TQFP-64 PACKAGE THERMAL RESISTANCE Search Results

tqfp 44 thermal resistance

Abstract: tqfp 64 thermal resistance CPGA MQUAD PQFP-128 TQFP 132 PACKAGE Package 48 LCC CQFP 240
Contextual Info: Thermal Resistance of Packages 4401035 NC Thermal Resistance of Packages Similarly, thermal resistance from junction to case is denoted by θ JC , and defined by θ JC = T j – T c ⁄ P d ; here, T c is the case temperature (˚C) at the external surface of the package.

BC 1098

Abstract: EPM7384 ALTERA 68 PLCC t187
Contextual Info: Altera Device Package Information June 1998, ver. 7.01 Introduction Data Sheet This data sheet provides the following package information for all Altera¨ devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.

LFXP2-8E

Abstract: LFXP2-40E LFXP2-5E LFXP20C theta jc FCBGA LFXP2-17E LFE3-17 Theta JB LFXP15C LFXP2-8E 132
Contextual Info: Thermal Management July 2009 Introduction Thermal management is recommended as part of any sound CPLD and FPGA design methodology. To properly assess the thermal characteristics of the system, Lattice Semiconductor specifies a maximum allowable junction temperature in all device data sheets. The system designer should always complete a thermal analysis of their specific design to ensure that the device and package does not exceed the junction temperature requirements.

texas instruments packing label

Abstract: SPAD Eftec 64t PZT144 CDC582 TEXAS INSTRUMENTS, Mold Compound EN-4085S2K3 eftec 45 EN-4085S2 eftec+64
Contextual Info: TEXAS INSTRUMENTS Notification for the Qualification of the S-Pad Leadframe Conversion for Certain TQFP Packages October 17, 1995 Abstract Texas Instruments Advanced System Logic ASL is converting conventionally designed leadframes to the newly designed Small Pad (S-Pad) leadframe. This breakthrough in device packaging will make

100 PIN "PGA" ALTERA DIMENSION

Contextual Info: Altera Device Package Information June 1996, ver. 6 Introduction Data Sheet This data sheet provides the following package information for all Altera devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in ascending pin count order.

altera ep610

Abstract: EPM5130 240 PIN QFP ALTERA DIMENSION epm7064s cross reference 192PGA EPF10K100 EPF10K20 EPF10K30 EPF10K40 EPF10K50
Contextual Info: Altera Device Package Information June 1996, ver. 6 Introduction Data Sheet This data sheet provides the following package information for all Altera devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in ascending pin count order.

LQFP-48 thermal pad

Abstract: CS-007 TQFP 100 pin ic pcb design 0,5 mm pitch 5x5 matrix LD176 tqfp 7x7 tqfp 7x7 1.4 tray tqfp 7x7 tray LD48
Contextual Info: LEADFRAME data sheet ExposedPad LQFP / TQFP Features ExposedPad LQFP/TQFP Packages: This Amkor-developed family of power IC packages significantly increases the thermal efficiency of power constrained standard LQFP and TQFP packages. The ExposedPad LQFP /

TQFP 100 pin ic

Abstract: 208ld
Contextual Info: LEADFRAME data sheet ExposedPad LQFP / TQFP Features: ExposedPad LQFP/TQFP Packages: This Amkor-developed family of power IC packages significantly increases the thermal efficiency of power constrained standard LQFP and TQFP packages. The ExposedPad LQFP /

4572 IC 8PIN

Abstract: epx780 TQFP 144 PACKAGE DIMENSION ALTERA EP610
Contextual Info: Altera Device Package Information J u n e 1995, ver. 6 Introduction Data Sheet This data sh eet p rovid es the fo llo w in g package inform ation for all Altera devices: • ■ ■ ■ Lead materials Thermal resistance Package w eig h ts Package outlines

PCMCIA Design

Abstract: TQFP 132 PACKAGE SN74ACT3641 tqfp 64 thermal resistance
Contextual Info: FIFO Surface-Mount Packages for PCMCIA Applications Tom Jackson Advanced System Logic – Semiconductor Group SDMA001A 69 IMPORTANT NOTICE Texas Instruments TI reserves the right to make changes to its products or to discontinue any semiconductor product or service without notice, and advises its customers to obtain the latest version of relevant information

TQFP 132 PACKAGE

Abstract: PCMCIA CARD, Static Memory, dual battery TQFP-120 SN74ACT3641
Contextual Info: FIFO Surface-Mount Packages for PCMCIA Applications Tom Jackson Advanced System Logic – Semiconductor Group SDMA001A 69 IMPORTANT NOTICE Texas Instruments TI reserves the right to make changes to its products or to discontinue any semiconductor product or service without notice, and advises its customers to obtain the latest version of relevant information

tqfp 44 thermal resistance datasheet

Abstract: plcc junction to ambient resistance EPAD-TQFP-64 tqfp 64 thermal resistance
Contextual Info: THERMAL MANAGEMENT Semiconductor devices dissipate heat while operating. Device junction temperature is a function of : 1 the amount of power dissipated in the circuit, and (2) the net thermal resistance between the heat source and a reference point such as the surrounding ambient of still air. It has been well

EP4CE6 package

Abstract: EP4CE40 Altera EP4CE6 EP4CE55 5M240Z 5M1270Z QFN148 5m570z 5M40 5M80
Contextual Info: Package Information Datasheet for Altera Devices DS-PKG-16.3 This datasheet provides package and thermal resistance information for Altera devices. Package information includes the ordering code reference, package acronym, leadframe material, lead finish plating , JEDEC outline reference, lead

ATSAMD21G18

Contextual Info: Atmel SAM D21E / SAM D21G / SAM D21J SMART ARM-Based Microcontroller DATASHEET SUMMARY Description The Atmel | SMART SAM D21 is a series of low-power microcontrollers using the 32-bit ARM® Cortex®-M0+ processor, and ranging from 32- to 64-pins with up to 256KB Flash and

ATMEL Tape and Reel drawing

Abstract: ATMEL Tape and Reel code JEDEC Drawing MO-220 qfn48 Atmel Moisture sensitivity level Moisture/ATMEL Tape and Reel QFN-64 ATSAMD21G18
Contextual Info: Atmel SAM D21E / SAM D21G / SAM D21J SMART ARM-Based Microcontroller DATASHEET SUMMARY Description The Atmel | SMART SAM D21 is a series of low-power microcontrollers using the 32-bit ARM® Cortex®-M0+ processor, and ranging from 32- to 64-pins with up to 256KB Flash and

BD 4914

Abstract: QFN 76 9x9 footprint qfn 48 7x7 stencil QFN 64 8x8 footprint QFN 64 9x9 footprint land pattern BGA 0.75 freescale QFN 56 7x7 footprint QFN PCB Layout guide Motorola MAP QFN MO-220 8x8
Contextual Info: Freescale Semiconductor, Inc. Application Note AN1902/D REV. 2, 03/2002 QUAD FLAT PACK NO-LEAD QFN Freescale Semiconductor, Inc. 1.0 PURPOSE This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level reliability, electrical parasitic and thermal resistance data are included as reference.

TQFP 100 pin ic

Abstract: tqfp 7x7 1.4 tray tqfp 7x7 tray MS-026 JEDEC tray standard 17 x 17 tqfp 64 thermal resistance MS-026 TQFP TQFP Package 44 lead tqfp 32 thermal resistance CO-124
Contextual Info: LEADFRAME data sheet TQFP Features: Thin Quad Flat Pack TQFP Packages: Amkor offers a broad line of TQFP IC packages. IC packaging engineers, component specifiers and systems designers will find our TQFPs help to solve issues such as increasing board density, die shrink

PHD64

Abstract: land pattern for vsop 8 pins land pattern for vsop DCA56 PFC80 PZT10 DED28 DFD64 DAP38 PWD14
Contextual Info: PowerPAD - A Method To Create Thermally Enhanced Plastic Package Solutions for Semiconductors Milton L. Buschbom, Mark Peterson, Shih-Fang Chuang, David Kee, and Buford Carter Texas Instruments, Incorporated Dallas, Texas f = switching frequency in Hz N = number of gates switched/clock cycle

ATSAMD21G18

Contextual Info: Atmel SAM D21E / SAM D21G / SAM D21J ARM-Based Microcontroller PRELIMINARY DATASHEET SUMMARY Description The Atmel SAM D21 is a series of low-power microcontrollers using the 32-bit ARM® Cortex®M0+ processor, and ranging from 32- to 64-pins with up to 256KB Flash and 32KB of SRAM. The

ATSAMd21g18

Abstract: JEDEC Drawing MO-220 qfn48
Contextual Info: Atmel SAM D21E / SAM D21G / SAM D21J ARM-Based Microcontroller PRELIMINARY DATASHEET SUMMARY Description The Atmel SAM D21 is a series of low-power microcontrollers using the 32-bit ARM® Cortex®M0+ processor, and ranging from 32- to 64-pins with up to 256KB Flash and 32KB of SRAM. The

JESD51-8

Abstract: JESD51-2 JEDEC JESD51-8 qfn 44 PACKAGE footprint 9mm surface mount package dimensions FREESCALE PACKING jesd51 8 JEDEC-STD-020 JEDEC-STD020 tqfp 44 PACKAGE footprint
Contextual Info: Freescale Semiconductor, Inc. ANALOG ICs INTEGRATED SOLUTIONS Freescale Semiconductor, Inc. PACKAGING Robust packaging is a key technology component of Analog Products. Motorola puts solutions together in single packages to accomodate power and high voltages.

MEC1609

Abstract: SCH5147 os81092 OS81050 mec1308 OS81110 HYC5000 OS81060 SIO1028 SCH5627
Contextual Info: CORPORATE PRODUCT OVERVIEW 2010 Providing Mixed-Signal IC solutions that enable connectivity and networking in consumer electronics, automotive infotainment, PC and industrial applications PC SYSTEM + MOST I/O CONTROLLERS USB ETHERNET Digital Cameras, HDTVs, Set-top Boxes,

Contextual Info: Atmel SAM D20J / SAM D20G / SAM D20E ARM-Based Microcontroller DATASHEET SUMMARY Description The Atmel SAM D20 is a series of low-power microcontrollers using the 32-bit ARM® Cortex®-M0+ processor, and ranging from 32- to 64-pins with up to 256KB Flash and

ATSAMD21G18

Contextual Info: Atmel SAM D21E / SAM D21G / SAM D21J SMART ARM-Based Microcontroller DATASHEET SUMMARY Description The Atmel | SMART SAM D21 is a series of low-power microcontrollers using the 32-bit ARM® Cortex®-M0+ processor, and ranging from 32- to 64-pins with up to 256KB Flash and