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Catalog Datasheet	Type	Document Tags	PDF
UM9701 Abstract: UMX9701B Contextual Info: UM9701 Low Resistance, Low Distortion, RF Switching PIN Diode KEY FEATURES DESCRIPTION surfaces of the silicon chip. A glass enclosure houses this bond in a reliable and hermetic package. The axial leads are attached to refractory pins and do not touch the glass enclosure.	Original	UM9701 UM9701 UMX9701B	PDF
Contextual Info: UM9701 Low Resistance, Low Distortion, RF Switching PIN Diode surfaces of the silicon chip. A glass enclosure houses this bond in a reliable and hermetic package. The axial leads are attached to refractory pins and do not touch the glass enclosure. Environmentally these, and all Microsemi	Original	UM9701 UM9701	PDF

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UM9701

Abstract: UMX9701B
Contextual Info: UM9701 Low Resistance, Low Distortion, RF Switching PIN Diode KEY FEATURES DESCRIPTION surfaces of the silicon chip. A glass enclosure houses this bond in a reliable and hermetic package. The axial leads are attached to refractory pins and do not touch the glass enclosure.

Original

UM9701 UM9701 UMX9701B

PDF

Contextual Info: UM9701 Low Resistance, Low Distortion, RF Switching PIN Diode surfaces of the silicon chip. A glass enclosure houses this bond in a reliable and hermetic package. The axial leads are attached to refractory pins and do not touch the glass enclosure. Environmentally these, and all Microsemi

Original

UM9701 UM9701

PDF