WAFER CONNECTOR Search Results

YY11CT

Abstract: YY5CT wire to wire YY12CT Wafer Connector YY4Nxx YY10CT yy5cxx YY9CT
Contextual Info: Housing / Terminal & Wafer YY4Nxx Lock Wafer YY4Rxx Lock Wafer Right Angle YY5Cxx Housing (PINS 2-20) (PINS 2-20) (PINS 2-20) Y4 Y5 3.96mm YY6Nxx Wafer YY6Rxx Wafer (Right Angle) YY5CT Terminal (PINS 2-20) (PINS 2-20) (6K/ROLL) Y5 Y6 3.96mm YY7CRxx Housing

0 shape header with square pins

Abstract: MFAS156 mfss156 CT156F CE156F
Contextual Info: MAS-CON* IDC Connectors A23 l-Y ¿¿>105-09 .156" £ Molded Wafer Flat Headers Performance Data MATERIALS Wafer: Pin: Plating: PANDUIT’S .156" centerline molded wafer flat header is available in straight or right angle post versions in circuit sizes 2 through

Cascade Microtech

Contextual Info: High-stable HF wafer contact ideal for automated wafer testing Z Probe High-Frequency Wafer Probe GS/SG 10 GHz A Ground-Signal (GS) coniguration is the most cost-effective RF design as less wafer space is taken up with contact pads. Cascade Microtech’s |Z| Probe in a GS/SG coniguration enables wafer-level testing with the highest accuracy and throughput available while

panduit 5 pin idc

Abstract: MPSS156 MPSS156-18 CE156F
Contextual Info: MAS-CON* IDC Connectors A27 .156" £ Molded Wafer Polarizing Headers Performance Data 111 MATERIALS Wafer: Pin: Plating: PANDUIT'S .156" centerline polarizing wafer is designed to pre­ vent 180° mismating between a header and connector, eliminat­ ing potential damage to PCB circuitry. Panduit’s headers are

IC weight sensor

Abstract: chloride ups circuit diagram relay 24v omron two leg infrared receiver led 12V ENERGY LIGHT CIRCUIT DIAGRAM EE-SPX303 hydrocarbon sensor hydrogen gas sensor omron plc Pulsating photoelectric Optical Sensor datasheet
Contextual Info: Wafer-carrier Mounting Photomicrosensors EE-SPY801/802 Photomicrosensors for detecting wafer-carrier mounting. • The mounting position is set with a pedestal. ■ The contact surface with the wafer carrier uses a special chemical-resistant fluoro-resin.

UN-D1400

Abstract: WLCSP stencil design AN10439 EIA541 IEC60286 WLCSP chip mount Service Manual smd rework station Wafer Level Chip Size Package und14
Contextual Info: AN10439 Wafer Level Chip Size Package Rev. 03 — 17 October 2007 Application note Document information Info Content Keywords wafer, level, chip-scale, chip-size, package, WLCSP Abstract This application note provides guidelines for the use of Wafer Level Chip

Contextual Info: R Silicon Wafer Mapping Sensor F3M-S825-1 Allows Simultaneous Mapping of Up to 25 Silicon Wafers H Economical—one sensor detects most wafer types H 200 mm wafer size H Automatic and remote teaching capability H Self-diagnostic functions reduce downtime Ordering Information

Contextual Info: R Silicon Wafer Mapping Sensor F3M-S Allows Simultaneous Mapping of up to 25 Silicon Wafers H Economical, one sensor detects most wafer types, including dummy wafers H Models match wafer sizes of 300 mm, 200 mm and 150 mm H Automatic and remote teaching capability

750197213

Contextual Info: HS Dock Receptacle Wafer Extractor Tool HS Dock™ Wafer Extraction Tool Application Tooling Specification Sheet Order No. 62202-3400 FEATURES This tool is designed for the removal of the wafer sub-assembly from a Right Angle HS Dock™ Receptacle connector assembly. To remove wafers from a plug assembly, use tool 62202-0220, 62202-0260, 622020280, or 62202-0290.

OCI 531

Abstract: m1b marking s1225 IEC60529 F3M-S1213 F3M-S1225
Contextual Info: R Silicon Wafer Mapping Sensor F3M-S Allows Simultaneous Mapping of up to 25 Silicon Wafers H Economical, one sensor detects most wafer types, including dummy wafers H Models match wafer sizes of 300 mm, 200 mm and 150 mm H Automatic and remote teaching capability

LSS156

Contextual Info: _ MAS-CON*1DC Connectors A25 .156" £ M olded Wafer Locking Headers Performance Data M ATERIALS Wafer: Pin: Plating: PANDUIT’S .156" centerline locking header has a locking backwall that friction latches its mating connector to prevent an open

15001LR

Abstract: 20022WS 20022WS-02A00 20022WS-03A00 20022WS-04A00 20022WS-05A00 20022WS-06A00 20022WS-07A00 20022WS-08A00 FFC 0.8mm
Contextual Info: 2.00mm 0.079" PITCH CONNECTOR Material 20022WS Series Wire-to-Board Wafer I/NO 1 2 3 SMT Straight DESCRIPTION WAFER PIN HOOK Available Pin PARTS NO. 20022WS-02A00 20022WS-03A00 20022WS-04A00 20022WS-05A00 20022WS-06A00 20022WS-07A00 20022WS-08A00 20022WS-09A00

20010WR05

Abstract: 20010WR 20010WR-02000 20010WR-03000 20010WR-04000 pa66 45
Contextual Info: 2.00mm 0.079" PITCH CONNECTOR DIP type Material 20010WR Series Wire-to-Board Wafer DIP I/NO DESCRIPTION 1 WAFER 2 PIN TITLE 2001OWR MATERIAL PA66, UL94V Grade BRASS & Tin Plated Right Angle Available Pin PARTS NO. 20010WR-02000 5.6 4.5 2.0 20010WR-03000

35001HS

Abstract: 35002WR 35002WR-02A00 PA46
Contextual Info: 3.50mm 0.138" PITCH CONNECTOR DIP type Material 35002WR Series Wire-to-Board Wafer DIP I/NO DESCRIPTION 1 WAFER 35002WR PA46 or PA6T.UL94V Grade PIN 35002PR Phosphor Bronze & Tin plated HOOK 35002LR Brass & Tin-Plated 2 3 Right Angle TITLE MATERIAL Available Pin

MIL-STD-202f Method 106e

Contextual Info: LANGUAGE PRODUCT SPECIFICATION ENGLISH 8624 Dual Row Wafer Header .025 Sq. Pins on .100 Grid w/Break Off Option 1.0 SCOPE: This specification covers a dual row wafer (header) system on .100 grid. The wafer (header) body has a low profile, and the system is designed for printed circuit board mounting. The pins are .025(.064mm)

MLAS156

Abstract: CT156F MLSs156 MLSS156-20-O CE156F MLSS156-22 MLSS156-2 MLAS156-14-D MLSS156-11 MLSS156-13-D
Contextual Info: MAS-CON \DC Connectors A25 A-¿>/'05-C5 3 .156" <£ Molded Wafer Locking Headers Performance Data MATERIALS Wafer: Pin: Plating: PANDUIT’S .156" centerline locking header has a locking backwall that friction latches its mating connector to prevent an open

20015LR

Abstract: 40006WR-02A00 40006WR
Contextual Info: SMT 4.00mm 0.157" PITCH CONNECTOR type Material Wire-to-Board Wafer 40006WR Series l/NO DESCRIPTION 1 WAFER SMT 2 PIN Right Angle 3 HOOK TITLE MATERIAL 40006WR PPS.UL94V Grade 20015LR Brass & Tin-Plated Brass & Tin-Plated Available Pin PARTS NO. 40006WR-02A00

YDAW200-16

Abstract: YDAW200 YDAW200-24 YDAW200-22 YDAW200-04 YDAW200-06 YDAW200-08 YDAW200-10 YDAW200-12 YDAW200-14
Contextual Info: DIP 2.00mm 0.079" PITCH CONNECTOR Wire-to-Board Wafer YDAW200 Series type Material DIP Right Angle I/NO DESCRIPTION 1 2 WAFER PIN TITLE YDAW200 MATERIAL PA66, UL 94V Grade Brass & Tin-Plated Available Pin PARTS NO. YDAW200-04 YDAW200-06 YDAW200-08 YDAW200-10

YBD254B

Abstract: YBD254B-52E YBD254B-NNE
Contextual Info: DIP 2.54mm 0.100" PITCH CONNECTOR Board-to-Board Wafer YBD254B-NNE Series typ Material DIP Right Angle l/NO DESCRIPTION 1 2 WAFER PIN TITLE MATERIAL PBT, UL94V Grade YBD254B-52E Brass & Gold-Plated Available Pin PARTS NO. YBD254B -10E YBD254B -12E YBD254B -14E

PA66 GF 25

Abstract: pa66 fr YFW800-04BL YFW800-NNBL
Contextual Info: 8.00m m type 0.315" PITCH CONNECTOR YFW800-NNBL Series Wire-to-Board Wafer DIP Material DIP I/NO DESCRIPTION 1 WAFER 2 PIN TITLE MATERIAL PA66, UL94V Grade YFW800-NNBL Brass &Tin-Plated Straight Available Pin PARTS NO. DIM. A YFW800-04BL 34.0 I Specification

Contextual Info: _ MAS-CON* IDC Connectors A23 .156" £ Molded Wafer Flat Headers Performance Data MATERIALS Wafer: Polyester, U.L. 94 V-0 Rated Pin: Copper Alloy Plating: 2 0 0 /" Tin Over Nickel 3 0 /" Gold Over Nickel (Contact factory 15(jl" Gold Over Nickel (Contact factory)

SMAW250-03g

Abstract: SMAW250-02G SMAW250-04G SMAW250-NNG SMAW250-05G SMAW250-07G SMAW250-11G SMAW250-NN PA66 GF 25 connector 064c
Contextual Info: 2.50mm 0.098" PITCH CONNECTOR Material SMAW250G Series Wire-to-Board Wafer I/NO 1 2 DIP DESCRIPTION TITLE MATERIAL PA66, UL94 V Grade WAFER SMAW250-NNG Brass & Tin-Plated PIN Right Angle Available Pin PARTS NO. SMAW250-02G SMAW250-03G SMAW250-04G SMAW250-05G

E108706

Abstract: SMAW250-08V SMAW250 SMAW250-22V SMAW250-NNV SMAW250-NN
Contextual Info: 2.50mm 0.098" PITCH CONNECTOR Material Wire-to-Board Wafer SMAW250-NNV Series DIP I/NO DESCRIPTION 1 WAFER 2 PIN TITLE MATERIAL PA66, UL94V Grade SMAW250 - NN V Brass & Tin-Plated Right Angle Available Pin A B C SMAW250 - 04V 7.45 5.8 2.50 SMAW250 - 06V

wafer connector 1.25

Abstract: 12507WR-02LD 12507WR-03LD 12507WR-04LD 12507WR-05LD 12507WR-06LD 12507WR-07LD 12507WR-08LD 12507WR-NNLD 20032LR
Contextual Info: 1.25mm 0.049" PITCH CONNECTOR Material 12507WR-NNLD Series Wire-to-Board Wafer I/NO DESCRIPTION TITLE MATERIAL 1 WAFER 12507WR-NNLD PA46 or PA6T, UL 94V Grade 2 Brass & Tin plated PIN 3 Brass & Tin plated HOOK 20032LR DIP Right Angle Available Pin PARTS NO.