U16R Search Results

Contextual Info: ZigBee Light Link User Guide JN-UG-3091 Revision 1.1 14 August 2013 ZigBee Light Link User Guide 2 NXP Laboratories UK 2013 JN-UG-3091 v1.1 ZigBee Light Link User Guide Contents About this Manual 9 Organisation Conventions Acronyms and Abbreviations Related Documents

U17R1

Contextual Info: 8GB, 16GB x72, ECC, QR 240-Pin DDR3 SDRAM RDIMM Features DDR3 SDRAM RDIMM MT72JDZQ1G72PZ – 8GB MT72JDZQ2G72PZ – 16GB Features Figure 1: 240-Pin RDIMM MO-269 (R/C U) • DDR3 functionality and operations supported as defined in the component data sheet

micron quad die ddr3

Contextual Info: 8GB, 16GB x72, ECC, QR 240-Pin DDR3 RDIMM Features DDR3 SDRAM RDIMM MT72JDZQ1G72PZ – 8GB MT72JDZQ2G72PZ – 16GB Features Figure 1: 240-Pin RDIMM MO-269 (R/C U) • DDR3 functionality and operations supported as defined in the component data sheet • 240-pin, registered dual in-line memory module

Contextual Info: 32GB x72, ECC, QR 240-Pin 1.35V DDR3L VLP RDIMM Features 1.35V DDR3L SDRAM VLP RDIMM MT72KDZQ4G72PZ – 32GB Features Figure 1: 240-Pin VLP RDIMM (MO-269 R/C U) Module Height: 18.75mm (0.738in) • DDR3L functionality and operations supported as defined in the component data sheet

Varitronix LCD vim

Abstract: VIM-808 varitronix vim 18 pin 7 digit LCD display pinout 3 digit 7 segment LCD diode 1D 12 pin 7 segment display layout -LD-5461BS 71M6511 71M6513 71m651x
Contextual Info: 71M651X Energy Meter IC A Maxim Integrated Products Brand Application Note AN_651X_017 JULY 2005 Liquid Crystal Display LCD Interface Teridian Semiconductor’s 71M651x has a variety of interfacing ports for data access and display of information. This application note was developed to provide details on interfacing LCD displays to the 71M651x chips.

MPC5510

Abstract: 100HZ AN37-3 AN3225
Contextual Info: Freescale Semiconductor Application Note Document Number: AN3737 Rev. 0, 12/2008 Emulating a PWM Module Using the IO Processor IOP on the MPC5510 Family by: Oscar Luna RTAC Latin America 1 Introduction This application note provides software framework to

240 pin quad rank DIMM DDR3 connector

Contextual Info: 8GB, 16GB x72, ECC, QR 240-Pin DDR3 RDIMM Features DDR3 SDRAM RDIMM MT72JDZQ1G72PZ – 8GB MT72JDZQ2G72PZ – 16GB Features Figure 1: 240-Pin RDIMM MO-269 (R/C U) • DDR3 functionality and operations supported as defined in the component data sheet • 240-pin, registered dual in-line memory module

Contextual Info: ZigBee Home Automation User Guide JN-UG-3076 Revision 1.1 22 October 2013 ZigBee Home Automation User Guide 2 NXP Laboratories UK 2013 JN-UG-3076 v1.1 ZigBee Home Automation User Guide Contents About this Manual 13 Organisation Conventions Acronyms and Abbreviations

Contextual Info: ZigBee RF4CE Stack User Guide JN-UG-3074 Revision 1.1 6 December 2012 ZigBee RF4CE Stack User Guide 2 NXP Laboratories UK 2012 JN-UG-3074 v1.1 ZigBee RF4CE Stack User Guide Contents About this Manual 7 Pre-requisites Organisation Conventions Acronyms and Abbreviations

JN-UG-3041

Contextual Info: JenNet-IP WPAN Stack User Guide JN-UG-3080 Revision 1.4 15 August 2013 JenNet-IP WPAN Stack User Guide 2 NXP Laboratories UK 2013 JN-UG-3080 v1.4 JenNet-IP WPAN Stack User Guide Contents About this Manual 13 Organisation Conventions Acronyms and Abbreviations

Contextual Info: ZigBee Cluster Library User Guide JN-UG-3077 Revision 1.9 14 October 2013 ZigBee Cluster Library User Guide 2 NXP Laboratories UK 2013 JN-UG-3077 v1.9 ZigBee Cluster Library User Guide Contents About this Manual 17 Organisation Conventions Acronyms and Abbreviations

MT72KDZQ4G72PZ-1G4

Abstract: MT41K4G4 32Gb QuadDie DRAM MT72KDZQ4G72PZ MT72KDZQ4G72PZ-1G1
Contextual Info: 32GB x72, ECC, QR 240-Pin 1.35V DDR3L VLP RDIMM Features 1.35V DDR3L SDRAM VLP RDIMM MT72KDZQ4G72PZ – 32GB Features Figure 1: 240-Pin VLP RDIMM (MO-269 R/C U) Module Height: 18.75mm (0.738in) • DDR3L functionality and operations supported as defined in the component data sheet

AI 0068 PCB

Abstract: ultrasonic microcontroller based distance meter ZFSM-101-2 1115 sec mac
Contextual Info: DATA SHEET FreeStar Transceiver Module ZFSM-101-2 FO T R R E N CO EW M M D E ES N D IG E N D S Integrated Transceiver Module for ZigBee/IEEE 802.15.4 DESCRIPTION CEL's FreeStar Module is a small, fully-integrated, drop-in RF transmission solution that’s ideal for ZigBee and other low

100HZ

Abstract: MPC5510 AN3225
Contextual Info: Freescale Semiconductor Application Note Emulating a PWM Module Using the IO Processor IOP on the MPC5510 Family by: Oscar Luna RTAC Latin America 1 Introduction This application note provides software framework to emulate a pulse width modulated (PWM) driver by

Contextual Info: LPRF Board API Reference Manual JN-RM-2003 Revision 2.2 17 December 2012 LPRF Board API Reference Manual 2 NXP Laboratories UK 2012 JN-RM-2003 v2.2 LPRF Board API Reference Manual Contents About this Manual 7 Organisation Conventions Acronyms and Abbreviations

Contextual Info: JN516x Integrated Peripherals API User Guide JN-UG-3087 Revision 1.0 22 November 2012 JN516x Integrated Peripherals API User Guide 2 NXP Laboratories UK 2012 JN-UG-3087 v1.0 JN516x Integrated Peripherals API User Guide Contents About this Manual 15 Organisation

U12R3

Contextual Info: 32GB x72, ECC, QR 240-Pin DDR3 VLP RDIMM Features DDR3 SDRAM VLP RDIMM MT72JDZQ4G72PZ – 32GB Features Figure 1: 240-Pin RDIMM MO-269 (R/C U) Module Height: 18.75mm (0.738in) • DDR3 functionality and operations supported as defined in the component data sheet

Contextual Info: ICs for Audio Common Use AN7531SA Headphone amplifier IC for portable equipment • Overview Unit: mm AN7531SA is an audio signal processing IC in which bass boost amplifiers, ALC circuit and beep circuit are built in the headphone amplifiers for use in portable equipment. Its headphone output block

Contextual Info: Voltage Regulators AN8049FHN 1.8-volt 3-channel step-up, step-down, and polarity inverting DC-DC converter control IC Unit: mm 5.20±0.10 5.00 20 24 7 0.20±0.10 1 R0.30 8 di p Pl lan nclu ea e se pla m d m des ne ain ain foll htt visit d te t o p:/ fo /w llo dis disc nan enan wing

Contextual Info: 32GB x72, ECC, QR 240-Pin 1.35V DDR3L VLP RDIMM Features 1.35V DDR3L SDRAM VLP RDIMM MT72KDZQ4G72PZ – 32GB Features Figure 1: 240-Pin VLP RDIMM (MO-269 R/C U) Module Height: 18.75mm (0.738in) • DDR3L functionality and operations supported as defined in the component data sheet

Contextual Info: 32GB x72, ECC, QR 240-Pin DDR3 VLP RDIMM Features DDR3 SDRAM VLP RDIMM MT72JDZQ4G72PZ – 32GB Features Figure 1: 240-Pin RDIMM MO-269 (R/C U) Module Height: 18.75mm (0.738in) • DDR3 functionality and operations supported as defined in the component data sheet

U16r

Abstract: L78L33 L78L33 A S3 diode ELCO connector 10KOHM 1N4744 CM500 LM317 MMBT2222
Contextual Info: OPB780-Kit Color Sensor Evaluation Kit • The OPB780-Kit is designed to provide the design engineer an easy way to evaluate the capability of the OPB780 Color Sensor. The OPB780Z is a full color sensor with 4 different frequencies relating directly to a specific color seen by the sensor.

DDR2-533

Abstract: DDR2-667 MT72HVQ1G72PY-667 PC2-5300 U21R0 MT47H1G4 SSTL-18 U21R1 MT72HVQ1G72
Contextual Info: 8GB x72, ECC, QR 240-Pin DDR2 SDRAM VLP RDIMM Features DDR2 SDRAM VLP RDIMM MT72HVQ1G72P – 8GB For component data sheets, refer to Micron’s Web site: www.micron.com Features Figure 1: • Fits with ATCA form factor • 240-pin, very low profile registered dual in-line