TQFP JEDEC TRAY Search Results

JEDEC TQFP 10*10 1.0 MM

Contextual Info: Mounting Pad Packing NEC Tray JEDEC Tray Name LA-3A73B-1 TQFP 10x10 1.0T 64 pin TQFP 10 × 10 Terminal Spacing Linear = 0.5 A B 48 33 32 49 F 64 R Q S D C detail of lead end 17 16 1 G H I M J M P K N L NOTE ITEM Each lead centerline is located within 0.10 mm (0.004 inch) of

144 pin qfp

Contextual Info: Mounting Pad Packing NEC Tray JEDEC Tray Name LA-3523A-1 TQFP 20x20 1.4mm 144 pin QFP 20 × 20 Terminal Spacing Linear = 0.5 A B 108 109 73 72 detail of lead end C D S R Q 144 1 37 36 F G H I M J K P M N NOTE Each lead centerline is located within 0.10 mm (0.004 inch) of

Contextual Info: Mounting Pad Packing NEC Tray JEDEC Tray Name LA-3A87A-1 TQFP 28x28 1.4mm 208 pin QFP 28 × 28 Terminal Spacing Linear = 0.5 A B 156 157 105 104 detail of lead end C D S Q 53 52 208 1 F G H I J M K P M N NOTE L ITEM Each lead centerline is located within 0.10 mm (0.004 inch) of

Contextual Info: Mounting Pad Packing NEC Tray JEDEC Tray Name LA-3A68A-1 ST-TQ242414TJ-1 TQFP 20x20 1.4mm 176 pin LQFP 24 × 24 Terminal Spacing Linear = 0.5 A B 132 133 89 88 detail of lead end C D S Q 176 1 R 45 44 F G H I M J P K M N NOTE ITEM Each lead centerline is located within 0.10 mm (0.004 inch) of

S100GC-50-8EU

Abstract: f 630
Contextual Info: Mounting Pad Packing NEC Tray Name LA-3566A-1 LA-0566A-1 JEDEC Tray TQFP 14x14×1.4 100 pin LQFP 14 × 14 A B 75 76 51 50 detail of lead end S C D Q R 26 25 100 1 F G H I M J K P M N NOTE Each lead centerline is located within 0.08 mm (0.003 inch) of its true position (T.P.) at maximum material condition.

JEDEC TRAY DIMENSIONS

Abstract: JEDEC tray standard TQFP JEDEC tray JEDEC tray standard TQFP TRAY DIMENSIONS TRAY CONTAINER tray container dimensions TQFP 100 PACKAGE TQFP 80 PACKAGE TRAY DIMENSIONS TQFP 64
Contextual Info: TRAY CONTAINER 7 A' 14.7 17.90 14.30 14.7 135 °C MAX. 18.00 13.95 TOFP12x12×1.0 A NEC 108.0 135.9 PPE 7×17=119 UNIT : mm 286.4 315.0 322.6 SECTION A – A' 14.70 Applied Package 6.22 (6.35) 7.62 12.00 Quantity (pcs) 64-pin Plastic TQFP(1.0mm thick) 80-pin Plastic TQFP(1.0mm thick)

128-PIN

Abstract: TQFP 100 PACKAGE nec tqfp TQFP JEDEC tray
Contextual Info: TRAY CONTAINER HEAT PROOF 7 PPE NEC 16.2 135°C MAX A' 15.45 A 6x15=90 21.00 105.0 TQFP 14×14×1.0 135.9 UNIT : mm 20.30 16.2 284.2 315.0 322.6 15.40 SECTION A – A' Applied Package 6.12 (6.35) 7.62 16.2 14.0 Quantity (pcs) 100-pin Plastic TQFP(1.0mm thick)

Contextual Info: 125°C BAKE/140°C MAX 109.9 13.00 15.70 TQFP 10x10 1.0T 135.9 UNIT : mm 12.37 A A' 15.20 12.37 288.8 13.1 315.0 322.6 SECTION A-A' 6.35 7.62 12.37 6.401 Applied Package Quantity (pcs) 64-pin Plastic TQFP (Fine Pitch)(1.0mm thick) MAX. 160 Tray Material

TRAY DIMENSIONS TQFP 64

Contextual Info: TRAY CONTAINER 150°C MAX 12.60 A' 10x25=250 11.25 A 12.20 11.10 9.1 113.4 TQFP7×7×1.0mm 135.9 UNIT : mm 9.1 292.8 315.0 322.6 SECTION A – A' Applied Package 48-pin Plastic TQFP (Fine Pitch)(1.0mm thick) 64-pin Plastic TQFP (Fine Pitch)(1.0mm thick)

TQFP JEDEC tray

Contextual Info: HEAT PROOF 105.0 7 135°C MAX PPE 17.5 A' 15.45 21.00 A TQFP 14x20×1.0 6×12=72 135.9 UNIT : mm 23.5 25.40 17.80 279.4 315.0 322.6 SECTION A – A' Applied Package 100-pin Plastic TQFP (1.0mm thick) 5.62 6.35 7.62 23.5 Quantity (pcs) MAX. 72 Tray Material

1f1-1717-a19

Abstract: 153FBGA BGA 6x6 tray FBGA tray kostat tray bga 6x6 169fbga-12.0x16.0-8x16-0 78BOC-11 78BOC ePAK BGA 5x5 tray 153FBGA-9
Contextual Info: Jul. 2010 Packing Tray Material Line-up Quantity Bake Temp. 8.1*15.1 8*12 ,256M DDR 5G 60WMBG Package 8*12 130℃ MAX 60M/54WBGA-8.10X15.10-8X12-A TR_MARKING LA69-00635A Material Code Material Spec 48TBGA,10.0*9.0(8*16) 8*16 130℃ MAX 48-TBGA-10.0X9.0-8X16-O

TQFP-28

Abstract: QFP JEDEC tray TQFP JEDEC tray
Contextual Info: HEAT PROOF A' 7 150°C MAX PPE 19.65 32.2 96.6 A TQFP 28 x 28 1.4mm 135.9 UNIT : mm 30.8 30.8 32.2 28.7 257.6 315 322.6 SECTION A-A' 30.8 6.02 6.35 7.62 27.85 Applied Package 208-pin • Plastic QFP Fine Pitch (1.4mm thick) Quantity (pcs) MAX. 36 Tray Material

Contextual Info: 150°C MAX 12.60 A' 10x25=250 11.25 A 12.20 11.10 9.1 113.4 TQFP7×7×1.0mm 135.9 UNIT : mm 9.1 292.8 315.0 322.6 SECTION A – A' 6.12 (6.35) 7.62 9.1 6.5 Applied Package Quantity (pcs) 48-pin Plastic TQFP (Fine Pitch)(1.0mm thick) MAX. 250 Tray Material

LQFP-48 thermal pad

Abstract: CS-007 TQFP 100 pin ic pcb design 0,5 mm pitch 5x5 matrix LD176 tqfp 7x7 tqfp 7x7 1.4 tray tqfp 7x7 tray LD48
Contextual Info: LEADFRAME data sheet ExposedPad LQFP / TQFP Features ExposedPad LQFP/TQFP Packages: This Amkor-developed family of power IC packages significantly increases the thermal efficiency of power constrained standard LQFP and TQFP packages. The ExposedPad LQFP /

TQFP 100 pin ic

Abstract: tqfp 7x7 1.4 tray tqfp 7x7 tray MS-026 JEDEC tray standard 17 x 17 tqfp 64 thermal resistance MS-026 TQFP TQFP Package 44 lead tqfp 32 thermal resistance CO-124
Contextual Info: LEADFRAME data sheet TQFP Features: Thin Quad Flat Pack TQFP Packages: Amkor offers a broad line of TQFP IC packages. IC packaging engineers, component specifiers and systems designers will find our TQFPs help to solve issues such as increasing board density, die shrink

100L

Abstract: JESD51-2 JESD51-7 32 QFP PACKAGE thermal resistance tqfp 7x7 1.4 tray tqfp 7x7 tray tqfp 64 thermal resistance Techpoint
Contextual Info: TQFP Thin Profile Quad Flat Pack • 7 x 7mm to 14 x 14mm • 32 to 128 lead count • Lead pitch range from 0.80mm to 0.40mm FEATURES DESCRIPTION • Body Sizes: 7 x 7mm to 14 x 14mm The Thin Profile Quad Flat Pack TQFP belongs to STATS ChipPAC’s QFP family. At 1.0mm body thickness, the TQFP

LQFP Package tray

Abstract: TQFP 1414 1.4mm JEDEC tray standard TQFP 1414
Contextual Info: HEAT PROOF 16.7 15.45 21.00 A' 6x15=90 A 150°CMAXPPE 7 105.0 TQFP 14×14×1.4 135.9 UNIT : mm 15.40 16.7 20.30 284.2 315.0 322.6 < SECTION A – A' > 16.7 5.62 6.35 7.62 13.85 Applied Package Quantity (pcs) 100-pin Plastic LQFP (1.4mm thick) MAX. 90 Tray

EP4CE6 package

Abstract: EP4CE40 Altera EP4CE6 EP4CE55 5M240Z 5M1270Z QFN148 5m570z 5M40 5M80
Contextual Info: Package Information Datasheet for Altera Devices DS-PKG-16.3 This datasheet provides package and thermal resistance information for Altera devices. Package information includes the ordering code reference, package acronym, leadframe material, lead finish plating , JEDEC outline reference, lead

tqfp 7x7 tray

Abstract: DAEWON tray drawing DAEWON JEDEC TRAY tray drawing tqfp 7x7 daewon 7x7 DAEWON JEDEC TRAY 10 X 10 TQFP Shipping Trays shipping tray daewon 7x7 1.0T JEDEC TRAY 10 X 10
Contextual Info: 12_ I_ y _ I_ 10_ I_9_ I_ 8_ I_7_ I_ 6_ I_ 5_ I_4_ I_ 3_ I_2_ I_1

EP4CE15

Abstract: MS 034 BGA and QFP Altera Package mounting Altera pdip top mark jedec package MO-247 SOIC 20 pin package datasheet QFN "100 pin" PACKAGE thermal resistance Theta JC of FBGA QFN148 EP4CE22
Contextual Info: Altera Device Package Information Datasheet DS-PKG-16.2 This datasheet provides package and thermal resistance information for Altera devices. Package information includes the ordering code reference, package acronym, leadframe material, lead finish plating , JEDEC outline reference, lead

ICS83210

Abstract: ICS83210AY ICS83210AYLF MS-026 IDT Package Marking format TQFP 100 pin Socket
Contextual Info: Low Skew, 1-to-10, HSTL Fanout Buffer ICS83210 DATA SHEET GENERAL DESCRIPTION FEATURES The ICS83210 is a low skew, 1-to-10 HSTL Fanout Buffer. The class II HSTL outputs are balanced push-pull in design, capable of delivering 16mA into a 10pF load. This class allows

Contextual Info: Low Skew, 1-to-10, HSTL Fanout Buffer ICS83210 DATA SHEET GENERAL DESCRIPTION FEATURES The ICS83210 is a low skew, 1-to-10 HSTL Fanout Buffer. The class II HSTL outputs are balanced push-pull in design, capable of delivering 16mA into a 10pF load. This class allows

jedec MS-026 ABA

Abstract: ICS83210AYT MS-026 CY2HH8110 ICS83210 ICS83210AY ICS83210AYLF idt cross TQFP JEDEC tray JEDEC tray standard TQFP
Contextual Info: ICS83210 LOW SKEW, 1-TO-10 HSTL FANOUT BUFFER GENERAL DESCRIPTION FEATURES The ICS83210 is a low skew, 1-to-10 HSTL Fanout ICS Buffer and a member of the HiPerClockS Family HiPerClockS™ of High Performance Clock Solutions from IDT. The class II HSTL outputs are balanced push-pull

ATSAMD21G18

Contextual Info: Atmel SAM D21E / SAM D21G / SAM D21J SMART ARM-Based Microcontroller DATASHEET SUMMARY Description The Atmel | SMART SAM D21 is a series of low-power microcontrollers using the 32-bit ARM® Cortex®-M0+ processor, and ranging from 32- to 64-pins with up to 256KB Flash and