WAFER LEVEL PACKAGE Search Results

Contextual Info: Wafer and Die Information Sheet Memory and Wireless / RF Products Features Level 1 • Async SRAMs, dual ports, FIFOs, micropower SRAMs, PROMs, sync SRAMs wafer and die, WirelessUSB LP wafer ■ Wafer ❐ Standard wafer 25 to 30 mil thick ❐ Background wafer to 14 mil thick

Contextual Info: Wafer and Die Information Sheet Memory and Wireless / RF Products Features Level 2 • Async SRAMs, dual ports, FIFOs, micropower SRAMs, PROMs, sync SRAMs wafer and die, WirelessUSB LP wafer ■ Wafer ❐ Standard wafer 25 to 30 mil thick ❐ Background wafer to 14 mil thick

Contextual Info: AN-617 Application Note One Technology Way • P.O. Box 9106 • Norwood, MA 02062-9106, U.S.A. • Tel: 781.329.4700 • Fax: 781.461.3113 • www.analog.com Wafer Level Chip Scale Package by the Wafer Level Package Development Team GENERAL DESCRIPTION PURPOSE

IPC-6012

Abstract: IPC-D-279 IPC-6013 IPC-6016 IPC-2223 ipc 7094 IPC-7094 IPC-2226 IPC-6011 IPC-7525
Contextual Info: Maxim > App Notes > General Engineering Topics Prototyping and PC- Board Layout Wireless and RF Keywords: chip scale package, flip chip, CSP, UCSP, U- CSP, BGA, WLCSP May 01, 2008 APPLICATION NOTE 1891 Wafer-level packaging WLP and its applications Abstract: This application note discusses Maxim's wafer-level package (WLP). Topics include: wafer construction, tape-and-reel

Contextual Info: VMMK-2203 0.9-11 GHz E-pHEMT Wideband Amplifier in Wafer Level Package Data Sheet Description Features Avago Technologies has combined its industry leading E-pHEMT technology with a revolutionary wafer level package WLP . • 1 x 0.5 mm Surface Mount Package

ASME-14

Abstract: MO-211 ISL59116 ISL59117
Contextual Info: Plastic Packages for Integrated Circuits Wafer Level Chip Scale Package WLCSP W3x3.9A 3x3 ARRAY 9 BALL WAFER LEVEL CHIP SCALE PACKAGE (For ISL59116, ISL59117 Only) E SYMBOL MILLIMETERS NOTES A 0.62 +0.05 -0.08 - A1 0.24 ±0.025 - A2 0.38 REF. - b 0.32 ±0.03

201676B

Contextual Info: APPLICATION NOTE Wafer Level Chip Scale Packages: SMT Process Guidelines and Handling Considerations Introduction The Skyworks Wafer Level Chip Scale Package WLCSP is a bumped die solution that can be used for in-module and/or standalone applications. WLCSP packaging technology is applied

Contextual Info: VMMK-2203 0.9-11 GHz E-pHEMT Wideband Amplifier in Wafer Level Package Data Sheet Description Features Avago Technologies has combined its industry leading E-pHEMT technology with a revolutionary wafer level package WLP . • 1 x 0.5 mm Surface Mount Package

Contextual Info: VMMK-2203 0.9-11 GHz E-pHEMT Wideband Amplifier in Wafer Level Package Data Sheet Description Features Avago Technologies has combined its industry leading E-pHEMT technology with a revolutionary wafer level package WLP . • 1 x 0.5 mm Surface Mount Package

34992

Contextual Info: VMMK-2203 0.9-11 GHz E-pHEMT Wideband Amplifier in Wafer Level Package Data Sheet Description Features Avago Technologies has combined its industry leading E-pHEMT technology with a revolutionary wafer level package WLP . • 1 x 0.5 mm Surface Mount Package

WLP0402

Abstract: VMMK-2203 34992 VMMK2203 A004R VMMK-2203-BLKG
Contextual Info: VMMK-2203 0.9-11 GHz E-pHEMT Wideband Amplifier in Wafer Level Package Data Sheet Description Features Avago Technologies has combined its industry leading E-pHEMT technology with a revolutionary wafer level package WLP . • 1 x 0.5 mm Surface Mount Package

A2 diode

Abstract: sd 9c 020E10
Contextual Info: Plastic Packages for Integrated Circuits Wafer Level Chip Scale Package WLCSP 0.4mm Ball Pitch W3x3.9C 3x3 ARRAY 9 BALL WAFER LEVEL CHIP SCALE PACKAGE E D PIN 1 INDEX AREA TOP VIEW SYMBOL MILLIMETERS A 0.445 Min, 0.495 Nom, 0.545 Max A1 0.190 ±0.025 A2

SAC1205

Abstract: IPC-A-600G IPC-6012 WLCSP stencil design JESD-B111 AN3846 sac105 IPC 6012 WLCSP smt IPC-6016
Contextual Info: Freescale Semiconductor Application Note AN3846 Rev. 2.0, 8/2009 Wafer Level Chip Scale Package WLCSP 1 Purpose The purpose of this Application Note is to outline the basic guidelines to use the Wafer Level Chip Scale Package (WLCSP) to ensure consistent Printed Circuit Board (PCB)

ed12

Contextual Info: Plastic Packages for Integrated Circuits Wafer Level Chip Scale Package WLCSP 0.4mm Ball Pitch W2x2.4 2x2 ARRAY 4 BALL WAFER LEVEL CHIP SCALE PACKAGE D E PIN 1 TOP VIEW SYMBOL MILLIMETERS A 0.44 Min, 0.495 Nom, 0.55 Max A1 0.190 ±0.030 A2 0.305 ±0.025

Contextual Info: Plastic Packages for Integrated Circuits Wafer Level Chip Scale Package WLCSP W3x2.6C 3x2 ARRAY 6 BALL WAFER LEVEL CHIP SCALE PACKAGE E D PIN 1 ID TOP VIEW A2 A A1 SYMBOL MILLIMETERS A 0.51 Min, 0.55 Max A1 0.225 ±0.015 A2 0.305 ±0.013 b Φ0.323 ±0.025

Contextual Info: Plastic Packages for Integrated Circuits Wafer Level Chip Scale Package WLCSP 0.4mm Ball Pitch W3x4.12 3x4 ARRAY 12 BALL WAFER LEVEL CHIP SCALE PACKAGE D SYMBOL MILLIMETERS A 0.445 Min 0.495 Nom 0.545 Max A1 0.190 ±0.025 A2 0.305 ±0.025 E PIN 1 ID TOP VIEW

MO-211-C

Abstract: ASME-14 WLCSP
Contextual Info: Plastic Packages for Integrated Circuits Wafer Level Chip Scale Package WLCSP W3x3.9B 3x3 ARRAY 9 BALL WAFER LEVEL CHIP SCALE PACKAGE (Intersil Standard) E SYMBOL MILLIMETERS NOTES A 0.54 Min, 0.65 Max - PIN A1 ID AREA D TOP VIEW bb A2 A A1 b A1 0.24 ±0.03

ASME-14

Contextual Info: Plastic Packages for Integrated Circuits Wafer Level Chip Scale Package WLCSP W4x3.10A 4X3 ARRAY 10 BALL WAFER LEVEL CHIP SCALE PACKAGE E PIN 1 ID SYMBOL MILLIMETERS NOTES A 0.64 +0.05 -0.10 - A1 0.29 ±0.02 - D TOP VIEW bb A2 A A1 b A2 0.35 REF. - b θ 0.37 ±0.03

Contextual Info: LSI403WLP Digital Signal Processor Wafer Level Package FEATURES OVERVIEW The LSI403WLP is an extremely low power 16-bit fixed-point digital signal processor DSP based on the LSI Logic ZSP400 DSP core, running less than 250µW per DSP MIPS (MMAC). The device is packed at a wafer level to create

Contextual Info: VMMK-2303 0.5 to 6 GHz 1.8 V E-pHEMT Shutdown LNA in Wafer Level Package Data Sheet Description Features Avago’s VMMK-2303 is an easy-to-use GaAs MMIC amplifier that offers excellent noise figure and flat gain from 0.5 to 6 GHz in a miniaturized wafer level package WLP . It

vmmk-2303

Abstract: VMMK2303 280q WLP0402 74640
Contextual Info: VMMK-2303 0.5 to 6 GHz 1.8 V E-pHEMT Shutdown LNA in Wafer Level Package Data Sheet Description Features Avago’s VMMK-2303 is an easy-to-use GaAs MMIC amplifier that offers excellent noise figure and flat gain from 0.5 to 6 GHz in a miniaturized wafer level package WLP . It

Contextual Info: VMMK-2103 0.5 to 6 GHz Bypass E-pHEMT LNA in Wafer Level Package Data Sheet Description Features Avago’s VMMK-2103 is an easy-to-use GaAs MMIC bypass LNA that offers good noise figure and flat gain from 0.5 to 6 GHz in a miniaturized wafer-level package WLP . The

AN-5378

Abstract: 5-6GHz LNA 132-079
Contextual Info: VMMK-2103 0.5 to 6 GHz Bypass E-pHEMT LNA in Wafer Level Package Data Sheet Description Features Avago’s VMMK-2103 is an easy-to-use GaAs MMIC bypass LNA that offers good noise figure and flat gain from 0.5 to 6 GHz in a miniaturized wafer-level package WLP . The

AN-5378

Contextual Info: VMMK-2103 0.5 to 6 GHz Bypass E-pHEMT LNA in Wafer Level Package Data Sheet Description Features Avago’s VMMK-2103 is an easy-to-use GaAs MMIC bypass LNA that offers good noise figure and flat gain from 0.5 to 6 GHz in a miniaturized wafer-level package WLP . The