W0011 Search Results

Contextual Info: 66AK2E05, 66AK2E02 SPRS865B—June 2013—Revised January 2014 Multicore DSP+ARM KeyStone II System-on-Chip SoC 1 66AK2E05/02 Features and Description • ARM Cortex -A15 MPCore™ CorePac – Up to Four ARM Cortex-A15 Processor Cores at up to 1.4-GHz

Contextual Info: AM5K2E04, AM5K2E02 SPRS864B—June 2013—Revised January 2014 Multicore ARM KeyStone II System-on-Chip SoC 1 AM5K2E04/02 Features and Description • ARM Cortex -A15 MPCore™ CorePac – Up to Four ARM Cortex-A15 Processor Cores at up to 1.4-GHz – 4MB L2 Cache Memory Shared by all Cortex-A15

Contextual Info: AM5K2E04, AM5K2E02 SPRS864B—June 2013—Revised January 2014 Multicore ARM KeyStone II System-on-Chip SoC 1 AM5K2E04/02 Features and Description • ARM Cortex -A15 MPCore™ CorePac – Up to Four ARM Cortex-A15 Processor Cores at up to 1.4-GHz – 4MB L2 Cache Memory Shared by all Cortex-A15

SPRS836D

Contextual Info: TCI6638K2K SPRS836D—February 2012—Revised October 2013 Multicore DSP+ARM KeyStone II System-on-Chip SoC 1 TCI6638K2K Features and Description 1.1 Features • Eight TMS320C66x DSP Core Subsystems (C66x CorePacs), Each With – 1.0 GHz or 1.2 GHz C66x Fixed/Floating-Point DSP Core

W0901

Abstract: W0914 W0915 W090E W0011 W000A w0006 CA850 ID850QB RX850
Contextual Info: お客様各位 カタログ等資料中の旧社名の扱いについて 2010 年 4 月 1 日を以って NEC エレクトロニクス株式会社及び株式会社ルネサステクノロジ が合併し両社の全ての事業が当社に承継されております。従いまして、本資料中には旧社

U18515EJ1V0UM00

Abstract: W0005 CA850 ID850QB RX850 SM850 W0901 ld850 W090D
Contextual Info: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid

60K6

Contextual Info: 66AK2H14/12/06 SPRS866E—November 2012—Revised November 2013 Multicore DSP+ARM KeyStone II System-on-Chip SoC Check for Evaluation Modules (EVM): EVMK2H 1 66AK2H14/12/06 Features and Description 1.1 Features • Eight (66AK2H14/12) or Four (66AK2H06) TMS320C66x

Contextual Info: 66AK2H14/12/06 SPRS866E—November 2012—Revised November 2013 Multicore DSP+ARM KeyStone II System-on-Chip SoC Check for Evaluation Modules (EVM): EVMK2H 1 66AK2H14/12/06 Features and Description 1.1 Features • Eight (66AK2H14/12) or Four (66AK2H06) TMS320C66x

Contextual Info: TCI6636K2H SPRS835F—February 2012—Revised October 2013 Multicore DSP+ARM KeyStone II System-on-Chip SoC 1 TCI6636K2H Features and Description 1.1 Features • Eight TMS320C66x DSP Core Subsystems (C66x CorePacs), Each With – 1.0 GHz or 1.2 GHz C66x Fixed/Floating-Point DSP Core

Contextual Info: TCI6630K2L SPRS893B—June 2013—Revised March 2014 Multicore DSP+ARM KeyStone II System-on-Chip SoC 1 TCI6630K2L Features and Description 1.1 Features • ARM CorePac – Two ARM Cortex -A15 MPCore™ Processors at Up To 1.4 GHz – 1MB L2 Cache Memory Shared by Two ARM Cores

MRF24XA

Abstract: PCB Antenna matching carrier frequency offset estimation
Contextual Info: MRF24XA Low-Power, 2.4 GHz ISM-Band IEEE 802.15.4 RF Transceiver with Extended Proprietary Features Features Low-Power • IEEE 802.15.4™-2003 and IEEE 802.15.4-2006 Standard Compliant RF transceiver • Multiple air data rates: - 250 kbps IEEE 802.15.4

I211

Abstract: transistor manual substitution sl 100 zilog 1648 intel 4040 Z380 W0005 w0006 Z180 Z893XX Z89C00
Contextual Info: Zilog Macro Cross Assembler User’s Manual UM003601-COR1299 1999 by ZiLOG, Inc. All rights reserved. Information in this publication concerning the devices, applications, or technology described is intended to suggest possible uses and may be superseded. ZiLOG, INC. DOES NOT ASSUME LIABILITY FOR OR PROVIDE A

w001-0411-00x-z

Contextual Info: P.C.B LAYOUT ELECTRICAL: CURRENT RATING: 1.0 AC/DC VOLTAGE RATING: AC 250V R.M.S. INSULATION RESISTANCE: 1000 MEGOHMS MIN. DIELECTRIC WITHSTANDING VOLTAGE: AC 500V (R.M.S) MATERIAL: INSULATOR: NYLON 66 (UL94V-2) CONTACT: COPPER ALLOY PLATING: 100u" MIN. TIN/LEAD OVER NICKEL ALL OVER

Contextual Info: 66AK2H12/06 SPRS866D—November 2012—Revised October 2013 Multicore DSP+ARM KeyStone II System-on-Chip SoC Check for Evaluation Modules (EVM): EVMK2H 1 66AK2H12/06 Features and Description 1.1 Features • Eight (66AK2H12) or Four (66AK2H06) TMS320C66x

Contextual Info: 66AK2H14/12/06 SPRS866E—November 2012—Revised November 2013 Multicore DSP+ARM KeyStone II System-on-Chip SoC Check for Evaluation Modules (EVM): EVMK2H 1 66AK2H14/12/06 Features and Description 1.1 Features • Eight (66AK2H14/12) or Four (66AK2H06) TMS320C66x

w001-0412-00x-z

Abstract: W0011
Contextual Info: ELECTRICAL: CURRENT RATING: 1.0 AC/DC VOLTAGE RATING: AC 250V R.M.S. INSULATION RESISTANCE: 1000 MEGOHMS MIN. DIELECTRIC WITHSTANDING VOLTAGE: AC 500V (R.M.S) MATERIAL: INSULATOR: NYLON 66 (UL94V-2) CONTACT: COPPER ALLOY PLATING: 100u" MIN. TIN/LEAD OVER NICKEL ALL OVER

Contextual Info: 66AK2E05, 66AK2E02 SPRS865B—June 2013—Revised January 2014 Multicore DSP+ARM KeyStone II System-on-Chip SoC 1 66AK2E05/02 Features and Description • ARM Cortex -A15 MPCore™ CorePac – Up to Four ARM Cortex-A15 Processor Cores at up to 1.4-GHz

Contextual Info: 66AK2H14/12/06 SPRS866E—November 2012—Revised November 2013 Multicore DSP+ARM KeyStone II System-on-Chip SoC Check for Evaluation Modules (EVM): EVMK2H 1 66AK2H14/12/06 Features and Description 1.1 Features • Eight (66AK2H14/12) or Four (66AK2H06) TMS320C66x

Contextual Info: 66AK2H14/12/06 SPRS866E—November 2012—Revised November 2013 Multicore DSP+ARM KeyStone II System-on-Chip SoC Check for Evaluation Modules (EVM): EVMK2H 1 66AK2H14/12/06 Features and Description 1.1 Features • Eight (66AK2H14/12) or Four (66AK2H06) TMS320C66x

HY5116100B

Abstract: 1AD41-00-MAY95 HY5116100
Contextual Info: ' • H Y U N D A H Y 5 1 1 6 1 0 0 B S e r ie s 16Mx 1-bit CMOS DRAM I DESCRIPTION The H Y 5116100B is the new generation and fast dynam ic R A M organized 16,777,216 x 1-bit. T h e H Y 5 1 1 6 1 0 0 B utilizes H yundai’s C M O S silicon gate process technology a s well a s advanced circuit techniques to provide w ide

automotive ecu manual

Abstract: mpc 2907 osek standard 05H12 HC12 MC68HC MC68HC16 A5S30 HC12D60
Contextual Info: User’s Manual Rev. 1.2 May 19, 1999 A G R E E M E N T OSEK Operating System N O N - D I S C L O S U R E HC12 R E Q U I R E D OSEK Operating System Rev. 1.2 N O N - D I S C L O S U R E A G R E E M E N T R E Q U I R E D User’s Manual Motorola reserves the right to make changes without further notice to

e0052

Abstract: zilog zds 3.68 z8 zilog F0009 E0053 E0094 E0078 w0006 E0000 zconvert
Contextual Info: ZILOG MACRO CROSS ASSEMBLER APPENDIX B UTILITIES DESCRIPTION ZFIXUP The ZFIXUP utility is a simple DOS-based program that does ‘address fixups’ on assembly language listing files generated by relocatable assemblers such as ZMASM. The normal listing file contains relative addresses base zero only, since the final execution address is not determined until