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    V3320 Search Results

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    Rochester Electronics LLC CY7C1041BV33-20ZI

    IC SRAM 4MBIT PARALLEL 44TSOP II
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    DigiKey CY7C1041BV33-20ZI Bulk 10,920 23
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    onsemi NCV33204DR2G

    IC OPAMP GP 4 CIRCUIT 14SOIC
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    DigiKey () NCV33204DR2G Cut Tape 4,973 1
    • 1 $1.17
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    NCV33204DR2G Digi-Reel 4,973 1
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    NCV33204DR2G Tape & Reel 4,973 2,500
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    Mouser Electronics NCV33204DR2G 2,996
    • 1 $1.17
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    Newark () NCV33204DR2G Tape & Reel 942 100
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    NCV33204DR2G Cut Tape 942 1
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    Rochester Electronics NCV33204DR2G 51,295 1
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    TME NCV33204DR2G 1
    • 1 $1.05
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    ComSIT USA NCV33204DR2G 930
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    EBV Elektronik NCV33204DR2G 15 Weeks 2,500
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    Flip Electronics NCV33204DR2G 17,500
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    Master Electronics NCV33204DR2G
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    Win Source Electronics NCV33204DR2G 17,980
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    Rochester Electronics LLC CY7C1041BV33-20ZC

    IC SRAM 4MBIT PARALLEL 44TSOP II
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    DigiKey CY7C1041BV33-20ZC Bag 4,336 56
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    FLIP ELECTRONICS CY7C1370KV33-200AXI

    IC SRAM 18MBIT PARALLEL 100TQFP
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    DigiKey CY7C1370KV33-200AXI Tray 1,905 144
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    FLIP ELECTRONICS CY7C1380KV33-200AXC

    IC SRAM 18MBIT PARALLEL 100TQFP
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    DigiKey CY7C1380KV33-200AXC Tray 1,288 72
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    V3320 Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    Contextual Info: fax id: 2052 :/ CYPRESS C Y M 1 8 5 1 V 3 3 1,024K x 32 3.3V Static RAM Module Features • High-density 3.3V 32-m egabit SRAM module • 32-bit Standard Footprint supports densities from 16K x 32 through 1 M x 32 • High-speed SRAMs — Access time of 12 ns


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    32-bit 1851V33 72-pin 64-pin PDF

    Contextual Info: C YM 1841V33 256K x 32 3.3V Static RAM Module Features ule is con stru cted from tw o 2 5 6 K x 16 S R A M s in SO J p a cka g ­ es m ounted on an ep oxy lam inate substrate. Four C hip S elects are used to in de pen de ntly en ab le th e four bytes. Reading or


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    1841V33 64-pin 64-pin PDF

    v3320

    Contextual Info: fax id: 2050 CYM1841V33 :/ C Y P R E S S 256K x 32 3.3V Static RAM Module Features ule is constructed from two 256K x 16 SRAMs in SOJ packag­ es mounted on an epoxy laminate substrate. Four chip selects are used to independently enable the four bytes. Reading or


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    CYM1841V33 1841V33 64-pin CYM1821, CYM1831, CYM1836, CYM1841) v3320 PDF

    lsi3320

    Contextual Info: Lattice ispLSI3320 ; ; ; Semiconductor •■■Corporation Features High-Density Programmable Logic F u n ctio n a l B lo c k Diagram • HIGH-DENSITY PROGRAMMABLE LOGIC — 160 I/O Pins — 14000 PLD Gates — 480 Registers — High Speed Global Interconnect


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    ispLSI3320 212A/3320 3320-1OOLM 3320-100LB320 3320-70LM 3320-70LB320 208-Pin 320-Ball lsi3320 PDF

    CYM1821

    Abstract: CYM1831 CYM1836 CYM1841 CYM1841V33
    Contextual Info: CYM1841V33 J. X .1. !• J *vJ¿ 256K X 32 3.3V Static RAM Module Features ule is con stru cted from tw o 25 6 K x 16 S R A M s in SO J pa ckag­ es m ounted on an epoxy lam inate substrate. Four C hip S elects are used to in de pen de ntly enable th e four bytes. R eading or


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    CYM1841V33 CYM1841V33 CYM1821 CYM1831 CYM1836 CYM1841 PDF