TQFP 32 PACKAGE Search Results

32TQFP

Contextual Info: SK19XX Family 1:9 Signal Distribution TEST AND MEASUREMENT PRODUCTS Ordering Information Ord ering Cod e Package ID SK1900ATF 32-TQFP 5 x 5 mm SK1901ATF 32-TQFP 5 x 5 mm SK1902ATF 32-TQFP 5 x 5 mm SK1903ATF 32-TQFP 5 x 5 mm SK1904ATF 32-TQFP 5 x 5 mm SK1925ATF

TQP32

Contextual Info: SK19XX Family 1:9 Signal Distribution PRELIMINARY HIGH-PERFORMANCE PRODUCTS Ordering Information Ordering Code Package ID Temperature Range SK1900 32-TQFP 5 x 5 mm Commercial SK1901 32-TQFP 5 x 5 mm Commercial SK1902 32-TQFP 5 x 5 mm Commercial SK1903 32-TQFP

Contextual Info: 19-2829; Rev 1; 7/03 Anything-to-LVDS Dual 2 x 2 Crosspoint Switches Ordering Information TEMP RANGE PIN-PACKAGE MAX9390EHJ PART -40°C to +85°C 32 TQFP MAX9390ETJ* -40°C to +85°C 32 Thin QFN MAX9391EHJ -40°C to +85°C 32 TQFP MAX9391ETJ* -40°C to +85°C

ADV0406

Abstract: TQFP 32 PACKAGE altera TQFP 32 PACKAGE MS-026 MS-026 TQFP
Contextual Info: CUSTOMER ADVISORY ADV0406 TQFP 32 PACKAGE TOP MOLD AND EJECTOR SIZE CHANGE Change Description: Due to assembly process improvements undertaken at our assembly supplier, slight dimensional changes are being made to the 32 lead thin quad flat pack TQFP packages. The dimension changes involve an increase of the top mold

MAX3877

Abstract: MAX3877EHJ MAX3878 MAX3878EHJ
Contextual Info: 19-2062; Rev 0; 5/01 2.5Gbps, +3.3V Clock and Data Retiming ICs with Vertical Threshold Adjust Ordering Information TEMP. RANGE PIN-PACKAGE MAX3877EHJ PART -40°C to +85°C 32 TQFP-EP* MAX3877E/D* -40°C to +85°C DICE* MAX3878EHJ -40°C to +85°C 32 TQFP-EP*

32-lead TQFP

Contextual Info: PACKAGE INFORMATION Micrel 32 LEAD TQFP DIE UP (T32-1) Rev. 01 Rev.: C 1 Amendment: 0 Issue Date: July, 1999

H321

Abstract: H32-1
Contextual Info: PACKAGE INFORMATION Micrel 32 LEAD EPAD-TQFP DIE UP (H32-1) Rev. 01 Rev.: A 1 Amendment: 0 Issue Date: February 2000

100L

Abstract: JESD51-2 JESD51-7 32 QFP PACKAGE thermal resistance tqfp 7x7 1.4 tray tqfp 7x7 tray tqfp 64 thermal resistance Techpoint
Contextual Info: TQFP Thin Profile Quad Flat Pack • 7 x 7mm to 14 x 14mm • 32 to 128 lead count • Lead pitch range from 0.80mm to 0.40mm FEATURES DESCRIPTION • Body Sizes: 7 x 7mm to 14 x 14mm The Thin Profile Quad Flat Pack TQFP belongs to STATS ChipPAC’s QFP family. At 1.0mm body thickness, the TQFP

tqfp 7x7

Abstract: W502 thermal conductivity
Contextual Info: Thermal Data  TQFP 7x7 32 leads 32 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.15 mm 3.9 W/cm°C die attach silver glue 10-40 µm 0.01 W/cm°C molding compound epoxy resin 1.4 mm 0.0063W/cm°C Frame options :

Contextual Info: 19-2078; Rev 1; 2/02 1:10 Differential LVPECL/LVECL/HSTL Clock and Data Drivers Both devices are offered in space-saving, 32-pin 5mm ✕ 5mm TQFP, 5mm x 5mm QFN, and industry-standard 32-pin 7mm x 7mm LQFP packages. Applications Precision Clock Distribution

mo135

Abstract: MO-135
Contextual Info: Revised January 1999 Package VBE032 32-Lead Thin Quad Flat Package TQFP , JEDEC MO-135, 7mm Square Package Number VBE032 1999 Fairchild Semiconductor Corporation vbe032.prf www.fairchildsemi.com Package VBE032 January 1999

Contextual Info: MAX5631/MAX5632/ MAX5633 16-Bit DACs with 32-Channel Sample-and-Hold Outputs General Description PART TEMP RANGE* MAX5631UCB+D 0°C to +85°C 64 TQFP MAX5631UTK+ 0°C to +85°C 68 TQFN-EP* 0°C to +85°C 64 TQFP MAX5632UTK+ 0°C to +85°C 68 TQFN-EP* MAX5633UCB+D

MAX9420

Abstract: MAX9420EHJ MAX9421 MAX9421EHJ MAX9422 MAX9422EHJ MAX9423 MAX9423EHJ
Contextual Info: 19-2285; Rev 0; 1/02 Quad Differential LVECL-to-LVPECL Translators The MAX9420–MAX9423 are specified for operation from -40°C to +85°C, and are offered in space-saving 32-pin 5mm ✕ 5mm TQFP and 32-lead 5mm ✕ 5mm QFN packages. Applications Features

MS-026ABA

Abstract: 241-Pin
Contextual Info: 32-Lead Thin Plastic Quad Flat Package [TQFP] SU-32-2 a Dimensions shown in millimeters 0.75 0.60 0.45 1.20 MAX 9.00 BSC SQ 25 32 24 1 PIN 1 1.05 1.00 0.95 0.15 0.05 0.20 0.09 7° 3.5° 0° 0.08 MAX COPLANARITY SEATING PLANE VIEW A 7.00 BSC SQ TOP VIEW (PINS DOWN)

Contextual Info: 19-2913; Rev 0; 8/03 Anything-to-LVDS Dual 2 x 2 Crosspoint Switches Also see the MAX9390/MAX9391 for the crossflow version. Ordering Information TEMP RANGE PIN-PACKAGE MAX9392EHJ PART -40°C to +85°C 32 TQFP MAX9392ETJ* -40°C to +85°C 32 Thin QFN MAX9393EHJ

QFN-68

Abstract: LQFP-64 footprint 21-0142E AX5631 MAX5633UTK T MAX5632UCB D t6800
Contextual Info: 19-2171; Rev 3; 1/05 16-Bit DACs with 32-Channel Sample-and-Hold Outputs Ordering Information PART TEMP RANGE* MAX5631UCB 0°C to +85°C 64 TQFP MAX5631UTK 0°C to +85°C 68 Thin QFN MAX5632UCB 0°C to +85°C 64 TQFP MAX5632UTK 0°C to +85°C 68 Thin QFN MAX5633UCB

21-0142E

Abstract: 40535 MAX5632UCB D
Contextual Info: 19-2171; Rev 3; 1/05 16-Bit DACs with 32-Channel Sample-and-Hold Outputs Ordering Information PART TEMP RANGE* MAX5631UCB 0°C to +85°C 64 TQFP MAX5631UTK 0°C to +85°C 68 Thin QFN MAX5632UCB 0°C to +85°C 64 TQFP MAX5632UTK 0°C to +85°C 68 Thin QFN MAX5633UCB

GS8160EV18B

Abstract: GS8160EV32B GS8160EV36B
Contextual Info: Preliminary GS8160EV18/32/36BT-250/200/150 100-Pin TQFP Commercial Temp Industrial Temp 1M x 18, 512K x 32, 512K x 36 18Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation • Dual Cycle Deselect DCD operation

GS816018B

Abstract: GS816018BT-150 GS816018BT-200 GS816018BT-250 GS816032B GS816036B
Contextual Info: Preliminary GS816018/32/36BT-250/200/150 1M x 18, 512K x 32, 512K x 36 18Mb Sync Burst SRAMs 100-Pin TQFP Commercial Temp Industrial Temp Features • FT pin for user-configurable flow through or pipeline operation • Single Cycle Deselect SCD operation

GS8160V18B

Abstract: GS8160V32B GS8160V36B
Contextual Info: Preliminary GS8160V18/32/36BT-250/200/150 1M x 18, 512K x 32, 512K x 36 18Mb Sync Burst SRAMs 100-Pin TQFP Commercial Temp Industrial Temp Features • FT pin for user-configurable flow through or pipeline operation • Single Cycle Deselect SCD operation

Contextual Info: ADVANCE MT58LC128K32/36E1 128K X 32/36 SYNCBURST SRAM MICRON I TECHNOLOGY, INC. 128K x 32/36 SRAM SYNCHRONOUS SRAM +3.3V SUPPLY, +2.5V I/O, FLOW-THROUGH AND SELECTABLE BURST MODE FEATURES 100-Pin TQFP SA-1 # # # # # (fi it oí3Ss! í * ty=*(fi8S* „.ft

GS8160E18AT-200

Abstract: GS8160E18AT-250 GS8160E18AT-300
Contextual Info: Preliminary GS8160E18/32/36AT-300/250/200/150 100-Pin TQFP Commercial Temp Industrial Temp 1M x 18, 512K x 32, 512K x 36 18Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation • Dual Cycle Deselect DCD operation

GS84018A

Abstract: GS84018AT-190 GS84032A GS84036A
Contextual Info: Preliminary GS84018/32/36AT/B-190/180/166/150/100 TQFP, BGA Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipelined operation • Single Cycle Deselect SCD operation

GS8160E36BGT

Abstract: GS8160E32BGT
Contextual Info: Preliminary GS8160E18/32/36BT-300/250/200/150 1M x 18, 512K x 32, 512K x 36 18Mb Sync Burst SRAMs 100-Pin TQFP Commercial Temp Industrial Temp Features • FT pin for user-configurable flow through or pipeline operation • Dual Cycle Deselect DCD operation