C packages Wakefield Engineering’s Series 619 fan heat sink provides processor spot cooling with direct impingement air flow. Features and Benefits : ♦ Captivated clips for ease of assembly Designed for use on a variety

extrusion Heatsinks

Abstract: Muffin 0024C
Contextual Info: Bonded Fin Heat Sinks CUSTOM BONDED FIN HEAT SINKS AND ASSEMBLIES Wakefield Engineering offers an extensive line of natural convection and forced convection custom bonded fin heat sinks assemblies. Configurable in a variety of ways, they are reliable, cost effective, and highly efficient thermal management

pentium II xeon

Abstract: pentium II Xeon 400 2118 intel Chomerics T710
Contextual Info: THERMAL MANAGEMENT SOLUTIONS FOR INTEL PENTIUM II Active 862F Xeon Slot II Passive Crosscut 862X Passive and active heat sinks for Pentium II Xeon (Slot II) Microprocessors Wakefield Engineering Passive 862 FEATURES AND BENEFITS heat sinks are • Both Passive and Active solutions are available

Wakefield Thermal Solutions

Abstract: Chomerics* T405 Bergquist BP-108 D10650-40 658-35AB 77AB datasheet of BGAS T405 bga package weight T411
Contextual Info: Cover.qxd 11/3/05 1:00 PM Page 1 THERMAL MANAGEMENT SOLUTIONS FOR BGAs DESIGN • ANALYSIS • FABRICATION CORPORATE HEADQUARTERS WAKEFIELD THERMAL SOLUTIONS INC. 33 Bridge Street Pelham, NH 03076 Tel: 603 635-2800 Fax: (603) 635-1900 www.wakefield.com SUBSIDIARIES:

Contextual Info: 901-910 SERIES CHIPSET HEAT SINKS PIN FIN & ELLIPTICAL HEAT SINKS Wakefield-Vette’s 901-910 Series Heat Sinks for Chipset can match up to devices from Intel, Broadcom, Xilinx. TI, Motorola and many more! These heat sinks are designed for air flow applications. Enclosed pages

T405R

Abstract: Bergquist BP-108 T410R Chomerics* T405 658-35AB T405 T410 T411 T412 i960CF
Contextual Info: WTS001_p1-25 6/14/07 10:53 AM Page 2 Thermal Management Solutions for BGAs BGA THERMAL SOLUTIONS MATRIX The following table represents Wakefield’s recommendations for a variety of standard BGA sizes. However, this is by no means a complete list of components that can be used with these heat sinks. To determine suitability for your particular component, request a BGA heat sink

LTN20069

Abstract: Wakefield Engineering LTN20069 a3911 T411
Contextual Info: I 2 REVISIONS tt£_ REV DESCRIPTION 391 1 3916 B RELEASED DATE 3/12/02 3/14/02 PER EC REVISED PER EC B APPROVED DB DB - .0 5 9 7 PL (.0 3 0 )8 PL B r (.0 6 0 ) .35 0 f 12^ |q |. ooT W ¡ ñ (.6 5 3 ) NOTES: 1. QÖÖD INDICATES A KEY PRODUCT WAKEFIELD 1 6 4 5 7 HEATSINK

transistor SMD p05

Abstract: 1981-R TRANSISTOR SMD 2X y 127 D TRANSISTOR 476 16q CP QUICK CONNECT L-398 LDA100 LDA101 LDA110
Contextual Info: I Solid State Current Sensors f H • I Engineering Specifications LDA100 LDA110 LDA101 LDA111 s l LDA200 LDA201 LDA210 LDA211 Output Characteristics Collector Current mA Typical Capacitance (pF) (Ve.= 1 0 V ;f = 1MHz) Collector Dark Current (nA) (Ve. = SV; lF= 0mA)

Contextual Info: I Solid State Current Sensors f H • I Engineering Specifications LDA100 LDA110 LDA101 LDA111 s l LDA200 LDA201 LDA210 LDA211 Output Characteristics Collector Current mA Typical Capacitance (pF) (Ve.= 1 0 V ;f = 1MHz) Collector Dark Current (nA) (Ve. = SV; lF= 0mA)

PC CLARE OFB 1202

Abstract: CP Clare RELAY OFB 2402 CP Clare RELAY, 1.5 amp, 2402 TL 7493 476 16q CP QUICK CONNECT T200 SSP15 J370 cp clare ofb 2402
Contextual Info: OptoFILM Solid State Switches O F * Engineering S pecifications 1202 O F (*) 2402 O F (') 1205D O F (*) 2405D O F (*) 1205-(X) O F (*) 2405-(X) O F (*) 1210-(X) O F (*) 2410-(X) O utput C haracteristics 400 500 400 500 400 500 400 500 1.5/120 1.5/240 3/120