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94611-108HLF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 8 Positions, 2.54 mm (0.100in) Pitch. |
PDF
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10114831-11108LF
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Amphenol Communications Solutions
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1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 8 POSITIONS, GOLD FLASH PLATING |
PDF
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54112-111081400LF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, 2.54mm (0.100in), Unshrouded vertical stacking Header, Through Hole, Double Row, 8 Positions |
PDF
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54111-108041000LF
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Amphenol Communications Solutions
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BergStik® 2.54mm, Board To Board Connector, Unshrouded vertical stacked header, Through Hole, Single Row, 4 Positions, 2.54mm (0.100in) Pitch. |
PDF
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10114829-11108LF
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Amphenol Communications Solutions
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1.25mm Wire to Board Wafer, Vertical, Through Hole, 8 Positions |
PDF
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