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    TSM-2233 Search Results

    TSM-2233 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    68002-233HLF
    Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 33 Positions, 2.54 mm (0.100in) Pitch. PDF
    77311-122-33LF
    Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 33 Positions, 2.54 mm Pitch. PDF
    88902-233LF
    Amphenol Communications Solutions 5 Row Signal Header, Straight, Press-Fit, Wide body, 30 Position PDF
    10137926-2233LF
    Amphenol Communications Solutions Minitek® Pwr 3.0, Dual Row, Vertical SMT Tails and Hold Down Header, 15u\\ Gold (Tin on Tails) plating, Natural Color, 22 Positions, GW Compatible LCP, Tape and Reel with cap. PDF
    G97V22332HR
    Amphenol Communications Solutions Mini Cool Edge IO(MCIO), SFF-TA-1016, PCIe Gen 5, 85Ω, Surfacemount, Vertical, 74 Pin, PCIe, SAS, SFP, NVMe, cable, dual, card. PDF