TO-264 JEDEC PACKAGE OUTLINE Search Results

S1614

Abstract: S1614XP saronix 106.2500 JESD22 DS264
Contextual Info: S1614XP Series 2.5V CMOS Low Jitter, High Frequency Crystal Clock Oscillator XO Actual Size = 7 x 5mm Product Features Pin Functions Packaging Outline • Thicker crystal than conventional overtone for Pin Function 1 OE Function • Less than 1 ps RMS jitter with advanced non-PLL,

S1614

Abstract: S1614XP crystal sx 8 DS264
Contextual Info: SX Series Crystal Clock Oscillator XO Legacy S1614XP Series 7.0 x 5.0mm SX 2.5V CMOS Low Jitter, High Frequency XO Actual Size = 7 x 5mm Product Features Pin Functions Packaging Outline • Thicker crystal than conventional overtone for improved reliability

LCMXO2-1200

Abstract: CEL-9750ZHF CEL-9750ZHF10
Contextual Info: MachXO2 Product Family Qualification Summary Lattice Document # 25 – 106923 July 2013 Lattice Semiconductor Corporation Doc. #25-106923 Rev. G 1 Dear Customer, Enclosed is Lattice Semiconductor‟s MachXO2 Product Family Qualification Report. This report was created to assist you in the decision making process of selecting and using our products. The

AT45DB081D

Abstract: AT45DB081D-SU-SL955 SL955 AT45-DB081D-SU-SL955 AT45DB081D-MU AT45DB081D-SSU AT45DB081D-SSU-SL955 AT45DB081D-SU SCK 183
Contextual Info: Features • Single 2.5V or 2.7V to 3.6V Supply • RapidS Serial Interface: 66 MHz Maximum Clock Frequency • • • • • • • • • • • • • • – SPI Compatible Modes 0 and 3 User Configurable Page Size – 256 Bytes per Page – 264 Bytes per Page

T03A

Abstract: TO-202 transistor mkt 344 Cu50 TRANSISTOR BC 136 MTL 728 MS-026-bcd M03A BD 669 V84A
Contextual Info: Plastic Package Dimensional/Thermal Data The following table identifies all of the plastic package configurations and pin counts per package type offered by National Semiconductor. In addition, the table provides dimensional and thermal data for each of the plastic packages

vjp44a

Abstract: MO-16B-AB TA11B TF11B cu50 ad 153 transistor transistor bd 905 transistor BC 185 mkt 344 MS-026-bcd
Contextual Info: Plastic Package Dimensional/Thermal Data The following table identifies all of the plastic package configurations and pin counts per package type offered by National Semiconductor. In addition, the table provides dimensional and thermal data for each of the plastic packages

SmD TRANSISTOR a42

Abstract: TRANSISTOR BC 136 TRANSISTOR BC 157 transistor BC 945 TRANSISTOR BC 187 SNA10A TRANSISTOR BC 413 MO-220-WGGD-2 pdf on BC 187 TRANSISTOR MO-220-WKKD-2
Contextual Info: Plastic Package Dimensional/Thermal Data The following table identifies all of the plastic package configurations and pin counts per package type offered by National Semiconductor. In addition, the table provides dimensional and thermal data for each of the plastic packages

VDFN

Abstract: AT45DB081D-SU-SL955 AT45DB081D AT45DB081D-MU AT45DB081D-SSU AT45DB081D-SSU-SL955 AT45DB081D-SU 8S2 EIAJ SOIC EDR-7320
Contextual Info: Features • Single 2.5V or 2.7V to 3.6V Supply • RapidS Serial Interface: 66 MHz Maximum Clock Frequency • • • • • • • • • • • • • • – SPI Compatible Modes 0 and 3 User Configurable Page Size – 256 Bytes per Page – 264 Bytes per Page

AT45DB041D-SU

Abstract: AT45DB041D VDFN AT45DB041D-SSU EDR-7320 AT45DB041D-MU SCK 048 at45db041dsusl955 SL954
Contextual Info: Features • Single 2.5V or 2.7V to 3.6V Supply • RapidS Serial Interface: 66 MHz Maximum Clock Frequency – SPI Compatible Modes 0 and 3 • User Configurable Page Size • • • • • • • • • • • • • – 256 Bytes per Page – 264 Bytes per Page

amkor exposed pad

Abstract: exposed QFP 128 amkor exposed QFP 144
Contextual Info: LEADFRAME data sheet FusionQuad Features: FusionQuad®: Amkor’s FusionQuad® technology represents a breakthrough in leadframe-based plastic packaging through the effective integration of ExposedPad TQFP and MLF® technologies. The novel integration of bottom lands in a QFP provides a cost-effective platform for increased lead count in a small

Contextual Info: Data sheet acquired from Harris Semiconductor SCHS022D – Revised September 2003 The CD4011UB types are supplied in 14-lead hermetic dual-in-line ceramic packages F3A suffix , 14-lead dual-in-line plastic packages (E suffix), 14-lead small-outline packages (M, MT, M96, and NSR suffixes),

amkor

Abstract: amkor exposed pad
Contextual Info: LEADFRAME data sheet FusionQuad Features FusionQuad®: Amkor’s FusionQuad® technology represents a breakthrough in leadframe-based plastic packaging through the effective integration of ExposedPad TQFP and MLF® technologies. The novel integration of bottom lands in a QFP provides a

Contextual Info: Advance Information S1614XP Series 2.5V CMOS Low Jitter, High Frequency Crystal Clock Oscillator XO Actual Size = 5 x 7mm Product Features • Less than 1 ps RMS jitter with advanced non-PLL, patent-pending design • 2.5V CMOS/TTL compatible logic levels

Saronix CRYSTAL oscillator

Abstract: Saronix Oscillator Saronix 24 MHz crystal DS264
Contextual Info: S1614XP Series 2.5V CMOS Low Jitter, High Frequency Crystal Clock Oscillator XO Actual Size = 5 x 7mm Product Features • Less than 1 ps RMS jitter with advanced non-PLL, patent-pending design • 2.5V CMOS/TTL compatible logic levels • Designed for standard reflow and washing

cd4086be

Contextual Info: Data sheet acquired from Harris Semiconductor SCHS061C – Revised September 2003 The CD4086B types are supplied in 14-lead hermetic dual-in-line ceramic packages F3A suffix , 14-lead dual-in-line plastic packages (E suffix), 14-lead small-outline packages (M,

CD4041UBE

Abstract: cmos 4061
Contextual Info: Data sheet acquired from Harris Semiconductor SCHS039C – Revised September 2003 The CD4041UB types are supplied in 14-lead hermetic dual-in-line ceramic packages F3A suffix , 14-lead dual-in-line plastic packages (E suffix), 14-lead small-outline packages (M,

Contextual Info: Data sheet acquired from Harris Semiconductor SCHS016C – Revised September 2003 The CD4001UB types are supplied in 14-lead hermetic dual-in-line ceramic packages F3A suffix , 14-lead dual-in-line plastic packages (E suffix), 14-lead small-outline packages (M, MT, M96, and

CD4085BPW

Contextual Info: Data sheet acquired from Harris Semiconductor SCHS060C – Revised September 2003 The CD4085B types are supplied in 14-lead hermetic dual-in-line ceramic packages F3A suffix , 14-lead dual-in-line plastic packages (E suffix), 14-lead small-outline packages (M,

AT45DB011D-SH-T

Abstract: AT45DB011D-SU AT45DB011D-SSH-T AT45DB011D AT45DB011D-MH-T AT45DB011D-MH-Y JEP106
Contextual Info: Features • Single 2.7V to 3.6V Supply • RapidS Serial Interface: 66 MHz Maximum Clock Frequency – SPI Compatible Modes 0 and 3 • User Configurable Page Size • • • • • • • • • • • • • – 256 Bytes per Page – 264 Bytes per Page

Contextual Info: Features • Single 2.7V to 3.6V Supply • RapidS Serial Interface: 66 MHz Maximum Clock Frequency – SPI Compatible Modes 0 and 3 • User Configurable Page Size • • • • • • • • • • • • • – 256 Bytes per Page – 264 Bytes per Page

AT45DB011D-SH-T

Abstract: AT45DB011D-SSH-T AT45DB011D-SU AT45DB011D AT45DB011D-MH-T AT45DB011D-MH-Y JEP106
Contextual Info: Features • Single 2.7V to 3.6V Supply • RapidS Serial Interface: 66 MHz Maximum Clock Frequency – SPI Compatible Modes 0 and 3 • User Configurable Page Size • • • • • • • • • • • • • – 256 Bytes per Page – 264 Bytes per Page

AT45DB011D-SH-T

Abstract: AT45DB011D-MH-Y AT45DB011D-SSH-B 8MA1 UDFN AT45DB011D-SH-T SL954
Contextual Info: Features • Single 2.7V to 3.6V Supply • RapidS Serial Interface: 66 MHz Maximum Clock Frequency – SPI Compatible Modes 0 and 3 • User Configurable Page Size • • • • • • • • • • • • • – 256 Bytes per Page – 264 Bytes per Page

Contextual Info: Features • Single 2.7V to 3.6V Supply • RapidS Serial Interface: 66 MHz Maximum Clock Frequency – SPI Compatible Modes 0 and 3 • User Configurable Page Size • • • • • • • • • • • • • – 256 Bytes per Page – 264 Bytes per Page

BP317

Abstract: SC05
Contextual Info: DISCRETE SEMICONDUCTORS DATA SHEET Package outlines Video Transistors and Modules for Monitors Supersedes data of 1995 Dec 11 File under Discrete Semiconductors, SC05 1997 Oct 08 Philips Semiconductors Video Transistors and Modules for Monitors Package outlines