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    U124A Search Results

    U124A Datasheets (1)

    Part ECAD Model Manufacturer Description Datasheet Type PDF PDF Size Page count
    U124A
    		National Semiconductor 124 Pin Ceramic Pin Grid Array, Cavity Up Original PDF 64.19KB 1
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    U124A Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    U124A

    Contextual Info: 124 Pin Ceramic Pin Grid Array Cavity Up NS Package Number U124A All dimensions are in inches millimeters LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL


    Original     		U124A U124A PDF

    78u30

    Abstract: oz9981 temic 0675 c9 temic 0675 d4 BC555 oz9983 oz99 temic 0675 d6 BC148 pin configuration foxconn
    Contextual Info: Jan. 11 2002 C-Note 2 Block Diagram Mobile CPU 3 HOST BUS LCD 13 CH70011 Almador-M 133MHz 10 12 To P.R. 7,8,9 MIC IN AC'97 CODEC HUB I/F . X I 66MHz AD1881A 24 PCI BUS Line Out OP AMP CARDBUS PWR SW TI 1410A TPS2211A AC-Link O C 11 DVO BUS / 66MHz GMCH Final version


    Original     		133MHz CH70011 133MHz 66MHz AD1881A 66MHz TPA0202 TSB43AB21 TPS2211A 47R27 78u30 oz9981 temic 0675 c9 temic 0675 d4 BC555 oz9983 oz99 temic 0675 d6 BC148 pin configuration foxconn PDF

    transistor BC 458

    Abstract: transistor BC 945 ac 1084 transistor bc 577 Transistor BC 585 MS-015-AB TRANSISTOR A42 bd 743 transistor uA109 CA 358 AE
    Contextual Info: Hermetic Dimensional/Thermal Data The following table identifies all of the hermetic package configurations and pin counts per package type offered by National Semiconductor. In addition, the table provides dimensional and thermal data for each of the ceramic and


    Original     		MS011795 transistor BC 458 transistor BC 945 ac 1084 transistor bc 577 Transistor BC 585 MS-015-AB TRANSISTOR A42 bd 743 transistor uA109 CA 358 AE PDF

    iso 1043-1

    Abstract: DIN 6120 iso 1043-1 polypropylene j1344 sae j1344 W28B D1972 DIN6120 d24j TA11A
    Contextual Info: Packing Considerations Methods, Materials and Recycling Transport Media All NSC commercial devices are prepared, inspected and packed to insure proper physical support and protection during handling, transportation and shipment. Assembled devices are packed in one or more of the following container


    Original     		MS011809-4 MS011809-1 MS011809-5 MS011809-2 MS011809-6 MS011809-3 MS011809-7 MS011809 iso 1043-1 DIN 6120 iso 1043-1 polypropylene j1344 sae j1344 W28B D1972 DIN6120 d24j TA11A PDF

    CERAMIC PIN GRID ARRAY 120 pins

    Abstract: 144 CERAMIC PIN GRID ARRAY CPGA CPGA U121A CERAMIC PIN GRID ARRAY CPGA U120C U68B Array UA65A U44A
    Contextual Info: Ceramic Pin Grid Array CPGA 44 Pin Ceramic Pin Grid Array, Cavity Up NS Package Number U44A 2000 National Semiconductor Corporation MS101111 www.national.com Ceramic Pin Grid Array (CPGA) August 1999 Ceramic Pin Grid Array (CPGA) 65 Pin Ceramic Pin Grid Array


    Original     		MS101111 UA65A CERAMIC PIN GRID ARRAY 120 pins 144 CERAMIC PIN GRID ARRAY CPGA CPGA U121A CERAMIC PIN GRID ARRAY CPGA U120C U68B Array UA65A U44A PDF

    temic 0675 D4

    Abstract: temic 0675 c9 temic 0675 d6 temic 0675 d1 oz9983 PLW3216S102SQ2 KBC-M38859 BC200 rfid U123D Wistron Corporation
    Contextual Info: Mar. 22 2002 Cnote 3 Block Diagram Mobile CPU 3 HOST BUS 01204-4 CRT CONN 4,5 L1: Signal 1 L2: GND TV OUT Tualatin Celeron-T CLK GEN. ICS 950806 PCB LAYER LCD 13 For C2 SOVP 14 L4: Signal 3 Final version L5: GND C3 SVT LVDS 133MHz L3: Signal 2 L6: POWER L7: Signal 4 weak


    Original     		133MHz CH70011 133MHz 66MHz MAX1631/MAX1772 AD1881A 66MHz TPS2211A 42P26 47R27 temic 0675 D4 temic 0675 c9 temic 0675 d6 temic 0675 d1 oz9983 PLW3216S102SQ2 KBC-M38859 BC200 rfid U123D Wistron Corporation PDF

    iso 1043-1

    Abstract: DIN 6120 sae j1344 j1344 w28c iso 1043-1 polypropylene bga Shipping Trays MEC34 BGA OUTLINE DRAWING TSOP package tray
    Contextual Info: Packing Considerations Methods, Materials and Recycling Transport Media All NSC commercial devices are prepared, inspected and packed to insure proper physical support and protection during handling, transportation and shipment. Assembled devices are packed in one or more of the following container


    Original     		MS011809-4 MS011809-1 MS011809-5 MS011809-2 MS011809-6 MS011809-3 MS011809-7 MS011809 iso 1043-1 DIN 6120 sae j1344 j1344 w28c iso 1043-1 polypropylene bga Shipping Trays MEC34 BGA OUTLINE DRAWING TSOP package tray PDF

    transistor BC 458

    Abstract: transistor a42 MO-003 transistor Bc 540 ua109a CERAMIC PIN GRID ARRAY CPGA lead frame transistor bc 577 W144A UA65A CERAMIC QUAD FLATPACK CQFP
    Contextual Info: Hermetic Dimensional/Thermal Data The following table identifies all of the hermetic package configurations and pin counts per package type offered by National Semiconductor. In addition, the table provides dimensional and thermal data for each of the ceramic and


    Original     		PDF

    NEC B1100

    Abstract: P82B305 TC17G022 weitek 1066 SCX6225 MOTOROLA 68012 SAB80286 toshiba tc17g P82C441 TC15G014
    Contextual Info: 4 SEMICONDUCTOR / SOCKET CROSS REFERENCE LIST mm m DEVICE NUMBER # OF PINS TYPE MILL-MAX PART NUMBER AMD 3500 673104A 80186 80186 80286 8086/88 9513A AM29000 AM 29117 AM29300/325 AM29332/334/434 AM29368 AM29C101 AM29C325 AM29C327 AM29C660 AM 29 C827A/828A


    OCR Scan     		73104A AM29000 AM29300/325 AM29332/334/434 AM29368 AM29C101 AM29C325 AM29C327 AM29C660 C827A/828A NEC B1100 P82B305 TC17G022 weitek 1066 SCX6225 MOTOROLA 68012 SAB80286 toshiba tc17g P82C441 TC15G014 PDF