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TST286 Abstract: Tst406t2 Contextual Info: TST Series • Designed for high cycle long term applications • New Spinodal Copper contact allows Burn-In temperature to 200°C • Chip resistant Polyetherimide bodies extend socket life; inhibit corrosion • Narrow body design allows for maximum board density	OCR Scan	hone812/948-0564 tng30 762pm tst286 +1tst406t2	PDF

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TST286

Abstract: Tst406t2
Contextual Info: TST Series • Designed for high cycle long term applications • New Spinodal Copper contact allows Burn-In temperature to 200°C • Chip resistant Polyetherimide bodies extend socket life; inhibit corrosion • Narrow body design allows for maximum board density

OCR Scan

hone812/948-0564 tng30 762pm tst286 +1

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