WAFER FAB CONTROL Search Results

TGC3000

Abstract: wafer fab control plan ASIC TGC2000 Qual wafer fab control TEXAS INSTRUMENTS, die attach TGB2000 F642790
Contextual Info: ASIC QRA / PROCESS & PACKAGE QUAL METHODOLOGY Design Libraries Specs Qual Cycle Time “GENERIC” QUALIFICATION Die Sizes Package Pincounts & Types Assembly Locations Wafer Fab Locations Wafer Fab Processes Texas Instruments - ASIC CQE Qual By Similarity

CARSEM

Abstract: 225E-01 0.5um ICC03290 MP8000C 84-1-lmis-r4 tsmc cmos model tsmc Activation Energy HRS100
Contextual Info: Reliability Engineering Tucson Corporation Analytical Services Qualification Description: Qualify new model. Model: RA: PA: Date: Die Name: Die Size: Mask Revision: Wafer Fab Site: Process: Technology: Metal 1: Metal 2: Metal 3: Passivation: HTOL assem/wafer/lot :

triac phase control motor

Abstract: versatile power supply applications U211B triac control pir sensor 3-phase motor triac DC permanent magnet motors Phase Control Circuit for Industrial Applications zero crossing switch Industrial DC Motor U211B
Contextual Info: TEMIC Semiconductors Industrial Segment Battery Charge Phase Control Identification Zero Crossing Switches Industrial S More than 15 years of industrial expertise S State-of-the-art wafer fab and packaging facilities S Rugged 30 V and high-density 16 V technology

toshiba mcp nand

Abstract: toshiba mcp GBNAND 2Gb NAND FLASH Toshiba MEP core MCP Technology Trend toshiba psram MCP 1Gb toshiba 512Mb TOSHIBA flash memory -NAND sd controller
Contextual Info: EYE 07 July 2006 TOSHIBA SEMICONDUCTOR BULLETIN EYE VOLUME 168 CONTENTS INFORMATION Kaga Toshiba to Build New 200mm Wafer-based Production Fab 2 Toshiba and ARC Collaborate to Grow Industry Adoption of Configurable Processor Technology Worldwide .3

MS-6G

Abstract: ms-7g sa5522 SUMITOMO g600f W83303D w99682bcdg W55U01-A2 ms 6g w89c35d g600f
Contextual Info: PCN No.: Z200-PCN-PA20070101 Date: Jan.-10-2007. Change Title: Upgrade molding compound for LQFP Family series at Greatek. Change Classification: Major Minor Change item: Design Raw Material Wafer FAB Package Assembly Testing Others: . Affected Product s :

404-011

Abstract: dmb2856 404002
Contextual Info: Silicon Beam-Lead and Chip EHAlpha Schottky Barrier Mixer Diodes DMB, DME, DMF and DMJ Series Features • Ideal for MIC ■ Low 1/f Noise ■ Low Intermodulation Distortion ■ Low Turn On ■ Hermetically Sealed Packages ■ SPC Controlled Wafer Fab Description

Zener Diode SOT-23 929b

Abstract: 13.8 8w zener diode zener diode t5 MMSZ4V7T1 MOTOROLA 929B 953b X2 diode zener zener diode T3 Marking diodes zener de 3.5 volts 938B
Contextual Info: MOTOROLA SEMICONDUCTOR TECHNICAL DATA GENERAL DATA 225 mW SOT-23 Zener Voltage Regulator Diodes 225 mW SOT-23 GENERAL DATA APPLICABLE TO ALL SERIES IN THIS GROUP Zener Voltage Regulator Diodes 3 Cathode Manufacturing Locations: 1 Anode WAFER FAB: Phoenix, Arizona

SOT-23 marking 77

Abstract: SOT-23 marking Z1 zener y21 zener y11 BZX84C2V4LT1 BZX84C2V7LT1 BZX84C3V0LT1 BZX84C3V3LT1 BZX84C30LT1 motorola BZX84C3V9LT1
Contextual Info: MOTOROLA SEMICONDUCTOR TECHNICAL DATA BZX84C2V4LT1 SERIES 225 mW SOT-23 Zener Voltage Regulator Diodes 225 mW SOT-23 GENERAL DATA APPLICABLE TO ALL SERIES IN THIS GROUP Zener Voltage Regulator Diodes 3 Cathode Manufacturing Locations: 1 Anode WAFER FAB: Phoenix, Arizona

8C SOT-23

Abstract: sot23 zener MMBZ5222BLT1 81J SOT23 8F sot23
Contextual Info: MOTOROLA SEMICONDUCTOR TECHNICAL DATA MMBZ5221BLT1 SERIES 225 mW SOT-23 Zener Voltage Regulator Diodes 225 mW SOT-23 GENERAL DATA APPLICABLE TO ALL SERIES IN THIS GROUP Zener Voltage Regulator Diodes 3 Cathode Manufacturing Locations: 1 Anode WAFER FAB: Phoenix, Arizona

MARKING ZE SOT-23

Abstract: LTA 703 S marking ar sot-23 212 s sot-23 Y1 SOT-23 TVS marking LZ ON
Contextual Info: MOTOROLA SEMICONDUCTOR TECHNICAL DATA BZX84C2V4LT1 SERIES 225 mW SOT-23 Zener Voltage Regulator Diodes 225 mW SOT-23 GENERAL DATA APPLICABLE TO ALL SERIES IN THIS GROUP Zener Voltage Regulator Diodes u Manufacturing Locations: 3 1 Cathode Anode WAFER FAB: Phoenix, Arizona

320F2812PGFA

Abstract: tms dsp 320F2812PGFA 320f2811pbka 320F2810PBKA TI TMS F2812 ti part naming convention TMS320F281x TMS320F2812 CC BGA 320F2811PBKQ 1833c05
Contextual Info: 12500 TI Boulevard, MS 8640, Dallas, Texas 75243 PCN# 20040226002 Title: TMS320F281X Digital Controller Additional Wafer Fab and Silicon Revision Change Final Change Notification / Sample Request Dear Customer: This is an initial announcement of change to a device that is currently offered by Texas Instruments. The

resistor 1k

Abstract: 30X30
Contextual Info: Submicron Fab: 71 Vista Montana • San Jose, CA 95134 TEL: 408 222-8888 • FAX: (408) 222-2707 Wafer Foundry Services 1.2µm CMOS Process Standard Features ❖ ❖ ❖ ❖ ❖ Standard Layout Rules and Process Parameters UT1X Stepper Single or double poly

29CD016

Abstract: JV3 diode S29CL-J spansion S29CD016J S29CD032J S29CD-J S29CL016J S29CL032J S29CL032
Contextual Info: S29CD-J & S29CL-J Ordering Information Supplement Supplement 1. Preface This document includes the details on how to order the following products affected from a specific wafer fab and assembly locations using the 18th character field in the Spansion Ordering Part Number OPN .

Contextual Info: Dicing Improvements: Yield Enhancement, Throughput Increase and Die Size Reduction in M/A-COM’s GaAs Fab Robert Fox M/A-COM : Tyco Electronics, 100 Chelmsford Street, Lowell, MA 01851 USA phone: 978-656-2523, email: foxr@tycoelectronics.com ABSTRACT A strong wafer dicing operation is vital to the

max17428

Abstract: MAX17401
Contextual Info:  MAX8796, MAX8797, MAX17401 1-Phase, Quick-PWM Intel IMVP-6/GMCH Controllers 1-Phase, Intel IMVP-6/6+ Controllers Ideal for Atom CPU and UMPC Designs Overview Technical Documents Ordering Info Related Products User Comments 0

Sample form for INCOMING Inspection of RAW MATERIAL

Abstract: INCOMING RAW MATERIAL INSPECTION procedure INCOMING RAW MATERIAL INSPECTION INCOMING RAW MATERIAL INSPECTION form INCOMING RAW MATERIAL INSPECTION method Temic PART DATE CODE INCOMING IC INSPECTION MHS IC INCOMING RAW MATERIAL INSPECTION chart INCOMING IC INSPECTION,
Contextual Info: Quality Flows Digital IC Products Quality Flows This document presents the flows used in manufacturing and screening of TEMIC Digital IC Processors, Memories, ASICs and ASSPs . Process Control As shown in the following tables, each device is constructed by manufacturing processes which are under

wafer fab control plan

Abstract: SPC3 SPC2 LINEAR TECHNOLOGY flowchart
Contextual Info: STATISTICAL PROCESS CONTROL STATISTICAL PROCESS CONTROL Linear Technology Corporation LTC has an active Statistical Process Control (SPC) system. It operates via the interrelated mechanisms of: a structure, control charts with built-in contingency action plans, operational area

CY7C63723

Abstract: 1120008 MIL-STD-883 Method 3015.7 sumitomo eme 1100
Contextual Info: Cypress Semiconductor Product Qualification Report QTP# 001406 VERSION 1.0 November, 2000 enCoRe  USB Family P26TLM Technology, Fab 2-CTI Low Speed USB Peripheral CY7C63221/CY7C63231 Controller CY7C63722/CY7C63723 Combination Low Speed USB CY7C63742/CY7C63743 & PS/2 Peripheral Controller

statistical process control

Abstract: wafer fab control plan pareto process control system spc data sheet SPC Technology TIONA wafer fab control SPC-2 SPC-3
Contextual Info: STATISTICAL PROCESS CONTROL STATISTICAL PROCESS CONTROL Linear Technology Corporation LTC has an active Statistical Process Control (SPC) system. It operates via the interrelated mechanisms of: a structure, control charts with built-in contingency action plans, operational area

M38510 10102BCA

Abstract: SCX6206 marking code E5 SMD ic jm38510/10101bga SCX6B48AIS SNJ54LS165J JM38510/30004bca JM38510/10102BCA JM38510/10102BIA 946DMQB
Contextual Info: N ENHANCED SOLUTIONS DESIGN/PROCESS CHANGE NOTIFICATION formerly Military & Aerospace Division PCN Nr: 2000 Listing GIDEP Nr: GIDEP Category: Issued: 01/24/2000 TRB Nr: Product ID (Description): Proposed Date of Change: Description of Change: Effect of Change:

ph 4148 zener diode

Abstract: philips zener diode ph 4148 pcf0700p Zener Diode ph 4148 PCA1318P ck2605 pcf0700p/051 philips Pca1318p on4673 Zener Diode 4148
Contextual Info: PHILIPS SEMICONDUCTORS PRODUCT DISCONTINUATION NOTICE NUMBER DN-40 DATED DECEMBER 31, 1998 EXHIBIT 'A' PHILIPS PHILIPS PHILIPS PART NUMBER PKG PART DESCRIPTION LAST TIME LAST TIME REPLACEMENT STATUS 12 NC NUMBER BUY DATE DLVY DATE PART CODE S COMMENTS DISCONTINUED INTEGRATED CIRCUIT PRODUCTS

54ACT3301

Abstract: 54ACT3301 die national semiconductor 54ls123j JM38510/30002BCA M38510/10304 5962R8773901VCA 01001BEA DM54LS244J/883 dm54ls74j 54154J
Contextual Info: ENHANCED SOLUTIONS DESIGN/PROCESS CHANGE NOTIFICATION formerly Military & Aerospace Division PCN Nr: 2001 Listing
 
   Issued: 01/09/2001   Product ID (Description): Proposed Date of Change: Description of Change: Effect of Change:

LM723 pin details

Abstract: LM723 application notes LM723 application note M38510-10104 lm723 54L73 DS26LV31 54L04 application lm723 945DM
Contextual Info: ENHANCED SOLUTIONS DESIGN/PROCESS CHANGE NOTIFICATION formerly Military & Aerospace Division PCN Nr: 2002 Listing GIDEP Nr: GIDEP Category: Issued: 01/09/2002 TRB Nr: Product ID (Description): Proposed Date of Change: Description of Change: Effect of Change:

Evaluating pHEMT Process Improvements Using Wafer Level RF Tests

Contextual Info: Evaluating pHEMT Process Improvements Using Wafer Level RF Tests James Oerth, Stephen Cousineau, and Sushila Singh Skyworks Solutions, Inc 20 Sylvan Road, Woburn, MA, 01801, USA Tel: 781 376-3076, Email: jim.oerth@skyworksinc.com Keywords: RF test, pHEMT, process improvement, harmonics, IMD