TR AK40 Search Results

Contextual Info: GaAs SPDT FET MMIC 4 Watt TR Switch ESAlph in 8 Lead SOIC Package DC-2.5 GHz AH002R2-12 Features • TR Switch ■ Low Insertion Loss < 0.5 dB @ 900 MHz ■ Designed for Cellular Radio Applications ■ Medium Power Handling Capability, 1 dB Compressed at 5W, 900 MHz, -1 0 V Bias

Contextual Info: GaAs MIMIC FET10 Watt Diversity Switch In 14 Lead SOIC DC-1.6 GHz ËBAlph ADH01D2-24 Features • High Power Handling Capability P -1 dB > 10W ■ Independent Four Port Switching ■ Portable Radio TR Switching ■ Individual Voltage Control on Each Port

Contextual Info: GaAs MMIC FET10 Watt Diversity Switch In 14 Lead SOIC DC-1.6 GHz ADHD1D2-24 Features • High Power Handling Capability P - 1 dB > 10W ■ Two Line Voltage Control ■ Independent Four Port Switching ■ Portable Radio TR Switching Description The A D H D 1D 2-24 is a 4 port switch with two line DC

AK-804 164-1-1

Abstract: AK401 AK406
Contextual Info: ASSMANN Extension Cables, serial & parallel Electronic C o m p o n en ts Examples o f application Part No. AK 401 AKS08 AK402 AK 403 2 x D-SUB-mate, 25 pins ÌUm extension for 25 pins Interlaces, serial parallel connected 1:1, fo il shielding AK404 A l a

dvh6731

Abstract: CVH2030-01 CVH2030-01-023-001 CVH2030-01-099-001 CVH2030-01-247-001 CVH2030-02 DVH6731-13 CVH2030-22-099-001 DVH6731-12 DVH6731-19
Contextual Info: Silicon Abrupt Varactor Diodes S3 Alpha CVH2030 Series Features • Low S eries R esistance - High Q ■ E xtensive Selection of C apacitan ce Values ■ A vailable in a W id e R a n g e of P ackage Outlines and in D ie Form Description Maximum Ratings T h e silicon abrupt junction varactor diode changes

AS117-45

Abstract: AD004T2-00 AK006R2-01
Contextual Info: GaAs MMIC FET10 Watt Diversity Switch In SOW 16 Package DC-2.0 GHz • " " ■ ■ ■ « ■ ■ ■ 03 Alpha t v ■,. : v r - r ^ - .n I ^w A S 11 7 -4 5 Features High Power P - 1 dB > 10 Watts Integrated Decoder Chip that Provides Two Line Voltage Control

Contextual Info: GaAs MMIC FET10 Watt Diversity Switch In SOW 16 Package DC-2.0 GHz • " " ■ ■ ■ « ■ ■ ■ 03 A lpha r - r ^ - .n I t v ■,. : v ^ w AS11 7 -4 5 Features High Power P - 1 dB > 10 Watts Integrated Decoder Chip that Provides Two Line Voltage Control

Contextual Info: GaAs Dual Antenna T/R Switch DC-2.5 GHz EBAJ AS113-24 Features • T ransm it to either o f Tw o A n te nn a Ports ■ R eceive from both A n te nn a Ports ■ O perates w ith 0, - 5 Volts ■ Low DC P ow er C onsum ption ■ Low C ost Plastic P ackage Description

AK41128

Abstract: AK42064
Contextual Info: HIGH DENSITY DYNAMIC RANDCM ACCESS MEMORY MODULES ACCUTEK DESCRIPTION The Accutek family of high density dynamic RAM modules are comprised of 64K x 1 or 256K x 1 dynamic RAMs packaged in LCCs or PLCCs along with chip capacitors, mounted to multi-layer ceramic

220v AC voltage stabilizer schematic diagram

Abstract: LG color tv Circuit Diagram tda 9370 1000w inverter PURE SINE WAVE schematic diagram schematic diagram atx Power supply 500w TV SHARP IC TDA 9381 PS circuit diagram wireless spy camera 9744 mini mainboard v1.2 sony 279-87 transistor E 13005-2 superpro lx
Contextual Info: QUICK INDEX NEW IN THIS ISSUE! Detailed Index - See Pages 3-24 AD9272 Analog Front End, iMEMS Accelerometers & Gyroscopes . . . . . . 782, 2583 Connectors, Cable Assemblies, IC Sockets . . . . . . . . . . . 28-528 Acceleration and Pressure Sensors . . . . . . . . . . . . . . . . . . . . . . . . . . Page 2585

schematic diagram atx Power supply 500w

Abstract: pioneer PAL 012A 1000w inverter PURE SINE WAVE schematic diagram 600va numeric ups circuit diagrams winbond bios 25064 TLE 9180 infineon smsc MEC 1300 nu TBE schematic diagram inverter 2000w DK55 circuit diagram of luminous 600va UPS
Contextual Info: QUICK INDEX NEW IN THIS ISSUE! Detailed Index - See Pages 3-24 Digital Signal Processors, iCoupler , iMEMS® and iSensor . . . . . 805, 2707, 2768-2769 Connectors, Cable Assemblies, IC Sockets . . . . . . . . . . . 28-568 RF Connectors . . . . . . . . . . . . . . . . . . . . . . Pages 454-455

c1842

Abstract: SMC HF 270
Contextual Info: Ceramic Packaged Surface Mount PIN Diodes SMC1800 Series Features • Industry Standard Outline ■ Hermetically Sealed Ceramic Package ■ Non-Rollable Surface Mount Design ■ Full Face PIN diode Chip Bond ■ For High Performance Switches and Attenuators

LTR1702-03

Abstract: 502001 hf 01801 LTR1701-01 LTR1701-02 LTR1701-03 LTR1702-01 LTR1702-02 Alpha Industries pin diodes
Contextual Info: El A lpha Low Thermal Resistance, High Power Double Slug PIN Diodes LTR1701, LTR1702, LTR1704 Series Features • Hermetically Sealed ■ 0.6 nH Inductance ■ 500 Volt Breakdown ■ 1.0 to 2.0 pF Capacitance ■ 0.25 Ohm Series Resistance ■ 2.5 W att Power Dissipation

smd marking BA13

Abstract: smd marking G28 ad38 SMD qml-38535 marking ZZA SMD MARKING CODE P28 TR AK40 smd code AA5 smd marking CODE G28 MO-192-BAU-1
Contextual Info: REVISIONS LTR DESCRIPTION DATE APPROVED Y R -M O -D A REV SHEET 35 36 37 38 39 40 41 15 16 17 18 19 20 21 22 23 24 25 26 26 28 29 30 31 32 33 34 1 2 3 4 5 6 7 8 9 10 11 12 13 14 REV SHEET REV STATUS OF SHEETS REV SHEET PMIC N/A STANDARD MICROCIRCUIT DRAWING

type bb12

Abstract: AG07 ag-07 T40 N03 st BC03 AT04 4 PINS
Contextual Info: Pin Assignment 4 Pinout and Signal Descriptions S ectio n s 4.1 and 4 .2 list an d d escrib e the 2 1 1 6 4 m icro p ro c esso r e x te rn al signals and th eir asso c ia te d pins. 4.1 Pin Assignment T h e 2 1 1 6 4 h as 499 pins alig n ed in an in terstitial pin grid array IP G A design.

9LPR310BGLF

Abstract: CLEVO samsung led tv ue service manual samsung lcd tv power supply schematic rqa130 PCI7412 2sd 588 IT8510TE CMS PJ 86 LV C8738
Contextual Info: Preface Notebook Computer M540/M545N/M550/M555N Service Manual Preface I Preface Notice The company reserves the right to revise this publication or to change its contents without notice. Information contained herein is for reference only and does not constitute a commitment on the part of the manufacturer or any subsequent vendor. They assume no responsibility or liability for any errors or inaccuracies that may appear in this publication nor are

TR AK40

Abstract: st BC03 RRU W01 AF06 BC-09 ak02 bb04 AG07
Contextual Info: 4 Pinout and Signal Descriptions Sections 4.1 and 4.2 list and describe the 21164 microprocessor external signals, and th eir associated pint . 4.1 Pin Assignment The 21164 package has 499 pins aligned in an in te rstitial pin grid array IPGA design. Table 1 lists the ¿1164 signal pins and th eir corresponding pin

S8050M

Abstract: BC39 av30 ate transistors BC23 equivalent for S AV36 EPF81188 ALTERA flex 81188
Contextual Info: ÆQüI^ August 1994, ver. 1 Features □ □ □ □ □ Architecture Description I* FLEX 8000M Programmable Logic Device Data Sheet P relim inary Inform ation *1 >1 EPF8050M 50,000 usable gates ideal for ASIC prototyping C o m b in atio n of fo u r E P F 8 1 1 8 8 d e v ice s and one Field

Alcor AU6366

Abstract: TP16460 cpu socket mPGA479m RS600ME TP16319 amd rs600 R5538 F38 ICP 218s6ecla21fg ICS951461
Contextual Info: 4 3 2 1 SAMSUNG PROPRIETARY THIS DOCUMENT CONTAINS CONFIDENTIAL PROPRIETARY INFORMATION THAT IS SAMSUNG ELECTRONICS CO’S PROPERTY. DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS EXCEPT AS AUTHORIZED BY SAMSUNG. Table of Contents D TORINO 2 VE CPU :INTEL MEROM

tp1322

Abstract: ICS951461 218s6ecla21fg tp1217 88E8040 SOCK-30P-2R-SMD-MNT 39B4 Marvell 88E8055 SAMSUNG ELECTRONICS BA41 TP1215
Contextual Info: 4 3 2 1 SAMSUNG PROPRIETARY THIS DOCUMENT CONTAINS CONFIDENTIAL PROPRIETARY INFORMATION THAT IS SAMSUNG ELECTRONICS CO’S PROPERTY. DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS EXCEPT AS AUTHORIZED BY SAMSUNG. Table of Contents D XI’AN CPU :INTEL MEROM/PENRYN

TP1230

Abstract: SOCK-30P-2R-SMD-MNT 88E8040 U5025 218S6ECLA21FG ICS951461 TP1319 tp1217 DTP60-8 TP1322
Contextual Info: 4 3 2 1 SAMSUNG PROPRIETARY THIS DOCUMENT CONTAINS CONFIDENTIAL PROPRIETARY INFORMATION THAT IS SAMSUNG ELECTRONICS CO’S PROPERTY. DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS EXCEPT AS AUTHORIZED BY SAMSUNG. Table of Contents D XI’AN g n l u a s i t m www.kythuatvitinh.com

7555-T

Abstract: M1FM3
Contextual Info: Al t hough we ar e cons t ant l ymak i ng ev er yef f or tt oi mpr ov et he qual i t yand r el i abi l i t yofourpr oduct s ,t her enev er t hel es sr emai nsacer t ai npr obabi l i t yt hatt he s emi conduct orpr oduct smayoccas i onal l yf ai lormal f unct

kbc 1070 nu

Abstract: KBC 1091 NU MXL 603 vcc3 1156 09 A52 infineon b 58 468 la intel 80 KBC 1098 NU smsc kbc 1091 KBC 1091- NU C5191 hcl p38 CIRCUIT diagram
Contextual Info: 5 4 MAX8743 1.8V & VCCP 3 2 TA6 SYSTEM BLOCK DIAGRAM P32 X 'TA L 14.318M MAX1541 (1.5 & VGACORE) P34 D 1 CPU Thermal Sensor P3 Intel CPU Yonah/Merom V C C _ C ORE GMCH_ V T T V C CA DISCHARGE P33 CK-GEN CK410M +3V +5V 479 Pins (uPGA) P2 D P3,4 VIDEO RAM

TMPRFE2G5

Abstract: MARS2G5 bey34 DIODE BA40 LVTTL25
Contextual Info: Hardware Design Guide September 8, 2004 MARS2G5 P-VC-XTRM TMPRFE2G5 Datamapper 2488/622/155 Mbits/s SONET/SDH x 10/100/1000 Mbits/s Ethernet 1 Introduction The documentation package for the Datamapper device consists of the following documents, available on a password protected website: