TO-46 THETA JC Search Results

Contextual Info: QT481 AND QT488 SERIES Q-TECH CORPORATION ULTRA-LOW CURRENT REAL TIME CLOCK OSCILLATORS 2.5Vdc and 3.3Vdc - 32.768kHz Description Q-Tech’s leaded or surface-mount miniature QT481 and QT488 oscillators consist of an IC 3.3Vdc and 2.5Vdc, clock square wave

32.768khz 5ppm

Abstract: QT481 QT88L EAR99 QT492 QT488
Contextual Info: QT481 AND QT488 SERIES Q-TECH CORPORATION ULTRA-LOW CURRENT REAL TIME CLOCK OSCILLATORS 2.5Vdc and 3.3Vdc - 32.768kHz Description Q-Tech’s leaded or surface-mount miniature QT481 and QT488 oscillators consist of an IC 3.3Vdc and 2.5Vdc, clock square wave

Contextual Info: QT481 AND QT488 SERIES Q-TECH CORPORATION ULTRA-LOW CURRENT REAL TIME CLOCK OSCILLATORS 2.5Vdc and 3.3Vdc - 32.768kHz Description Q-Tech’s leaded or surface-mount miniature QT481 and QT488 oscillators consist of an IC 2.5Vdc and 3.3Vdc, clock square wave generator and a miniature round or

Contextual Info: QT581 AND QT588 SERIES Q-TECH CORPORATION ULTRA-LOW CURRENT, HIGH-TEMPERATURE REAL TIME CLOCK OSCILLATORS 2.5Vdc and 3.3Vdc - 32.768kHz Description Q-Tech’s high temperature real time clock oscillators consist of a source clock square wave generator and a

Contextual Info: QT581 AND QT588 SERIES Q-TECH CORPORATION ULTRA-LOW CURRENT, HIGH-TEMPERATURE REAL TIME CLOCK OSCILLATORS 2.5Vdc and 3.3Vdc - 32.768kHz Description Q-Tech’s high temperature real time clock oscillators consist of a source clock square wave generator and a

Contextual Info: QT481 AND QT488 SERIES Q-TECH CORPORATION ULTRA-LOW CURRENT REAL TIME CLOCK OSCILLATORS 2.5Vdc and 3.3Vdc - 32.768kHz Description Q-Tech’s leaded or surface-mount miniature QT481 and QT488 oscillators consist of an IC 2.5Vdc and 3.3Vdc, clock square wave generator and a miniature round or

MCM2680-1 32.768KHZ

Contextual Info: QT581 AND QT588 SERIES Q-TECH CORPORATION ULTRA-LOW CURRENT, HIGH-TEMPERATURE REAL TIME CLOCK OSCILLATORS 2.5Vdc and 3.3Vdc - 32.768kHz Description Q-Tech’s high temperature real time clock oscillators consist of a source clock square wave generator and a

MAX8900

Abstract: DC1006 ion lithium battery ev
Contextual Info: MAX8900C RELIABILITY REPORT FOR MAX8900CEWV+ WAFER LEVEL PRODUCT February 10, 2011 MAXIM INTEGRATED PRODUCTS 120 SAN GABRIEL DR. SUNNYVALE, CA 94086 Approved by Sokhom Chum Quality Assurance Reliability Engineer Maxim Integrated Products. All rights reserved.

Contextual Info: MAX8765 RELIABILITY REPORT FOR MAX8765ETI+ PLASTIC ENCAPSULATED DEVICES July 7, 2011 MAXIM INTEGRATED PRODUCTS 120 SAN GABRIEL DR. SUNNYVALE, CA 94086 Approved by Sokhom Chum Quality Assurance Reliability Engineer Maxim Integrated Products. All rights reserved.

JESD22-A114

Abstract: MAX4951BE SATA III sata Connector signal spacing
Contextual Info: MAX4951BE RELIABILITY REPORT FOR MAX4951BECTP+ PLASTIC ENCAPSULATED DEVICES May 19, 2010 MAXIM INTEGRATED PRODUCTS 120 SAN GABRIEL DR. SUNNYVALE, CA 94086 Approved by Don Lipps Quality Assurance Manager, Reliability Engineering Maxim Integrated Products. All rights reserved.

IPC-9702

Abstract: BGA PACKAGE thermal resistance Freescale JESD51-9 Freescale Tape Ball Grid Array Overview freescale 352 tbga ipc 9702 motherboard ga 151C C151C 181C
Contextual Info: Freescale Semiconductor Tape Ball Grid Array TBGA Overview TM Revision 0 – 2006 Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. Freescale

Theta-JC QFP die down

Abstract: G30-88 Theta-J G38-87 Theta JB
Contextual Info: Freescale Semiconductor, Inc. Thermal Measurement Report Freescale Semiconductor, Inc. Package Description: DATE: 5/8/96 revised 11/18/96 Package: 240 32 x 32 mm QFP Die Down Flag: 10.6 mm Square Leadframe: SIDN 1234625 Die Attach: JMI 2500AN Mold Compound: Sumitomo 7304LC

Contextual Info: LB11685AV Monolithic Digital IC 3-Phase sensor less Motor Driver Application Note http://onsemi.com Overview The LB11685AV is a three-phase full-wave current-linear-drive motor driver which adopts a sensorless control system without a use of Hall effect device. The LB11685AV features a current soft switching circuit for

MT06-2

Abstract: MT06
Contextual Info: MAX6767 RELIABILITY REPORT FOR MAX6767TALD2+T PLASTIC ENCAPSULATED DEVICES June 9, 2011 MAXIM INTEGRATED PRODUCTS 120 SAN GABRIEL DR. SUNNYVALE, CA 94086 Approved by Sokhom Chum Quality Assurance Reliability Engineer Maxim Integrated Products. All rights reserved.

C9633

Abstract: soic theta jc value
Contextual Info: MAX4521 RELIABILITY REPORT FOR MAX4521CSE+ PLASTIC ENCAPSULATED DEVICES October 6, 2011 MAXIM INTEGRATED PRODUCTS 120 SAN GABRIEL DR. SUNNYVALE, CA 94086 Approved by Sokhom Chum Quality Assurance Reliability Engineer Maxim Integrated Products. All rights reserved.

GST-2

Abstract: soic theta jc value
Contextual Info: MAX9371 RELIABILITY REPORT FOR MAX9371ESA+ PLASTIC ENCAPSULATED DEVICES June 10, 2011 MAXIM INTEGRATED PRODUCTS 120 SAN GABRIEL DR. SUNNYVALE, CA 94086 Approved by Sokhom Chum Quality Assurance Reliability Engineer Maxim Integrated Products. All rights reserved.

MAX17108E

Contextual Info: MAX17108ETI+ RELIABILITY REPORT FOR MAX17108ETI+ PLASTIC ENCAPSULATED DEVICES May 4, 2009 MAXIM INTEGRATED PRODUCTS 120 SAN GABRIEL DR. SUNNYVALE, CA 94086 Approved by Ken Wendel Quality Assurance Director, Reliability Engineering Maxim Integrated Products. All rights reserved.

Contextual Info: MAX1305 RELIABILITY REPORT FOR MAX1305ECM+ PLASTIC ENCAPSULATED DEVICES January 3, 2011 MAXIM INTEGRATED PRODUCTS 120 SAN GABRIEL DR. SUNNYVALE, CA 94086 Approved by Sokhom Chum Quality Assurance Reliability Engineer Maxim Integrated Products. All rights reserved.

MAX2850

Abstract: MAX2850ITK "rf transmitter ic" rf transmitter ic 8 channel RF transmitter and Receiver circuit DIA WD401 max285 OFDM receiver wireless hdmi WD40-1
Contextual Info: MAX2850 RELIABILITY REPORT FOR MAX2850ITK+ PLASTIC ENCAPSULATED DEVICES April 8, 2011 MAXIM INTEGRATED PRODUCTS 120 SAN GABRIEL DR. SUNNYVALE, CA 94086 Approved by Sokhom Chum Quality Assurance Reliability Engineer Maxim Integrated Products. All rights reserved.

Contextual Info: MAX4080 RELIABILITY REPORT FOR MAX4080SASA+T PLASTIC ENCAPSULATED DEVICES June 6, 2011 MAXIM INTEGRATED PRODUCTS 120 SAN GABRIEL DR. SUNNYVALE, CA 94086 Approved by Richard Aburano Quality Assurance Manager, Reliability Engineering Maxim Integrated Products. All rights reserved.

98ARL10519D

Abstract: JESD51-5 JEDEC JESD51-8 BGA AN2409 JESD51-7 JESD51-51 jesd51 8 54ld JESD51-8
Contextual Info: Freescale Semiconductor Application Note AN2409 Rev. 1.0, 12/2005 Small Outline Integrated Circuit Fine Pitch Package SOIC 1.0 Purpose This Application Note provides general package information including package dimensions, guidelines for printed circuit board (PCB) layout,

Contextual Info: Freescale Semiconductor Application Note AN2409 Rev. 2.0, 4/2013 Small Outline Integrated Circuit Fine Pitch Package SOIC 1.0 Purpose This Application Note provides general package information including package dimensions, guidelines for printed circuit board (PCB) layout,

MTTF analysis data

Abstract: JEDEC JESD51-8 BGA 98ARL10519D JESD51-51 QFN PACKAGE thermal resistance JESD51-5 JESD51-7 jesd51 8 1147 x motorola SOICW-32
Contextual Info: Freescale Semiconductor, Inc. Application Note AN2409/D Rev. 0, 01/2003 Small Outline Integrated Circuit-Fine Pitch Package SOIC Freescale Semiconductor, Inc. CONTENTS 1.0 PURPOSE 3 2.0 SCOPE 3 3.0 SOIC PACKAGE 3 3.1 PACKAGE DESCRIPTION 3 3.2 PACKAGE DIMENSION

AN1232

Abstract: QFP PACKAGE thermal resistance micromechanical
Contextual Info: MOTOROLA Order this document by AN1232/D SEMICONDUCTOR TECHNICAL DATA AN1232 Thermal Performance of Plastic Ball Grid Array PBGA Packages for Next Generation FSRAM Devices Prepared by: Shailesh Mulgaonker (APDC, Phoenix, AZ) and Bennett Joiner (APDPL, Austin, TX)