jedec QFP80
Abstract: SC82AB SC88A TVSP10 VSP10 pat2
Contextual Info: 熱抵抗について 本書ではお客様におけます熱設計時のご参考のために、弊社での熱抵抗に関する各パラメータの定義、 測定方法などについて解説いたします。 •背景 一般的に素子のジャンクション温度（Tj）が 10℃上がる毎にデバイスの寿命は約半分になり、故障率は約２倍になるとい
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175tjeia/jesd51-3/-5/-725mma02mm35um+9201jaot23-5ot23-6sc88asc82abjedec qfp80tvsp10vsp10pat2
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SC82AB
Abstract: SC88A TVSP10 VSP10 QFP100-U1 SC82A pat2
Contextual Info: 熱抵抗について 本書ではお客様におけます熱設計時のご参考のために、弊社での熱抵抗に関する各パラメータの定義、 測定方法などについて解説いたします。 •背景 一般的に素子のジャンクション温度（Tj）が 10℃上がる毎にデバイスの寿命は約半分になり、故障率は約２倍になるとい
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175tjeia/jesd51-3/-5/-725mma02mm35um+10201jaot23-5ot23-6sc88asc82abtvsp10vsp10qfp100-u1sc82apat2
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CON-HDR-2X5-050
Abstract: C44-10BSA1-G TSSOP54 HR961160C microSD card adapter circuit diagram K350QVG-V1-F C44-08BSA1-G WM8510 W25X80AVSSIG DS-LM39B92
Contextual Info: Stellaris Intelligent Display Module Single-Board Computer IDM-SBC Reference Design Kit User ’s Manual RDK-IDM-SBC-UM-05 Co pyrigh t 2 009– 201 1 Te xas In strumen ts Copyright Copyright © 2009–2011 Texas Instruments, Inc. All rights reserved. Stellaris and StellarisWare are registered trademarks of Texas Instruments.
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rdk-idm-sbc-um-05con-hdr-2x5-050c44-10bsa1-gtssop54+7hr961160cmicrosd card adapter circuit diagramk350qvg-v1-fc44-08bsa1-gwm8510w25x80avssigds-lm39b92
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TSSOP54
Abstract: tssop-54 Test-Element-Group SC82AB SC88A TVSP10 VSP10 TSSOP54-N1 ESON6-H12 JESD51-5
Contextual Info: 关于热阻 本资料，作为客户热量设计时的参考，关于本公司的热阻的各参数定义测量方法等在此进行解说。 •背景 通常，元件的结温 Junction Temperature （Tj）每上升 10℃，器件的寿命就会大约减为一半，故障率也
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TSSOP54
Abstract: emp8 Package EPFFP6-A2 dmp8 Package dimension tssop-54 HSOP-8 SC82AB SC88A SSOP14 TVSP10
Contextual Info: THERMAL RESISTANCE This manual explains about measurement procedures and definitions of thermal resistance. •INTRODUCTION Generally, the life of a device would decrease to half, and the failure rate would double whenever Junction Temperature, Tj, goes up by
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ot23-5ot23-6sc88asc82ab+8tssop54emp8 packageepffp6-a2dmp8 package dimensiontssop-54hsop-8ssop14tvsp10
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EQFN12-E2
Abstract: H12 SOT23 SC82AB SC88A TVSP10 VSP10 JESD51-3
Contextual Info: 关于热阻 本资料，作为客户热量设计时的参考，关于本公司的热阻的各参数定义测量方法等在此进行解说。 •背景 通常，元件的结温 Junction Temperature （Tj）每上升 10℃，器件的寿命就会大约减为一半，故障率也
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H12 SOT23
Abstract: TO252 thermal character PAT-1 QFP80-C2 TVSP10 base resistance for SOT23 IC chip 555 SC82AB SC88A SSOP10
Contextual Info: THERMAL RESISTANCE This manual explains about measurement procedures and definitions of thermal resistance. •INTRODUCTION Generally, the life of a device would decrease to half, and the failure rate would double whenever Junction Temperature, Tj, goes up by
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