TRAY LQFP Search Results

Kostat tray

Abstract: KS-8308 CAMTEX Kostat DAEWON tray 48 DAEWON tray drawing JEDEC Kostat CERAMIC PIN GRID ARRAY CPGA AMD daewon D-12G-56LD-A13
Contextual Info: u Chapter 7 Trays CHAPTER 7 TRAYS Introduction Design and Materials Device Count per Tray and Box Tray Suppliers per Package Type Tray Dimensions Packages and Packing Publication Revision A 3/1/03 7-1 u Chapter 7 Trays INTRODUCTION Trays are used instead of tubes to protect higher

5150Q

Abstract: S100GF-65-8ET
Contextual Info: Mounting Pad Packing NEC Tray JEDEC Tray Name LA-3510A-1 ST-TQ142014TJ-1 100 pin LQFP 14 x 20 Terminal Spacing Linear = 0.65 A B 80 81 51 50 Q F 31 30 100 1 G R S D C detail of lead end H I M J M P K N L NOTE ITEM Each lead centerline is located within 0.13 mm (0.005 inch) of

Contextual Info: Mounting Pad Packing NEC Tray JEDEC Tray Name LA-3A68A-1 ST-TQ242414TJ-1 TQFP 20x20 1.4mm 176 pin LQFP 24 × 24 Terminal Spacing Linear = 0.5 A B 132 133 89 88 detail of lead end C D S Q 176 1 R 45 44 F G H I M J P K M N NOTE ITEM Each lead centerline is located within 0.10 mm (0.004 inch) of

S100GC-50-8EU

Abstract: f 630
Contextual Info: Mounting Pad Packing NEC Tray Name LA-3566A-1 LA-0566A-1 JEDEC Tray TQFP 14x14×1.4 100 pin LQFP 14 × 14 A B 75 76 51 50 detail of lead end S C D Q R 26 25 100 1 F G H I M J K P M N NOTE Each lead centerline is located within 0.08 mm (0.003 inch) of its true position (T.P.) at maximum material condition.

LQFP Package tray

Abstract: 128-PIN nec 144 pin LQFP LQFP Package 128-pin LQFP 144 tray
Contextual Info: TRAY CONTAINER UNIT : mm 17.55 135°C MAX 22.63 25.40 17.80 22.63 100.8 A' LQFP 20x20×1.4 25.20 135.9 NEC A 279.4 315.0 322.6 SECTION A-A' 22.63 6.02 (6.35) 7.62 19.85 Applied Package Quantity (pcs) Material 128-pin Plastic LQFP (Fine Pitch) (1.4mm thick)

LQFP Package tray

Abstract: TQFP 1414 1.4mm JEDEC tray standard TQFP 1414
Contextual Info: HEAT PROOF 16.7 15.45 21.00 A' 6x15=90 A 150°CMAXPPE 7 105.0 TQFP 14×14×1.4 135.9 UNIT : mm 15.40 16.7 20.30 284.2 315.0 322.6 < SECTION A – A' > 16.7 5.62 6.35 7.62 13.85 Applied Package Quantity (pcs) 100-pin Plastic LQFP (1.4mm thick) MAX. 90 Tray

LQFP Package tray

Abstract: 128-PIN ST-TQ142014TJ-1 NEC 87 tray dimensions
Contextual Info: TRAY CONTAINER A' 15.45 16.64 21.00 150°C MAX. 7 A PPE ST-TQ142014TJ-1 135.9 105 UNIT : mm 22.64 25.40 17.80 279.4 315 322.6 SECTION A-A' 22.64 Applied Package 100-pin Plastic LQFP 1.4mm thick 128-pin Plastic LQFP (1.4mm thick) 5.62 6.35 7.62 19.87 Quantity (pcs)

ST-TQ142014TJ-1

Abstract: LQFP Package tray
Contextual Info: A' 15.45 16.64 21.00 150°C MAX. 7 A PPE ST-TQ142014TJ-1 135.9 105 UNIT : mm 22.64 25.40 17.80 279.4 315 322.6 SECTION A – A' 22.64 Applied Package 100-pin Plastic LQFP 1.4mm thick 5.62 6.35 7.62 19.87 Quantity (pcs) MAX. 72 Tray Material Heat Proof Temp.

LQFP144

Abstract: QFN24 tray qfp32 QFN tray QFP52-A2 QFP52-S1 SSOP20 DIP18 DIP20 DIP32
Contextual Info: PACKING SPECIFICATION TABLE • General Description NJRC delivers ICs in 4 methods, plastic tube container, two kinds of Taping, tray and vinyl bag packing. Except adhesive tape treated anti electrostatic and contain carbon are using as the ESD Electrostatic

LQFP1414-8bt Package tray

Abstract: LQFP Package tray h658 LQFP1414-8BT
Contextual Info: TRAY CONTAINER HEAT PROOF 7 A' 15.45 18.0 6x15=90 21.00 A 135°CMAXPPE 105.0 NEC LQFP1414−8BT 15.40 18.0 20.30 284.2 315.0 322.6 < SECTION A – A' > 18.0 5.62 (6.35) 13.85 7.62 135.9 UNIT : mm Applied Package 64-pin Plastic LQFP (1.4mm thick) 80-pin Plastic LQFP (1.4mm thick)

LQFP Package tray

Abstract: TQFP14X14X1 LQFP "100 pin" PACKAGE LQFP Package 128-pin 128-PIN tray container dimensions TRAY CONTAINER LQFP14 100-PIN PLASTIC LQFP NEC tqfp14x14x1.4
Contextual Info: TRAY CONTAINER 7 15.45 16.7 6x15=90 21.00 A' A 150°C MAX. PPE 105.0 TQFP14X14X1.4 15.40 16.7 20.30 284.2 315.0 322.6 Section A – A' 16.7 5.62 (6.35) 13.85 7.62 135.9 UNIT : mm Applied Package Quantity (pcs) 80-pin Plastic LQFP (1.4mm thick) 100-pin Plastic LQFP (1.4mm thick)

QFP JEDEC tray

Abstract: nec 44 pin LQFP LQFP Package tray NEC lqfp 52 JEDEC TRAY QFP JEDEC tray standard qfp tray standard nec 44pin QFp Package tray tray qfp 160 jedec
Contextual Info: TRAY CONTAINER HEAT PROOF 7 A' 15.20 13.10 12.5 PPE 135°C MAX NEC 15.70 A 8x20 = 160 13.00 109.9 LQFP 10×10×1.4 12.5 288.8 315.0 322.6 SECTION A-A' 12.50 Applied Package 6.12 (6.35) 9.90 7.62 135.9 UNIT : mm Quantity (pcs) 64-pin Plastic QFP (1.4mm thick)

lqfp64

Abstract: TRAY DIMENSIONS TQFP64 TQFP64 TQFP10
Contextual Info: FUJITSU SEMICONDUCTOR DATA SHEET LQFP64, TQFP64 Maximum storage capacity PKG code pcs/tray pcs/inner box pcs/outer box FPT-64P-M03 160 1600 9600 FPT-64P-M04 160 1600 9600 322.6 315 15.2 x 19 = 288.8 13.1 7.62 1.27 13.1 15.7 × 7 = 109.9 13 B 0.76 A A B 34.3

3510A

Abstract: LA10A LQFP Package tray
Contextual Info: Unit : mm 335±1.0 23.5±0.5 288±0.5 27.5±0.1 13.85 A' A 137.5±0.5 180±1.0 21.25±0.5 32±0.1 NEC LA–3510A–1 HEAT PROOF 19.85 SECTION A – A' 22.2 6.8 5.8 8.8 19.85 Applied Package Quantity pcs 100pin Plastic LQFP (1.4mm thick) MAX. 60 Tray LA-3510A-1

LQFP Package tray

Abstract: fine pitch LQFP24 JEDEC TRAY DIMENSIONS tray container dimensions LQFP-24
Contextual Info: TRAY CONTAINER HEAT PROOF 30.40 20.70 26.4 7 135°C MAX NEC PPE A' 20.70 A 4x10=40 31.50 94.5 LQFP24×24×1.4 135.9 UNIT : mm 26.4 273.6 315.0 322.6 SECTION A – A' 26.4 6.12 7.62 (6.35) 23.9 Applied Package Quantity (pcs) 160-pin • Plastic LQFP(Fine Pitch)(1.4mm thick)

LQFP Package tray

Abstract: JEDEC TRAY DIMENSIONS
Contextual Info: TRAY CONTAINER UNIT : mm 7 x 17=119 NEC 135° C MAX. A' 14.60 17.90 14.30 14.60 108.0 13.95 18.00 LQFP12 × 12× 1.4 135.9 PPE A 286.4 315.0 322.6 SECTION A-A' 14.60 5.62 (6.35) 7.62 11.82 Applied Package 64-pin Plastic LQFP (1.4mm thick) 80-pin Plastic LQFP (Fine Pitch)(1.4mm thick)

LQFP Package tray

Abstract: JEDEC TRAY DIMENSIONS tray container dimensions
Contextual Info: TRAY CONTAINER UNIT : mm 10 x 25=250 113.4 135.9 PPE NEC 135° C MAX. A' 9.60 11.25 12.60 LQFP7 × 7× 1.4 A 9.60 12.20 11.10 292.8 315.0 322.6 SECTION A-A' 9.60 5.62 (6.35) 7.62 6.82 Applied Package 48-pin Plastic LQFP (Fine Pitch)(1.4mm thick) 64-pin Plastic LQFP (Fine Pitch)(1.4mm thick)

Contextual Info: Packing Instruction Page:1/1 Tube and Tray Unit Quantity Update: June 3,2015 Description SRAM Product / Package 28 SOJ 25 ea / Tube 2,500 ea / 100 Tube / Box 10,000 ea / 4 Box / CTN 32 SOJ 22 ea / Tube 2,200 ea / 100 Tube / Box 8,800 ea / 4 Box / CTN 28 SOP

1f1-1717-a19

Abstract: 153FBGA BGA 6x6 tray FBGA tray kostat tray bga 6x6 169fbga-12.0x16.0-8x16-0 78BOC-11 78BOC ePAK BGA 5x5 tray 153FBGA-9
Contextual Info: Jul. 2010 Packing Tray Material Line-up Quantity Bake Temp. 8.1*15.1 8*12 ,256M DDR 5G 60WMBG Package 8*12 130℃ MAX 60M/54WBGA-8.10X15.10-8X12-A TR_MARKING LA69-00635A Material Code Material Spec 48TBGA,10.0*9.0(8*16) 8*16 130℃ MAX 48-TBGA-10.0X9.0-8X16-O

trays

Abstract: QFN Shipping Trays PEAK TRAY bga
Contextual Info: S PEC I FI C AT I ON SHE E T Matrix Trays Matrix T r ay s UltraLite designs Available Now Open Tooling for all popular configurations Quick-tur n, custom tooling ser vices Peak Matrix Trays conform to JEDEC standards and are available in a number of tray types including Pin Grid Array, Plastic Quad

Marking Code 2K

Contextual Info: EEPROM & Memory Card Code Information 1/2 Last Updated : August 2009 S5XXXXXXXX - XXXX 1 2 3 4 5 6 7 8 1. System LSI (S) 12. Package Type 1 : TEBGA A : SDIP C : CHIP BIZ E : LQFP G : CLCC J : ELP L : CERDIP N : COB Q : QFP S : SOP V : SSOP Y : FBGA 2. Large Classfication : MOS (5)

HM-RAE105

Abstract: RPG100 PEAK TRAY qfn 4 x 4 RPG100F RPG100-01 qfn 5 x 5 TRAY PEAK TRAY qfn
Contextual Info: HM-RAE105-1105 PACKAGE [ RPG100 ] 32-pin plastic LQFP 32-pin plastic LQFP Lead pitch 0.80mm Package width x package length 7 x 7 mm Lead shape Gullwing Sealing method Plastic mold Mounting height 1.70 mm MAX Note1 * :These dimensions do not include resin protrusion.

MS-026 lqfp 80

Abstract: DS170G MS-026 JEDEC Matrix Tray outlines LQFPPOWERQUAD2 CS-007
Contextual Info: LEADFRAME data sheet LQFP PowerQuad 2 Features: LQFP PowerQuad® 2 Packages: LQFP PowerQuad® 2 PQ2 is the same Amkor patented, advanced IC packaging technology used in plastic QFPs but applied to Low Profile 1.4 mm QFPs (LQFP). This breakthrough in IC packaging

JEDEC MS-026

Abstract: MS-026 Amkor mold compound lqfp 7x7 tray jedec MS-026-A
Contextual Info: LEADFRAME data sheet LQFP Features: Low Profile Quad Flat Pack LQFP Packages: Amkor offers a broad line of LQFP IC packages designed to provide the same great benefits as MQFP packaging with a 1.4 mm body thickness. This allows IC packaging engineers, component specifiers and systems designers