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87185-135HLF
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Amphenol Communications Solutions
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BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 35 Positions, 2.54 mm Pitch, Vertical, 26.49 mm (1.043in) Mating, 2.41 mm (0.095in) Tail. |
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59112-T38-25-135LF
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Amphenol Communications Solutions
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Minitek® 2.00mm, Board To Board, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 50 Positions. |
PDF
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68705-135HLF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 35 Positions, 2.54 mm (0.100in) Pitch. |
PDF
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68015-135HLF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 35 Positions, 2.54 mm (0.100in) Pitch. |
PDF
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76745-135-40LF
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Amphenol Communications Solutions
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BERGSTIK |
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