U156A
Contextual Info: 156 Pin Ceramic Pin Grid Array NS Package Number U156A All dimensions are in inches millimeters LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL
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transistor BC 458
Abstract: transistor BC 945 ac 1084 transistor bc 577 Transistor BC 585 MS-015-AB TRANSISTOR A42 bd 743 transistor uA109 CA 358 AE
Contextual Info: Hermetic Dimensional/Thermal Data The following table identifies all of the hermetic package configurations and pin counts per package type offered by National Semiconductor. In addition, the table provides dimensional and thermal data for each of the ceramic and
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ms011795transistor bc 458transistor bc 945ac 1084+7transistor bc 577transistor bc 585ms-015-abtransistor a42bd 743 transistorua109ca 358 ae
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iso 1043-1
Abstract: DIN 6120 iso 1043-1 polypropylene j1344 sae j1344 W28B D1972 DIN6120 d24j TA11A
Contextual Info: Packing Considerations Methods, Materials and Recycling Transport Media All NSC commercial devices are prepared, inspected and packed to insure proper physical support and protection during handling, transportation and shipment. Assembled devices are packed in one or more of the following container
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ms011809-4ms011809-1ms011809-5ms011809-2+14ms011809-6ms011809-3ms011809-7ms011809iso 1043-1din 6120iso 1043-1 polypropylenej1344sae j1344w28bd1972din6120d24jta11a
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CERAMIC PIN GRID ARRAY 120 pins
Abstract: 144 CERAMIC PIN GRID ARRAY CPGA CPGA U121A CERAMIC PIN GRID ARRAY CPGA U120C U68B Array UA65A U44A
Contextual Info: Ceramic Pin Grid Array CPGA 44 Pin Ceramic Pin Grid Array, Cavity Up NS Package Number U44A 2000 National Semiconductor Corporation MS101111 www.national.com Ceramic Pin Grid Array (CPGA) August 1999 Ceramic Pin Grid Array (CPGA) 65 Pin Ceramic Pin Grid Array
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ms101111ua65aceramic pin grid array 120 pins144 ceramic pin grid array cpga+7cpgau121aceramic pin grid array cpgau120cu68barrayu44a
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iso 1043-1
Abstract: DIN 6120 sae j1344 j1344 w28c iso 1043-1 polypropylene bga Shipping Trays MEC34 BGA OUTLINE DRAWING TSOP package tray
Contextual Info: Packing Considerations Methods, Materials and Recycling Transport Media All NSC commercial devices are prepared, inspected and packed to insure proper physical support and protection during handling, transportation and shipment. Assembled devices are packed in one or more of the following container
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ms011809-4ms011809-1ms011809-5ms011809-2+14ms011809-6ms011809-3ms011809-7ms011809iso 1043-1din 6120sae j1344j1344w28ciso 1043-1 polypropylenebga shipping traysmec34bga outline drawingtsop package tray
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transistor BC 458
Abstract: transistor a42 MO-003 transistor Bc 540 ua109a CERAMIC PIN GRID ARRAY CPGA lead frame transistor bc 577 W144A UA65A CERAMIC QUAD FLATPACK CQFP
Contextual Info: Hermetic Dimensional/Thermal Data The following table identifies all of the hermetic package configurations and pin counts per package type offered by National Semiconductor. In addition, the table provides dimensional and thermal data for each of the ceramic and
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transistor bc 458transistor a42mo-003transistor bc 540+6ua109aceramic pin grid array cpga lead frametransistor bc 577w144aua65aceramic quad flatpack cqfp
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