TOP 244 Y Search Results

54HC244

Abstract: C244
Contextual Info: SN54HC244, SN74HC244 OCTAL BUFFERS AND LINE DRIVERS WITH 3 STATE OUTPUTS D2884, DECEMBER 1 98 2 -REVISED SEPTEMBER 1987 SN 54H C244 . . . J PACKAGE S N 74H C 244 . . . DW OR N PACKAGE 3-State Output Drive Bus Lines or Buffer Mem ory Address Registers TOP VIEW

74ACT11656

Abstract: Z819 Y2227
Contextual Info: 74ACT11656 OCTAL BUFFERS/LINE DRIVERS WITH PARITY CHECKER/GENERATOR AND 3-STATE OUTPUTS S C AS460 - D E C E M B E R 1994 DW PACKAGE TOP VIEW • Inputs are TTL-Voltage Compatible • Combines '244 and '280 Functions In One Package • Flow-Through Architecture Optimizes PCB

54HC244

Abstract: HC240 HC241 SN54HC244 SN74HC244
Contextual Info: SN54HC244, SN74HC244 OCTAL BUFFERS AND LINE DRIVERS WITH 3-STATE OUTPUTS D 2 6 8 4 , DECEMBER 1 9 8 2 -R E V IS E D SEPTEMBER 1 9 8 7 SN 54H C 244 . . . J PACKAGE SN 74H C244 . . . OW OR N PACKAGE TOP VIEW Package Options Include Plastic “ Small Outline" Packages. Ceramic Chip Carriers,

TMC57253

Contextual Info: TC254P 336- x 244-PIXEL CCD IMAGE SENSOR S O C S O 6 OB - J U N E 1 9 9 7 - R E V IS E D J U L Y 1 9 9 8 Medium-Resolution, Solid-State Image Sensor for Low-Cost Color TV Applications DUAL-IN-LINE PACKAGE TOP VIEW 324(H) x 243(V) Active Elements in Image

Contextual Info: MITSUBISHI HIGH SPEED CMOS M 74HC244P M 74HC244DW P OCTAL 3-S T A T E N ONINVERTING B U F F E R /L IN E D R IV E R /L IN E REC EIVER DESCRIPTION The M 74H C 244 is a sem iconductor inte grated c ircu it con­ PIN CONFIGURATION TOP VIEW sisting of tw o blocks of 3-state non-inverting buffers each

Contextual Info: M IT S U B IS H I HIGH SPEED CMOS M 74H C 244P /FP /D W P OCTAL 3-S TA TE NONINVERTING B U F F E R /L IN E D R IV E R /L IN E R ECEIVER DESCRIPTION The M 74H C 244 is a sem iconductor integrated circuit con­ PIN CONFIGURATION TOP VIEW sisting of tw o blocks of 3-state non-inverting buffers each

E60389

Abstract: LR20812 RF-12 RF-SC2290
Contextual Info: Crimp 2.54mm RF CONNECTOR HEADER • Disconnectable Crimp style connectors and headers .100" pitch Features –––––––––––––––––––––––– • Highly reliable, yet low in cost Our original double-leaf spring construction withstands the

Contextual Info: Crimp 2.54mm RF CONNECTOR HEADER • Disconnectable Crimp style connectors and headers .100" pitch Features ––––––––––––––––––––––– • Highly reliable, yet low in cost Our original double-leaf spring construction withstands the

RF-SC2290

Abstract: E60389 LR20812 RF-12 APLMK RF-SC22
Contextual Info: Crimp 2.54mm RF CONNECTOR HEADER • Disconnectable Crimp style connectors and headers .100" pitch Features –––––––––––––––––––––––– • Highly reliable, yet low in cost Our original double-leaf spring construction withstands the

rf08

Contextual Info: Crimp 2.54mm RF CONNECTOR HEADER • Disconnectable Crimp style connectors and headers .100" pitch Features ––––––––––––––––––––––– • Highly reliable, yet low in cost Our original double-leaf spring construction withstands the

sc2290

Abstract: rf-sc2290 E60389 LR20812 RF-12
Contextual Info: Crimp 2.54mm RF CONNECTOR HEADER • Disconnectable Crimp style connectors and headers .100" pitch Features –––––––––––––––––––––––– • Highly reliable, yet low in cost Our original double-leaf spring construction withstands the

E60389

Abstract: LR20812 RF-12 RF-SC2290
Contextual Info: Crimp 2.54mm RF CONNECTOR HEADER • Disconnectable Crimp style connectors and headers .100" pitch Features ––––––––––––––––––––––– • Highly reliable, yet low in cost Our original double-leaf spring construction withstands the

bga244

Abstract: SF-BGA244B-B-11
Contextual Info: D Package Code: BGA244B C 22.48mm [0.885"] 1.5mm [0.059"] See BGA pattern code to the right for actual pattern layout Y X 22.5mm [0.886"] Top View reference only 1.5mm [0.059"] 2 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"] [0.210"] B 1 Ø 0.64mm pad [Ø 0.025"]

bga244

Abstract: 19X19 SF-BGA244A-B-11
Contextual Info: D Package Code: BGA244A .0225" dia. tooling holes X2 non plated (optional) C 0.914mm See BGA pattern code to the right for actual pattern layout Y 0.533mm X 22.86mm 0.025" dia. pad Top View (reference only) 2 0.36mm [0.014"] dia. 0.762mm 5.33mm 3.74mm [0.147"]

Contextual Info: % Q u a lit y S e m ic o n d u c t o r , In c . High Speed 3 .3 V CM OS 8-Bit Buffers/Line Drivers QS74LCX240 QS74LCX244 FEATURES/BENEFITS DESCRIPTION • • • • • • • • The LCX240 and LCX244 are 8-bit buffers/line drivers with three-state outputs that are ideal for

AMI 602

Abstract: 104A1 AMI-006 Semiconductor
Contextual Info: AMI AM I SEM ICO ND U CTOR 'Is s SOIC Packaging Capabilities Description Surface Mount The Small Ourline Integrated Circuit SOIC is a small surface mount package and is an excellent choice for maximum board density. It is surface mounted on your printed circuit board

Contextual Info: REV. DESCRIPTION DATE — RELEASE May 06,2004 B May 13.2004 04*0522 04*0642 Jun 24,2004 c Jul 19,2004 D 04*0732 0.40 [.0 1 6 ] h- Mo o CM Lfi - - 4 - 1 . 9 5 *- — 1.9 5 [.0 7 7 ] MUfF/gnm? MATERIALS - _ Y V u |£ 7 |0 .1 0 | I U— 3.86 U — 3.86 [.1 5 2 ] —

minidimm JEDEC

Abstract: DDR3 miniDIMM JEDEC
Contextual Info: Molex Connector Part Number - 0877823005 Page 1 of 1 Go yword Product Name Connectors Switch Language English Need Assistance? Contact Us Find a Distributor Order Samples Tech Library Ecocare Electrical Models Printer-friendly page Email this page Cross-Ref

multicomp OVS-0808

Abstract: OVS-08 OVS-0803 OVS-0808 Multicomp OVS-0806 CATHODE BLUE SMD ny smd transistor OVS 30 SMD SI OVS-0806
Contextual Info: SMD Super Bright LED OVS-08 Series CATHODE MARK 0.8 Features: • Standard 0805 Package • Wide Viewing Angle 0.4 0.4 1.4 2.0 RESIN 0.28±0.05 TOP VIEW 10° 20° White 0° Blue / Green / Yellow / Red Radiation Diagram s BOTTOM VIEW 30° 40° 1.0 0.9 50°

OVS-06

Abstract: OVS-0608 OVS-0604 OVS-0603 0603 led red, green, white CATHODE BLUE SMD white led Mega bright
Contextual Info: SMD Super Bright LED CATHODE OVS-06 Series Features: • Small 0603 Footprint • Very Wide Viewing Angle 0.60 0.4 0.4 1.0 1.6 RESIN 0.18±0.03 TOP VIEW 10° 20° 30° 40° 1.0 0.9 50° 0.8 60° 70° 0.7 0.5 0.3 0.1 0.2 0.4 0.6 0° Blue / Green / Yellow / Red

DFB TO

Abstract: H Beam
Contextual Info: 48400 Fremont Blvd. Fremont, CA 94538 USA Tel: 510 445-3068 x 244 Fax: (510) 445-3060 th 50, Lung-Yuan 7 Road, Lung-Tan Tao-Yuan Hsien, TAIWAN Tel: (03) 409-1335 x 230/235 Fax: (03) 409-1339 1310 nm 2.5 Gbps DFB TO-Header Data Sheet (Preliminary) Product Description:

Contextual Info: PRELIMINARY YRH40.245 12-28V, 40A, SINGLE REDUNDANCY MODULE Y-Series REDUNDANCY MODULE ̇ ̇ ̇ ̇ ̇ ̇ ̇ ̇ ̇ ̇ ̇ Suitable for Power Supplies with HiccupPLUS Overload Behavior Minimal Losses - Mosfets Instead of Diodes Only 150mV Voltage Drop at 40A

74AHC244

Abstract: PLCC-3 74AHC244D 74AHC244PW 74AHCT244 74AHCT244D
Contextual Info: P hilips S em ico n d uctors Product sp ecification Octal buffer/line driver; 3-state FEA TUR ES • W ide operating voltage fo r AHC: 2.0 to 5.5 V 74AHC244; 74AHCT244 Q U IC K R E F E R E N C E DATA GN D = 0 V; Tamb = 25 °C; tr = tf < 3.0 ns. T Y P IC A L

w12 diode

Abstract: 7C243 cerdip z PACKAGE CY7C243 CY7C244
Contextual Info: CY7C243 CY7C244 W j? c y p r e s s • F e a tu re s • C M O S for optim um speed/pow er 4K X 8 Reprogrammable PROM C apable o f w ith stan d in g greater th an 2001V sta tic discharge • T T L -com patible I/O • D irect replacem ent for bipolar PR O M s