54121-407031500LF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 3 Positions, 2.54mm (0.100in) Pitch. |
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54111-407031350LF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, 2.54mm (0.100in), Unshrouded vertical stacking Header, Through Hole, Single Row, 3 Positions |
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54121-407031300LF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 3 Positions, 2.54mm (0.100in) Pitch. |
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54121-107031050LF
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Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 3 Positions, 2.54mm (0.100in) Pitch. |
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54121-407031350LF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, 2.54mm (0.100in), Unshrouded vertical stacking Header, Through Hole, Single Row, 3 Positions |
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98426-F07-03-135LF
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Amphenol Communications Solutions
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Minitek® 2.00mm, Board to Board, Shrouded Vertical Stacking Header, Through Hole, Double Row, 6 Positions, 2.00mm (0.079in) Pitch. |
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