TRAY JEDEC Search Results

JEDEC TRAY DIMENSIONS

Abstract: JEDEC tray standard JEDEC tray standard 13 tsop Shipping Trays 32 jedec tray Shipping Trays jedec tray 32 0925D
Contextual Info: TRAY SPECIFICATIONS 32-pin TSOP-I Package Tray Critical Dimensions TEMP. RATING A B NOTES: 1. Surface electric resistivity of tray ranges from: < 1E+7 Ohm/sq. 2. The molded tray’s material shall be rigid enough to avoid damage to the components during handling, loading,

JEDEC TRAY DIMENSIONS

Abstract: JEDEC tray standard tsop Shipping Trays tsop-ii tray RAMTRON T944
Contextual Info: TRAY SPECIFICATIONS 44-pin TSOP-II Package Tray Critical Dimensions A B NOTES: 1. Surface electric resistivity of tray ranges from: 1E+5 to 1E+12 Ohm/sq. 2. The molded tray’s material shall be rigid enough to avoid damage to the components during handling, loading,

DAEWON tray drawing

Abstract: 124-48LD-119 DAEWON JEDEC TRAY daewon 1EC-08LD-919 Kostat tray daewon tray FBGA tray kostat Kostat TSOP Tray KS8503
Contextual Info: ‹ Chapter 5 Trays CHAPTER 5 TRAYS Introduction Design and Materials Device Count per Tray and Box Tray Suppliers Tray Dimensions Packages and Packing Methodologies Handbook 17 Oct 2008 5-1 ‹ Chapter 5 Trays INTRODUCTION Trays are used instead of tubes to protect

Kostat tray

Abstract: KS-8308 CAMTEX Kostat DAEWON tray 48 DAEWON tray drawing JEDEC Kostat CERAMIC PIN GRID ARRAY CPGA AMD daewon D-12G-56LD-A13
Contextual Info: u Chapter 7 Trays CHAPTER 7 TRAYS Introduction Design and Materials Device Count per Tray and Box Tray Suppliers per Package Type Tray Dimensions Packages and Packing Publication Revision A 3/1/03 7-1 u Chapter 7 Trays INTRODUCTION Trays are used instead of tubes to protect higher

pd0008

Abstract: tray 8 x 8 TSOP TRAY 40 PIN TSOP package tray N1N213 Package and Packing Information ST
Contextual Info: PD0008 Packing information Tray for TSOP packages type 1 Introduction TSOP type-1 packages can be supplied in tray packing. Refer to Table 1 for the list of TSOP type-1 packages supplied in trays. The objective of this document is provide a detailed description of the tray. It applies to all

Package tray

Abstract: OT-007TM-01 PPO datasheet jedec Package QFP JEDEC tray JEDEC tray
Contextual Info: 77.46 29.22 135.9 OT-007TM-01 UNIT : mm A 50.56 31.10 A' 252.8 315 322.6 <SECTION A - A'> 4.12 7.62 6.35 39.57 48.8 Tray Material Heat Proof Temp. Surface resistance OT-007TM-01 JEDEC Tray Carbon PPO 125°C less than 1x106Ω / Applied Package Quantity(PCS)

JEDEC TRAY DIMENSIONS

Abstract: JEDEC tray standard OT-007TM-01 JEDEC tray QFP JEDEC tray JEDEC tray standard 10 TRAY MATERIAL
Contextual Info: 39.57 135°C MAX 77.46 29.22 135.9 OT-007TM-01 UNIT : mm A 50.56 31.10 A' 39.57 252.8 315 322.6 <SECTION A - A'> 4.12 6.35 7.62 39.57 48.8 Tray OT-007TM-01 (JEDEC Tray) Material Carbon PPO Heat Proof Temp. Surface resistance 135°C 12 less than 1 x 10 Ω /

LA-072

Abstract: PGA JEDEC tray 216-0016
Contextual Info: Packing Name NEC Tray LA-072 JEDEC Tray PGA 21x21 528 pin Ceramic PGA Seam Weld A D (Bottom View) J I G H Index mark Orientation pin N K L φM E M F NOTE Each lead centerline is located within φ 0.254 mm (φ 0.010 inch) of its true position (T.P.) at maximum material condition.

PGA weight

Abstract: jedec bottom LA-072 PGA JEDEC tray
Contextual Info: Packing Name NEC Tray LA-072 JEDEC Tray PGA 21x21 528 pin Ceramic PGA Seam Weld (Bottom View) A D Index mark Index mark I V W L φM M F E G J NOTE Each lead centerline is located within φ 0.254 mm (φ 0.01 inch) of its true position (T.P.) at maximum material condition.

PGA weight

Abstract: PGA JEDEC tray
Contextual Info: Packing Name NEC Tray LA-A76 JEDEC Tray PGA 20x20 447 pin Ceramic PGA Seam Weld A B D P C Q (Bottom View) R H G S T J I Index mark K L φM N E M F NOTE Each lead centerline is located within φ 0.254 mm (φ 0.010 inch) of its true position (T.P.) at maximum material condition.

QFP JEDEC tray

Contextual Info: Mounting Pad Packing NEC Tray JEDEC Tray Name LA-3A68A-1 ST-TQ242414TJ-1 160 pin QFP 24 x 24 Terminal Spacing Linear = 0.5 A B 81 80 120 121 detail of lead end C D S Q 41 40 160 1 F G H I M J P K N NOTE S160GM-50-8ED-2 EIAJ CODE Weight (Reference Value)

240-pin

Abstract: LA-3522A-1
Contextual Info: Mounting Pad Packing NEC Tray JEDEC Tray Name LA-3522A-1 MQFP 32x32 3.2mm 240 pin QFP 32 × 32 Terminal Spacing Linear = 0.5 A B 180 181 121 120 detail of lead end S C D R Q 240 1 F G 61 60 H I J M P K M N S L NOTE ITEM 1. Controlling dimention millimeter.

13x13

Abstract: nec 13A JEDEC tray standard SSD-A-H7551-1 FBGA13x13A JEDEC TRAY 10 X 10 TRAY DIMENSIONS JEDEC TRAY DIMENSIONS
Contextual Info: TRAY CONTAINER UNIT : mm 8x19=152 135.9 112.0 PPE A A 11.95 13.50 16.00 135°CMAX NEC FBGA13×13A 16.15 13.50 290.7 315.0 322.6 12.15 <SECTION A-A> 13.5±0.05 (6.03) 7.62 5.62 13.00 Applied Package Quantity(pcs) 144-pin Plastic FBGA(13x13) Tray Material

nec 2565

Abstract: NEC C 324 C 2565 nec nec 1026 JEDEC TRAY DIMENSIONS BGA package tray tray bga
Contextual Info: TRAY CONTAINER 135°C MAX 19.65 NEC 102.6 A' 16.65 25.65 FBGA 19x19A A 19.65 22.00 286.0 14.50 315.0 322.6 SECTION A-A' (5.62) (5.80) 19.65 19.00 7.62 135.9 PPE 5×14=70 UNIT : mm Applied Package Quantity (pcs) 324-pin Plastic BGA (19×19) 70 MAX. Tray

676 BGA package tray

Abstract: BGA package tray NEC 2415 tray bga 676-Pin 596-PIN 27ES jedec tray BGA tray datasheet bga BGA JEDEC tray
Contextual Info: TRAY CONTAINER UNIT : mm 4x10=40 NEC 7 135°C MAX. 27.50 29.20 262.8 315.0 322.6 26.10 Section A – A' 27.50 27.00 (5.95) (6.35) 7.62 27.50 29.20 87.6 BGA27×27ESP A' 24.15 135.9 PPE A Applied Package Quantity (pcs) Tray BGA27×27ESP 225-pin Plastic BGA (27×27)

fBGA package tray

Abstract: JEDEC FBGA FBGA tray JEDEC TRAY DIMENSIONS FBGA NEC 208pin FBGA JEDEC tray JEDEC tray standard
Contextual Info: TRAY CONTAINER 110.1 A A' 7 135°C MAX 15.74 18.35 FBGA15x15ESP 12.90 NEC 135.9 PPE 7×17=119 Unit : mm 15.74 18.10 289.6 12.70 315.0 322.6 SECTION A – A' 15.74 (5.91) 5.62 7.62 15.00 Applied Package Quantity(PCS) Tray FBGA 15×15ESP 176-pin PLASTIC FBGA (15×15)

fBGA package tray 12

Abstract: JEDEC TRAY DIMENSIONS FBGA JEDEC FBGA 236-PIN fBGA package tray FBGA-10 FBGA10 236PIN 277-PIN
Contextual Info: TRAY CONTAINER NEC A' 10.65 7 135°C MAX. 12.80 A FBGA10x10ESP 10.35 135.9 115.2 PPE 10×24=240 UNIT : mm 10.65 12.80 10.30 294.4 315.0 322.6 SECTION A – A' 10.65 (5.95) (5.62) 7.62 10.00 Applied Package Quantity (pcs) FBGA10×10 ESP Tray 113-pin Plastic FBGA (10×10)

fBGA package tray

Contextual Info: TRAY CONTAINER NEC 119.6 7 FBGA8x6ESP 135°C MAX. A' 6.50 9.20 A 8.50 10.60 296.8 9.10 315.0 322.6 8.50 8.00 (5.62) (5.91) Section A – A' 7.62 8.15 135.9 PPE 14×29=406 UNIT : mm Applied Package 48-pin Plastic FBGA (8×6) Quantity (pcs) 406 MAX. Tray

IC TRAY

Abstract: IC 8898 8641 6 pin ic
Contextual Info: M55 Sect 7 p104-115 M 10/15/06 4:09 PM Page 114 ANTI-STATIC IC TRAY CLIP The unique color coded Anti-Static IC Tray Clip, is a patent pending design and can be used for the following applications: .067 [1.70] .394 [10.0] .205 [5.21] .197 [5.00] .185 [4.7]

8641 6 pin ic

Abstract: ic tray 8641 sot23-6
Contextual Info: M60 Section 7 FREV2:11-2011 11/20/11 2:46 PM Page 122 ANTI-STATIC IC TRAY CLIP The unique color coded Anti-Static IC Tray Clip, is a patent pending design and can be used for the following applications: .075 [1.90] .394 [10.0] .205 [5.2] .197 [5.01] .185 [4.7]

Contextual Info: Mounting Pad Packing NEC Tray Name LA-3508A-1 JEDEC Tray OT-001T-01 160 pin QFP 28 x 28 Terminal Spacing Linear = 0.65 A B 120 121 81 80 detail of lead end C S D R Q 41 40 160 1 F G P H I M J K M N NOTE ITEM Each lead centerline is located within 0.13 mm (0.005 inch) of

NEC 2701

Abstract: 144 pin qfp 2701 NEC B108 JEDEC tray dimension NEC 596 S144GJ-50-3EN-3
Contextual Info: Mounting Pad Packing NEC Tray JEDEC Tray Name LA-3519A-1 LA-0519A-1 MQFP 20x20 2.7mm 144 pin QFP 20 × 20 Terminal Spacing Linear = 0.5 A B 108 109 73 72 detail of lead end S C D R Q 144 1 37 36 F G H I J M K P S N S L NOTE 1. Controlling dimension millimeter.

216-pin

Contextual Info: Mounting Pad Packing NEC Tray JEDEC Tray Name LA-3A68A-1 ST-TQ242414TJ-1 216 pin QFP 24 x 24 Terminal Spacing Linear = 0.4 A B 162 163 109 108 detail of lead end C D S R Q 216 1 F G 55 54 H I M P J K M N L NOTE Each lead centerline is located within 0.07 mm (0.003 inch) of

QFP40

Abstract: P304GL-50-NMU JEDEC TRAY mQFP
Contextual Info: Mounting Pad Packing Name NEC Tray LA-A41A JEDEC Tray MQFP 40x40 3.7mm 304 pin QFP 40 × 40 Terminal Spacing Linear = 0.5 A B 228 229 153 152 detail of lead end S C D R Q 77 76 304 1 F G H I J M P K M N NOTE ITEM Each lead centerline is located within 0.10 mm (0.004 inch) of