TSMC 0.18 Search Results

XPC823ZT66B2T

Abstract: XPC823ZT81B2T XPC823 XPC823ZT75B2T motorola tsmc XPC823ZT66B2 KXPC823ZT81B2T MPC823 MOS11 xpc823zt66
Contextual Info: Semiconductor Products Sector Networking and Computing Systems Group Networking and Communications System Division PCN: MPC823 XC Qualification in TSMC/WaferTech Motorola is pleased to announce an additional wafer fabrication facility, TSMC/WaferTech, for

3248L

Contextual Info: RELIABILITY REPORT DATE: 6/8/05 QUALITY ENG : PART NUMBER MICREL KS8001L/KSZ8001L KS8001LD/KSZ8001LD PROJECT # PACKAGE TYPE : ASSEMBLY LOC LOT # FAB LOC D/C # PROCESS KS8001S 48L SSOP OSE GD64047MEA TSMC 0437A 0.18 um KS8001LD 48L QFP ASE GD64047MEK TSMC 0503A

XPC823ZT66B2T

Abstract: XPC823 XPC823ZT75B2T XPC823ZT81B2T KXPC823ZT81B2T MPC823 W90913 XPC823ZT
Contextual Info: M Semiconductor Products Sector Networking and Computing Systems Group Networking and Communications System Division PCN: MPC823 XC Qualification in TSMC/WaferTech Motorola is pleased to announce an additional wafer fabrication facility, TSMC/WaferTech, for

XPC850SRZT50BT

Abstract: XPC850ZT50BT XPC850DEZT50BT XPC850SRZT80BT XPC850DEZT66BT XPC850SRZT66A SPB25 SC5302 MPC850 XPC850SRCZT50B
Contextual Info: Semiconductor Products Sector Networking and Computing Systems Group Networking and Communications System Division PCN: MPC850 XC Qualification in TSMC/WaferTech EFFECTIVE DATE: 30-SEPT-00 Motorola is pleased to announce an additional wafer fabrication facility, TSMC/WaferTech, for

tristate buffer cmos

Abstract: TSMC 0.18 um CMOS "embedded dram" tsmc tsmc cmos 0.13 um TSMC 0.18um tsmc cmos 0.13 MOSAID Technologies TSMC cmos 0.18um
Contextual Info: SoC-RAMTM PL Memory Core 0.18µm 4.97Mbit embedded DRAM Macrocell Memory Type: Process: Geometry: Configuration: Structure: Synchronous DRAM 0.18µm Generic TSMC Logic Process Memory Density Area Height Width Cell-Efficiency Number of banks Number of pages in a bank

ISSI

Abstract: TSMC embedded Flash TSMC Flash memory 0.18 motorola tsmc flash Integrated Silicon Solution Inc "embedded dram" tsmc memory issi tsmc 0.18 flash TSMC embedded EEPROM
Contextual Info: Memory Based Solutions ISSI ¨ Integrated Silicon Solution, Inc. ISSI www.issi.com 1 ISSI198_11/98 ¨ Integrated Silicon Solution, Inc. Over Ten Years of High-Performance Memories ISSI Milestones Incorporated - 1988 u First Foundry Partnership TSMC - 1990

tsmc cmos 0.13 um

Abstract: "embedded dram" tsmc
Contextual Info: SoC-RAMTM PL Memory Core 0.18µm 3Mbit embedded DRAM Macrocell Memory Type: Process: Geometry: Configuration: Structure: Synchronous DRAM 0.18µm Generic TSMC Logic Process Memory Density Area Height Width Cell-Efficiency Number of banks Number of pages in a bank

Contextual Info: TSMC 0.18 micron Process OPERATING LIFE @ Tj = + 130-150c at rated Voltage Family Device Lot. Pkg Qty Act Hrs Rej Act Hrs Rej PHYs KS8001LD KS8001S KSZ8001S KSZ8001L GD64047MEL GD64047MEC GD64047MEQ GDP0833.02 QFP-48 SSOP-48 SSOP-48 QFP-48 116 116 77 77 168

tsmc cmos 0.13 um

Abstract: "embedded dram" tsmc D1270 TSMC cmos 0.18um TSMC 0.18Um MOSAID Technologies
Contextual Info: SoC-RAMTM PL Memory Core 0.18µm 8Mbit embedded DRAM Macrocell Memory Type: Process: Geometry: Configuration: Structure: Synchronous DRAM 0.18µm Generic TSMC Logic Process Memory Density Area Height Width Cell-Efficiency Number of banks Number of pages in a bank

TSMC embedded Flash

Abstract: TSMC Flash memory 0.18 ISSI Integrated Silicon Solution Inc
Contextual Info: Over Ten Years of High-Performance Memories ISSI Integrated Silicon Solution, Inc. ISSI www.issi.com 1 ISSI198_11/98 ® Integrated Silicon Solution, Inc. Over Ten Years of High-Performance Memories ISSI Milestones Incorporated - 1988 u First Foundry Partnership TSMC - 1990

roadmap ISSI

Abstract: IS61C1024 IS61C64AH IS61C64B IS62C64 IS89C52 IS25M080A5T2R IS80C32 flash memory 5v 16M-bit 48 TSOP ISSI
Contextual Info: Memory Based Solutions ISSI Integrated Silicon Solution, Inc. ISSI www.issi.com 1 ISSI_498 04/09/98 ® Integrated Silicon Solution, Inc. Memory Based Solutions ISSI Milestones • • • • • • • Incorporated - 1988 First Foundry Partnership TSMC - 1990

cmos tsmc 0.18

Abstract: tsmc eeprom ram tsmc 0.18 tsmc cmos 0.35 0.35 tsmc cmos 16V8 20V8
Contextual Info: PRESS RELEASE CYPRESS AND TSMC TEAMING UP ON 0.18-MICRON CPLD FAMILY Six-Layer Metal Process will Deliver Very High Density and Performance with Low Power SAN JOSE, Calif., September 14, 1998 - Cypress Semiconductor Corp. NYSE:CY and Taiwan Semiconductor Manufacturing Company (NYSE:TSM) today announced that they have entered

TSMC embedded Flash

Abstract: NT410 tsmc 0.18 flash TSMC Flash cmos tsmc 0.18 TSMC Flash memory 0.18 TSMC Flash IP tsmc cmos NT1208 NT1115
Contextual Info: Taiwan Semiconductor Manufacturing Company Ltd. January 27, 2000 Page 1 FOR IMMEDIATE RELEASE CONTACT IN TAIWAN CONTACT IN NEW YORK Derek Tien or Julie Chan Finance Division TSMC invest@tsmc.com.tw 886/3/567-2664 Mami Ogawa Thomson Financial Investor Relations

JESD22-A114F

Abstract: JESD47 JESD-47 JEDEC JESD22-B116 free download JESD22-A102C JESD22-A108B JESD22-B116A JESD22-A114-F JESD78B JESD22-A102-C
Contextual Info: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: W-1002-01(R4) DATE: October 4, 2010 Affected Products: Refer to the attached list of products transferring from IDT Fab 4 to TSMC

tsmc 0.18um

Abstract: TSMC 0.18um data sheet tsmc cmos RTL code for ethernet TSMC cmos 0.18um data sheet TSMC cmos 0.18um ethernet mdio circuit diagram 20 channel data transmitting circuit 3.125G block diagram for optical fiber receiver
Contextual Info: SB1000 PRODUCT BRIEF SILICON BRIDGE SB1000 - Quad 1 - 3.125Gbps Low Power CMOS Transceiver Macro Cell in 0.18um TSMC Process FEATURES BENIFITS/ADVANTAGES • • • • • • • • • • • • • • • • • • • • • Compliant with IEEE 802.3ae 10Gbps Ethernet

TSMC 0.35Um

Abstract: TSMC 1P4M HP83K cmos tsmc 0.18 tsmc FAB10 FAB-10 tsmc cmos 0.35 PI7C8150B PI7C8150A PI7C8152A
Contextual Info: 3545 North First St. • San Jose, CA 95134 • USA PRODUCT/PROCESS CHANGE NOTICE PCN PCN Number: 06-04 Date Issued: June 30, 2006 Product(s) Affected: PI7C8150A, 8150A-33, 8150B, 8150B-33, PI7C8152A, 8152B Manufacturing Location Affected: TSMC Fab 7 and 10

CL018G

Abstract: TSMC 0.18 um CMOS silicon TSMC 0.18 um CMOS low power low noise frequency divider specification cmos tsmc 0.18 tsmc cmos model N-7075 0.18 um CMOS Process adc verilog tsmc cmos 0.18 um
Contextual Info: BRIEF PRODUCT SPECIFICATION nPLL20240-18a 240MHz Low Jitter PLL FEATURES • • • • • • • • • TSMC CL018G 1.8 V 240 MHz Low Jitter PLL Reference Clock Input 20 Mhz, 40 MHz and 80 MHz Programmable Steps, 3, 6 or 12 Divider 80 MHz, 40 MHz and 20 MHz Complimentary

TSMC Flash

Abstract: linear handbook E144 EP3C10 EP3C120 EP3C16 EP3C25 EP3C40 EP3C55 automatic heat detector project report
Contextual Info: Cyclone III Design Guidelines November 2008 AN-466-1.2 Introduction The Cyclone III FPGA family offered by Altera ® is a cost-optimized, memory-rich FPGA family. Cyclone III FPGAs are built on Taiwan Semiconductor Manufacturing Company's TSMC 65-nm low-power (LP) process technology with additional silicon

70241k

Abstract: d5611 61c256 ic 9022 61c64 RELIABILITY REPORT ISSI vacuum tubes CMS 2015 S/TRANSISTOR J 5804 EQUIVALENT 28F010P
Contextual Info: ISSI Integrated Silicon Solution, Inc. Quality and Reliability 1997-1998 An ISO 9001 Company ISSI ® Reliability Report 1997-1998 An ISO 9001 Company 1997 Integrated Silicon Solution, Inc. Integrated Silicon Solution, Inc. • 2231 Lawson Lane • Santa Clara, CA 95054

c9013

Abstract: 84 pin PBGA oscilloscope MTBF TSMC retention memory dc 8069 IS61C1024 IC Data-book Q-16 car radio 14x20 TSOP 8638
Contextual Info: ISSI Integrated Silicon Solution, Inc. Quality and Reliability 1997-1998 An ISO 9001 Company ISSI ® Quality System Manual QUALITY Reliabilty Report 1997-1998 RELIABILITY Integrated Silicon Solution, Inc. An ISO 9001 Company 1997 Integrated Silicon Solution, Inc.

TSMC 0.18Um

Contextual Info: Nomenclature Guide TW Types TW aaaa bb - c d e f g# - h j k l PREFIX DEVICE NUMBER AT: Auto Wafer EP: Epi Wafer l - OPTIONS S = SLT B = Burn-in H = High Temp. Testing I = Industrial V = High Volt Testing T = Tape & Reel Packing c - PROCESS This character is included in the

TSMC 0.35um

Abstract: tsmc 0.18um Intersil marking code TSMC 0.25Um vanguard 0.35Um tsmc 0.18-um utac qfn TSMC 90nm TW6818-LA1-GR
Contextual Info: Nomenclature Guide TW Types TW aaaa bb - c d e f g# - h j k l PREFIX DEVICE NUMBER AT: Auto Wafer EP: Epi Wafer l - OPTIONS S = SLT B = Burn-in H = High Temp. Testing I = Industrial V = High Volt Testing T = Tape & Reel Packing c - PROCESS This character is included in the

PCI AHB DMA

Abstract: tsmc 0.18 axi bridge
Contextual Info: Compliant with PCI Express Base Specification 1.1 CPXP-EP PCI Express Endpoint Controller Core with SoC Bridge Extensions for AHB, AXI and Wishbone Implements a PCI Express endpoint controller that is compliant with PCI Express Base specification 1.1, including the Transaction, Data Link, and Physical protocol layers. It

018U

Abstract: Nordic Semiconductor ADC Verilog Implementation TSMC 0.18Um
Contextual Info: PhysicalExpress H HA AN ND DO OFFFF A AN ND DM MA AN NU UFFA AC CTTU UR RIIN NG GS SE ER RV VIIC CE E What is PhysicalExpress? Through several years of experience with Handoff projects, Nordic Semiconductor is able to present customers with a well-proven methodology and a simple, streamlined interface. Combining this methodology with state-of-the-art EDA tools and silicon proven IP, we