XO-31
Abstract: AAD00-AAD04 wtl3164 weitek NS32580-30 NS32081
Contextual Info: PRELIMINARY NS32580-20/NS32580-25/NS32580-30 Floating Point Controller G eneral Description The NS32580 Floating-Point Controller FPC is an interface device designed to couple the NS32532 Microprocessor with the Weitek WTL 3164 Floating-Point Data Path (FPDP).
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ns32580-20/ns32580-25/ns32580-30ns32580ns32532ns32081+5xo-31aad00-aad04wtl3164weitekns32580-30
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weitek 3164
Abstract: WTL-3164-15 weitek FPU weitek AADD CA001 NS32532 t03h 32580-WTL3164 R4X20
Contextual Info: PRELIM INARY NS32580-20/NS32580-25/NS32580-30 Floating Point Controller G eneral Description The NS32580 Floating-Point Controller FPC is an interface device designed to couple the NS32532 Microprocessor with the Weitek WTL 3164 Floating-Point Data Path (FPDP).
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OCR Scan
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ns32580-20/ns32580-25/ns32580-30ns32580ns32532ns32081+9weitek 3164wtl-3164-15weitek fpuweitekaaddca001t03h32580-wtl3164r4x20
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iso 1043-1
Abstract: DIN 6120 iso 1043-1 polypropylene j1344 sae j1344 W28B D1972 DIN6120 d24j TA11A
Contextual Info: Packing Considerations Methods, Materials and Recycling Transport Media All NSC commercial devices are prepared, inspected and packed to insure proper physical support and protection during handling, transportation and shipment. Assembled devices are packed in one or more of the following container
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ms011809-4ms011809-1ms011809-5ms011809-2+14ms011809-6ms011809-3ms011809-7ms011809iso 1043-1din 6120iso 1043-1 polypropylenej1344sae j1344w28bd1972din6120d24jta11a
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L146 voltage regulator
Abstract: c1295 battery Mosfet FDD 0207 DC1306 29C982 dell c1295 LPC47N354 foxconn 2820m compal
Contextual Info: 5 4 3 2 1 D D LAGUNA REV : X01 @ : Depop Component C C PRELIMINARY LA-2112 8 Layer M/B for LAGUNA B B Dothan Schematic with Capture CIS and Function field uFCPGA Dothan 04-21-2004 REV: 0.2 A A DELL CONFIDENTIAL/PROPRIETARY PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
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la-2112la2112pr259pr260+12pr261la2111l146 voltage regulatorc1295 batterymosfet fdd 0207dc130629c982dell c1295lpc47n354foxconn2820mcompal
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iso 1043-1
Abstract: DIN 6120 sae j1344 j1344 w28c iso 1043-1 polypropylene bga Shipping Trays MEC34 BGA OUTLINE DRAWING TSOP package tray
Contextual Info: Packing Considerations Methods, Materials and Recycling Transport Media All NSC commercial devices are prepared, inspected and packed to insure proper physical support and protection during handling, transportation and shipment. Assembled devices are packed in one or more of the following container
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ms011809-4ms011809-1ms011809-5ms011809-2+14ms011809-6ms011809-3ms011809-7ms011809iso 1043-1din 6120sae j1344j1344w28ciso 1043-1 polypropylenebga shipping traysmec34bga outline drawingtsop package tray
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scr c1060
Abstract: 2c1216 foxconn marvell 88SA8040 emc6n300 DC1149 PIN202 Socket AM2 C116 max1535
Contextual Info: 5 4 3 2 1 D D LAGUNA REV : X00 @ : Depop Component C C PRELIMINARY B B Dothan Schematic with Capture CIS and Function field uFCPGA Dothan 02-07-2004 REV: 0.3 A A DELL CONFIDENTIAL/PROPRIETARY PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
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la2111pc141scr c10602c1216+8foxconnmarvell 88sa8040emc6n300dc1149pin202socket am2c116max1535
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