VTB8444 Search Results

Contextual Info: 5bE D BDBDbQ^ GGQ1G5M IVCT V T B 8 4 4 3 B , 8 4 4 4B VTB Process Photodiodes E 243 Q 8. G VACTEC T-41-51 PACKAGE DIMENSIONS inch mm CASE 21F PRODUCT DESCRIPTION P la n a r s ilic o n p h o to d io d e in a recessed ceramic package. The pack­ age incorporates an infrared rejection

photodiode ge

Abstract: VTB8443 VTB8444 photodiode 516
Contextual Info: SbE » m aDBGtOT D0010S2 470 VTB Process Photodiodes VCT V T B 8 4 4 3 , 8444 E G & G VACTE C T-41-51 PACKAGE DIMENSIONS inch mm CASE 21 8 mm CERAMIC CHIP ACTIVE AREA: .008 in2 (5.16 mm2) PRODUCT DESCRIPTION P la n a r s ilic o n p h o to d io d e in a recessed ceramic package. Chip is

VTB8443B

Abstract: 8444B VTB8444B
Contextual Info: SbE D B O B Ü b C H G Ü D I O S H 243 • VCT VTB Process Photodiodes VTB8443B, 8444B E G & G VACTEC T-41-51 PACKAGE DIMENSIONS inch mm CASE 21F 8 mm CERAMIC CHIP ACTIVE AREA: .008 in2 (5.16 mm2) PRODUCT DESCRIPTION P la n a r s ilic o n p h o to d io d e in a

Contextual Info: SLE D • 3Q30t.0S QQ 01 0 5E 470 H V C T V TB 8443, 8444 [vTB Process Photodiodes E G & G VACTEC T-41-51 PACKAGE DIMENSIONS inch mm CASE 21 PRODUCT DESCRIPTION P la n a r s ilico n photodiode in a recessed ceramic package. Chip is coated with a protective layer of epoxy.