U124A
Contextual Info: 124 Pin Ceramic Pin Grid Array Cavity Up NS Package Number U124A All dimensions are in inches millimeters LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL
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78u30
Abstract: oz9981 temic 0675 c9 temic 0675 d4 BC555 oz9983 oz99 temic 0675 d6 BC148 pin configuration foxconn
Contextual Info: Jan. 11 2002 C-Note 2 Block Diagram Mobile CPU 3 HOST BUS LCD 13 CH70011 Almador-M 133MHz 10 12 To P.R. 7,8,9 MIC IN AC'97 CODEC HUB I/F . X I 66MHz AD1881A 24 PCI BUS Line Out OP AMP CARDBUS PWR SW TI 1410A TPS2211A AC-Link O C 11 DVO BUS / 66MHz GMCH Final version
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133mhzch7001166mhzad1881a+14tpa0202tsb43ab21tps2211a47r2778u30oz9981temic 0675 c9temic 0675 d4bc555oz9983oz99temic 0675 d6bc148 pin configurationfoxconn
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transistor BC 458
Abstract: transistor BC 945 ac 1084 transistor bc 577 Transistor BC 585 MS-015-AB TRANSISTOR A42 bd 743 transistor uA109 CA 358 AE
Contextual Info: Hermetic Dimensional/Thermal Data The following table identifies all of the hermetic package configurations and pin counts per package type offered by National Semiconductor. In addition, the table provides dimensional and thermal data for each of the ceramic and
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ms011795transistor bc 458transistor bc 945ac 1084+7transistor bc 577transistor bc 585ms-015-abtransistor a42bd 743 transistorua109ca 358 ae
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iso 1043-1
Abstract: DIN 6120 iso 1043-1 polypropylene j1344 sae j1344 W28B D1972 DIN6120 d24j TA11A
Contextual Info: Packing Considerations Methods, Materials and Recycling Transport Media All NSC commercial devices are prepared, inspected and packed to insure proper physical support and protection during handling, transportation and shipment. Assembled devices are packed in one or more of the following container
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ms011809-4ms011809-1ms011809-5ms011809-2+14ms011809-6ms011809-3ms011809-7ms011809iso 1043-1din 6120iso 1043-1 polypropylenej1344sae j1344w28bd1972din6120d24jta11a
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CERAMIC PIN GRID ARRAY 120 pins
Abstract: 144 CERAMIC PIN GRID ARRAY CPGA CPGA U121A CERAMIC PIN GRID ARRAY CPGA U120C U68B Array UA65A U44A
Contextual Info: Ceramic Pin Grid Array CPGA 44 Pin Ceramic Pin Grid Array, Cavity Up NS Package Number U44A 2000 National Semiconductor Corporation MS101111 www.national.com Ceramic Pin Grid Array (CPGA) August 1999 Ceramic Pin Grid Array (CPGA) 65 Pin Ceramic Pin Grid Array
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ms101111ua65aceramic pin grid array 120 pins144 ceramic pin grid array cpga+7cpgau121aceramic pin grid array cpgau120cu68barrayu44a
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temic 0675 D4
Abstract: temic 0675 c9 temic 0675 d6 temic 0675 d1 oz9983 PLW3216S102SQ2 KBC-M38859 BC200 rfid U123D Wistron Corporation
Contextual Info: Mar. 22 2002 Cnote 3 Block Diagram Mobile CPU 3 HOST BUS 01204-4 CRT CONN 4,5 L1: Signal 1 L2: GND TV OUT Tualatin Celeron-T CLK GEN. ICS 950806 PCB LAYER LCD 13 For C2 SOVP 14 L4: Signal 3 Final version L5: GND C3 SVT LVDS 133MHz L3: Signal 2 L6: POWER L7: Signal 4 weak
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133mhzch7001166mhzmax1631/max1772+14ad1881atps2211a42p2647r27temic 0675 d4temic 0675 c9temic 0675 d6temic 0675 d1oz9983plw3216s102sq2kbc-m38859bc200 rfidu123dwistron corporation
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iso 1043-1
Abstract: DIN 6120 sae j1344 j1344 w28c iso 1043-1 polypropylene bga Shipping Trays MEC34 BGA OUTLINE DRAWING TSOP package tray
Contextual Info: Packing Considerations Methods, Materials and Recycling Transport Media All NSC commercial devices are prepared, inspected and packed to insure proper physical support and protection during handling, transportation and shipment. Assembled devices are packed in one or more of the following container
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ms011809-4ms011809-1ms011809-5ms011809-2+14ms011809-6ms011809-3ms011809-7ms011809iso 1043-1din 6120sae j1344j1344w28ciso 1043-1 polypropylenebga shipping traysmec34bga outline drawingtsop package tray
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transistor BC 458
Abstract: transistor a42 MO-003 transistor Bc 540 ua109a CERAMIC PIN GRID ARRAY CPGA lead frame transistor bc 577 W144A UA65A CERAMIC QUAD FLATPACK CQFP
Contextual Info: Hermetic Dimensional/Thermal Data The following table identifies all of the hermetic package configurations and pin counts per package type offered by National Semiconductor. In addition, the table provides dimensional and thermal data for each of the ceramic and
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transistor bc 458transistor a42mo-003transistor bc 540+6ua109aceramic pin grid array cpga lead frametransistor bc 577w144aua65aceramic quad flatpack cqfp
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NEC B1100
Abstract: P82B305 TC17G022 weitek 1066 SCX6225 MOTOROLA 68012 SAB80286 toshiba tc17g P82C441 TC15G014
Contextual Info: 4 SEMICONDUCTOR / SOCKET CROSS REFERENCE LIST mm m DEVICE NUMBER # OF PINS TYPE MILL-MAX PART NUMBER AMD 3500 673104A 80186 80186 80286 8086/88 9513A AM29000 AM 29117 AM29300/325 AM29332/334/434 AM29368 AM29C101 AM29C325 AM29C327 AM29C660 AM 29 C827A/828A
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73104aam29000am29300/325am29332/334/434+16am29368am29c101am29c325am29c327am29c660c827a/828anec b1100p82b305tc17g022weitek 1066scx6225motorola 68012sab80286toshiba tc17gp82c441tc15g014
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