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    TQFP 144 PACKAGE ALTERA Search Results

    TQFP 144 PACKAGE ALTERA Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    54ACT825/QKA
    		Rochester Electronics LLC 54ACT825/QKA - Dual marked (5962-9161101MKA), D-Type Flip-Flop, 5V, 24-CFP PDF Buy
    TPH1R306PL
    		Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 100 A, 0.00134 Ω@10 V, SOP Advance / SOP Advance(N) Datasheet
    TPH9R00CQH
    		Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Datasheet
    TPH9R00CQ5
    		Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 150 V, 64 A, 0.009 Ω@10 V, High-speed diode, SOP Advance / SOP Advance(N) Datasheet
    TPHR8504PL
    		Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 40 V, 150 A, 0.00085 Ω@10 V, SOP Advance / SOP Advance(N) Datasheet

    TQFP 144 PACKAGE ALTERA Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    EPC1213PC8

    Abstract: EPC1PC8 EPC2LC20 epc2tc32 EPC4QC100 EPM7128* kit NIOS-EVALKIT-1C12 EPC1441PC8 EPC16UC88 EPM1270F256C5ES
    Contextual Info: NEW! Package 100-TQFP 100-TQFP 100-TQFP 44-TQFP 44-TQFP 44-TQFP 44-TQFP 84-PLCC 100-TQFP 100-TQFP 100-TQFP 144-TQFP 100-TQFP 100-TQFP 144-TQFP * Tube CPLD’s Cont. Macro Cells Logic Elements Pin-Pin Delay (ns) I/O Pins Voltage Speed (NS) 64 64 64 64 64


    Original     		100-TQFP 44-TQFP 84-PLCC EPC1213PC8 EPC1PC8 EPC2LC20 epc2tc32 EPC4QC100 EPM7128* kit NIOS-EVALKIT-1C12 EPC1441PC8 EPC16UC88 EPM1270F256C5ES PDF

    PCN0404

    Abstract: SUMITOMO g700l sumitomo EME G700L G700L TQFP 144 PACKAGE Compound SUMITOMO mold compound TQFP 144 PACKAGE altera G700
    Contextual Info: PROCESS CHANGE NOTICE PCN0404 ADDITIONAL MOLD COMPOUND FOR TQFP 144 PACKAGE Change Description: The Sumitomo G700L mold compound is being added as additional mold compound choice for selected Altera devices in thin quad flat pack TQFP 144 lead packages assembled by


    Original     		PCN0404 G700L PCN0404 SUMITOMO g700l sumitomo EME G700L TQFP 144 PACKAGE Compound SUMITOMO mold compound TQFP 144 PACKAGE altera G700 PDF

    ep600i

    Abstract: processor cross reference MS-034 1152 BGA Cross Reference epm7064 cross reference EP2S15 EP2S180 EP2S30 EP2S60 EP2S90
    Contextual Info: Altera Device Package Information October 2005, vers.14.2 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 16)


    Original     		PDF

    PQFP 176

    Abstract: 240 pin rqfp drawing EP3C5E144 EP1K50-208 processor cross reference EP3C16F484 MS-034 1152 BGA 84 FBGA thermal TQFP 144 PACKAGE DIMENSION FBGA 1760
    Contextual Info: Altera Device Package Information May 2007 version 14.7 Document Revision History Data Sheet Table 1 shows the revision history for this document. Table 1. Document Revision History 1 Date and Document Version May 2007 v14.7 Changes Made ● ● ● ●


    Original     		144-Pin 100-Pin 256-Pin 780-Pin 256-Pin 68-Pin PQFP 176 240 pin rqfp drawing EP3C5E144 EP1K50-208 processor cross reference EP3C16F484 MS-034 1152 BGA 84 FBGA thermal TQFP 144 PACKAGE DIMENSION FBGA 1760 PDF

    ep600i

    Abstract: JEDEC MS-034-AAJ-1 BGA Package 172 EP1800 MS-034 AAF-1 192PGA pdip 24 altera AP672 EP610 epm9560 die
    Contextual Info: Altera Device Package Information May 2001, ver. 9.1 Introduction Data Sheet This data sheet provides the following package information for all Altera® devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.


    Original     		PDF

    transistors BC 458

    Abstract: 240 pin rqfp drawing ep600i BC 458 256-pin BGA drawing EPM7032-44 transistor BC 458 tqfp 44 thermal resistance datasheet epm7064s cross reference BGA PACKAGE thermal resistance
    Contextual Info: Altera Device Package Information August 1999, ver. 8 Data Sheet 2 Introduction This data sheet provides the following package information for all Altera® devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.


    Original     		PDF

    100 PIN tQFP ALTERA DIMENSION

    Abstract: TQFP 144 PACKAGE DIMENSION 100 PIN PQFP ALTERA DIMENSION TQFP 100 PACKAGE TQFP 144 PACKAGE PQFP chip size TQFP 144 PACKAGE altera altera EPM7032S altera TQFP 32 PACKAGE EPM7128S
    Contextual Info: Saving Board Space with MAX 7000S & MAX 7000A TQFP Packages February 1998, ver. 2 Board Space Savings Altera® devices allow designers to save board space by enabling the integration of 22V10s, PALs, and GALs into higher density devices. Designers can save even more board space by using Altera MAX® 7000S


    Original     		7000S 22V10s, 44-Pin 100 PIN tQFP ALTERA DIMENSION TQFP 144 PACKAGE DIMENSION 100 PIN PQFP ALTERA DIMENSION TQFP 100 PACKAGE TQFP 144 PACKAGE PQFP chip size TQFP 144 PACKAGE altera altera EPM7032S altera TQFP 32 PACKAGE EPM7128S PDF

    EP20K100E

    Abstract: EP20K160E EP20K200 EP20K200E EP20K300E EP20K60E EP20K100 0245 TQFP-208 208RQFP 280-PGA
    Contextual Info: Altera Device Package Information August 2000, ver. 8.03 Data Sheet 2 Introduction This data sheet provides the following package information for all Altera® devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.


    Original     		49-pin 169-pin EP20K100E EP20K160E EP20K200 EP20K200E EP20K300E EP20K60E EP20K100 0245 TQFP-208 208RQFP 280-PGA PDF

    micro fineline BGA

    Abstract: EPM240 EPM570-144TQFP altera TQFP 32 PACKAGE bsc part 2 date sheet fbga Substrate design guidelines EPM1270 EPM2210 EPM240G EPM240Z
    Contextual Info: 7. Package Information MII51007-2.1 Introduction This chapter provides package information for Altera’s MAX II devices, and includes these sections: • “Board Decoupling Guidelines” on page 7–1 ■ “Device and Package Cross Reference” on page 7–1


    Original     		MII51007-2 144-Pin 68-Pin 144Pin 100-pin micro fineline BGA EPM240 EPM570-144TQFP altera TQFP 32 PACKAGE bsc part 2 date sheet fbga Substrate design guidelines EPM1270 EPM2210 EPM240G EPM240Z PDF

    240 pin rqfp drawing

    Abstract: BGA sumitomo 724p EP1C12 Altera pdip top mark epm7032 plcc FBGA672 192 BGA PACKAGE thermal resistance
    Contextual Info: Altera Device Package Information February 2003, vers. 11.0 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 9)


    Original     		7000B, 7000AE, 240 pin rqfp drawing BGA sumitomo 724p EP1C12 Altera pdip top mark epm7032 plcc FBGA672 192 BGA PACKAGE thermal resistance PDF

    BGA 256 PACKAGE thermal resistance

    Abstract: C5200 C52006-1 EP1C12 TQFP 144 PACKAGE altera 324 bga thermal altera cross reference BGA EP1C20
    Contextual Info: 15. Package Information for Cyclone Devices C52006-1.2 Introduction This data sheet provides package information for Altera devices. It includes these sections: Section Page Device & Package Cross Reference . . . . . . . . . . . . . . . . . . . . . 15–1


    Original     		C52006-1 EP1C12 EP1C20 BGA 256 PACKAGE thermal resistance C5200 EP1C12 TQFP 144 PACKAGE altera 324 bga thermal altera cross reference BGA EP1C20 PDF

    transistors BC 458

    Abstract: BC 458 CQFP 208 datasheet EPM7032-44 EPM5192 44JPLCC TQFP-208 0245 192PGA EPM5128 280PGA
    Contextual Info: アルテラ・デバイス パッケージ・インフォメーション Altera Device Package Information Data Sheet 1998年 1 月 ver.7 イントロダク ション Data Sheet このデータシートにはアルテラのすべてのデバイス・パッケージに関する


    Original     		PGAT-187 -DS-PKG-07/J 10KFLEX 9000MAX EPF10K10 transistors BC 458 BC 458 CQFP 208 datasheet EPM7032-44 EPM5192 44JPLCC TQFP-208 0245 192PGA EPM5128 280PGA PDF

    BGA 256 PACKAGE thermal resistance

    Abstract: bga 208 PACKAGE ep1c6-144 324 bga thermal BGA PACKAGE thermal resistance C52006-1 EP1C12 BGA400 EP1C6 C5200
    Contextual Info: 15. Package Information for Cyclone Devices C52006-1.3 Introduction This data sheet provides package information for Altera devices. It includes the following sections: • ■ ■ “Device and Package Cross Reference” on page 15–1 “Thermal Resistance” on page 15–2


    Original     		C52006-1 EP1C20 BGA 256 PACKAGE thermal resistance bga 208 PACKAGE ep1c6-144 324 bga thermal BGA PACKAGE thermal resistance EP1C12 BGA400 EP1C6 C5200 PDF

    EP4CE15

    Abstract: MS 034 BGA and QFP Altera Package mounting Altera pdip top mark jedec package MO-247 SOIC 20 pin package datasheet QFN "100 pin" PACKAGE thermal resistance Theta JC of FBGA QFN148 EP4CE22
    Contextual Info: Altera Device Package Information Datasheet DS-PKG-16.2 This datasheet provides package and thermal resistance information for Altera devices. Package information includes the ordering code reference, package acronym, leadframe material, lead finish plating , JEDEC outline reference, lead


    Original     		DS-PKG-16 EP4CE15 MS 034 BGA and QFP Altera Package mounting Altera pdip top mark jedec package MO-247 SOIC 20 pin package datasheet QFN "100 pin" PACKAGE thermal resistance Theta JC of FBGA QFN148 EP4CE22 PDF

    PCN0602

    Abstract: sumitomo G700 sumitomo G700 Tg sumitomo epoxy sumitomo g700 type g700 mold compound G700 SUMITOMO Tg G700 sumitomo g700 mold compound sumitomo epoxy G700
    Contextual Info: PROCESS CHANGE NOTIFICATION PCN0602 MOLD COMPOUND CHANGE FOR CYCLONE II PQFP & TQFP PACKAGES Change Description: Altera is adopting the Sumitomo G700 series mold compound as the standard mold material on its Cyclone™ II low-k dielectric Plastic Quad Flat Pack PQFP and Plastic Thin Quad


    Original     		PCN0602 E730SJ Sumitomo-G700 EME-E730SJ x10-5/ x102N/mm2 UL-94 PCN0602 sumitomo G700 sumitomo G700 Tg sumitomo epoxy sumitomo g700 type g700 mold compound G700 SUMITOMO Tg G700 sumitomo g700 mold compound sumitomo epoxy G700 PDF

    PCN0714

    Abstract: EQFP-144 XZ074 EQFP 144 PACKAGE altera TQFP 32 PACKAGE ep1k30 pin marking ic 2008 EP1K100 EPF8452A EPF8636A
    Contextual Info: Revision: 1.3.0 PROCESS CHANGE NOTIFICATION PCN0714 UPDATE ASSEMBLY PLANT CHANGE FOR PQFP AND TQFP PACKAGES Change Description: This is an update to PCN0714; please see the revision history table for information specific to this update. The plastic quad flat pack PQFP and thin quad flat pack (TQFP) packages currently


    Original     		PCN0714 PCN0714; EP20K100 EP20K60E EP20K100E EP20K160E EP20K200E EP20K300E EPF10K100E EPF10K130E EQFP-144 XZ074 EQFP 144 PACKAGE altera TQFP 32 PACKAGE ep1k30 pin marking ic 2008 EP1K100 EPF8452A EPF8636A PDF

    ORELA 4500

    Abstract: ARC 625D PNX5 CW4512 PNX5220 ZSP540 interface of IR SENSOR with SPARTAN3 FPGA ARC 725D TMS320LF24xx digital hearing aids
    Contextual Info: 2005 EDN DSP Directory DSP devices and cores Company Device/family core Target applications Altera www.altera.com Cyclone II HardCopy II Consumer, communications, industrial, computer Video/image processing, wireless, wireline, industrial, test and measurement


    Original     		18x18-bit 10-bit, 40-MHz PowerPC405 32-bit ORELA 4500 ARC 625D PNX5 CW4512 PNX5220 ZSP540 interface of IR SENSOR with SPARTAN3 FPGA ARC 725D TMS320LF24xx digital hearing aids PDF

    ipc-sm-786A

    Abstract: EPX780 altera TQFP 32 PACKAGE EPF10K20 EPF10K30 EPF10K40 EPF8636 TQFP 144 PACKAGE altera RQFP
    Contextual Info: CUSTOMER ADVISORY RQFP & TQFP MOISTURE RECLASSIFICATION In ADV 9505, Altera announced that it had established dry packing requirements for the RQFP package, as well as for other QFP and PLCC packages. Dry packing enhances the shipping process by placing devices in vacuum-sealed moisture-barrier bags with


    Original     		IPC-SM-786A, PCN9705 ipc-sm-786A EPX780 altera TQFP 32 PACKAGE EPF10K20 EPF10K30 EPF10K40 EPF8636 TQFP 144 PACKAGE altera RQFP PDF

    TSB12LV23

    Abstract: "USB Hub Controllers" PCI CardBus Controllers Physical Layer Controllers 21152AB PCI4520 TSB43CB43A LQFP 128 pin Socket TSB12LV01B TSB12LV21B
    Contextual Info: R E A L W O R L D S I G N A L P R O C E S S I N G Connectivity Solutions: 1394 and USB 4Q 2003 1394 Integrated Devices Family/ Name iOHCI-Lynx iOHCI-Lynx iOHCI-Lynx iOHCI-Lynx Voltage V 3.3 3.3 3.3 3.3 TSB43CA42 iceLynx-Micro 3.3 up to 400 16.5 TSB43CA43A


    Original     		TSB43CA42 TSB43CA43A TSB43CB43A TSB43AA22 TSB43AB21A TSB43AB22A TSB43AB23 1394a-2000 TSB12LV23 "USB Hub Controllers" PCI CardBus Controllers Physical Layer Controllers 21152AB PCI4520 TSB43CB43A LQFP 128 pin Socket TSB12LV01B TSB12LV21B PDF

    IC51-1604-845-4

    Abstract: IC51-2084-1052 IC51-2404-1655-2 IC51-1604-845-1 IC51-1764-1505 IC51-1604-1350 socket IC51-2084-1052 IC51-1444-1354 IC51-1444-1354-7 socket Yamaichi ic51-2084-1052
    Contextual Info: IC51 Series Clamshell QFP, PQFP and TQFP Part Number (Details) Specifications As specifications for this product differ by pitch and material-mix, please contact our Sales Department for detailed information. Series No. 1,000M Ω min. at100V DC, 500V DC


    Original     		at100V 10mA/20mV Contact33 IC51-2724-1727 IC51-3044-1471-2 40x63 IC51-2564-1668 IC51-1604-845-4 IC51-2084-1052 IC51-2404-1655-2 IC51-1604-845-1 IC51-1764-1505 IC51-1604-1350 socket IC51-2084-1052 IC51-1444-1354 IC51-1444-1354-7 socket Yamaichi ic51-2084-1052 PDF

    4572 IC 8PIN

    Abstract: epx780 TQFP 144 PACKAGE DIMENSION ALTERA EP610
    Contextual Info: Altera Device Package Information J u n e 1995, ver. 6 Introduction Data Sheet This data sh eet p rovid es the fo llo w in g package inform ation for all Altera devices: • ■ ■ ■ Lead materials Thermal resistance Package w eig h ts Package outlines


    OCR Scan     		503-Pin 4572 IC 8PIN epx780 TQFP 144 PACKAGE DIMENSION ALTERA EP610 PDF

    IC51-1444-1354-7

    Abstract: IC51-1444-1354 IC51-1204-1646 IC51-1444-1014-3 ic51-1204-1812 IC51-1204-1497 IC51-1284-1433 IC51-1124-1036-YED IC51-1124-1036-2 ks 213 F
    Contextual Info: IC51 Series Clamshell QFP, PQFP and TQFP Part Number (Details) Specifications As specifications for this product differ by pitch and material-mix, please contact our Sales Department for detailed information. IC51 Series No. 1,000M Ω min. at100V DC, 500V DC


    Original     		at100V 10mA/20mV IC51-1284-844-1 IC51-1284-976-1 IC51-1284-976-2 IC51-1014 KS-11137 IC51-1444-1014-3 IC51-1444-1014 65x35 IC51-1444-1354-7 IC51-1444-1354 IC51-1204-1646 IC51-1444-1014-3 ic51-1204-1812 IC51-1204-1497 IC51-1284-1433 IC51-1124-1036-YED IC51-1124-1036-2 ks 213 F PDF

    EPM7256ATc144-10

    Abstract: epm7256aqc208-10 EPM7256ATI144-10 EPM7256AFI256-10 EPM7256AETC100-10 EPM7256ATC100 EPM7256AEFC256-7 EPM7256ATC100-10 EPM7256ATC144-7 EPM7256ATC100-7
    Contextual Info: CL7256A CL7256AE Laser Processed Logic Device Family Key Features u Laser Processed Logic Device LPLD™ technology offers the ultimate combination of performance, flexibility, and low cost u Functionally, architecturally, and electrically compatible with industry-standard Altera MAX® 7000


    Original     		CL7256A CL7256AE CL7000 CL7128A CL7128AE CL7512A CL7256AEQC208-10 EPM7256AETI144-7 EPM7256ATc144-10 epm7256aqc208-10 EPM7256ATI144-10 EPM7256AFI256-10 EPM7256AETC100-10 EPM7256ATC100 EPM7256AEFC256-7 EPM7256ATC100-10 EPM7256ATC144-7 EPM7256ATC100-7 PDF

    pin information ep3c10

    Abstract: EP3C40F484 EP3c55 EP3C16F484 EP3C16 EP3C40Q240 EP3C40 U256 100 PIN PQFP ALTERA DIMENSION PIN INFORMATION FOR EP3C55
    Contextual Info: Cyclone Series Device Thermal Resistance July 2007, version 2.2 Revision History Data Sheet The following table shows the revision history for this data sheet. Date Document Version Changes Made July 2007 2.2 Updated values for EP3C25 E144 device in Table 2.


    Original     		EP3C25 EP3C10 pin information ep3c10 EP3C40F484 EP3c55 EP3C16F484 EP3C16 EP3C40Q240 EP3C40 U256 100 PIN PQFP ALTERA DIMENSION PIN INFORMATION FOR EP3C55 PDF