TO-220 PACKING METHODS Search Results

Contextual Info: Continental Device India Limited An ISO/TS 16949, ISO 9001 and ISO 14001 Certified Company TO-220 3 leads Thru-hole Plastic Package Package Outline, Tube Packing, Packaging and Handling Information Continental Device India Limited Data Sheet Page 1 of 5

Contextual Info: RECOMMENDED MOUNTING METHOD RECOMMENDED MOUNTING METHOD Soldering Methods, Recommended Soldering Method for Moisture-Proof Packing and Flux Cleaning are in the following. Mounting was evaluated with the following profiles in our company, so there was no problem.

IC JRC

Contextual Info: RECOMMENDED MOUNTING METHOD RECOMMENDED MOUNTING METHOD Soldering Methods, Recommended Soldering Method for Moisture-Proof Packing and Flux Cleaning are in the following. Mounting was evaluated with the following profiles in our company, so there was no problem.

Contextual Info: RECOMMENDED MOUNTING METHOD RECOMMENDED MOUNTING METHOD Soldering Methods, Recommended Soldering Method for Moisture-Proof Packing and Flux Cleaning are in the following.Mounting was evaluated with the following profiles in our company, so there was no problem.

1P28

Abstract: SDMP30 SSOP14 SSOP16 SSOP20 P22 sot89
Contextual Info: m PACKING SPECIFICATION TABLE General Description NJRC delivers ICs in 4 methods of plastic tube container, two kind of Taping,tray and vinyl bag packing. Except adhesive tape treated anti electorostatic and contain carbon are using as the ESD Electrostatic Discharge Damage protection.

2sk4145

Abstract: 2sk4075 UPA2724 2SK4212 2sk4213 uPA2804T1L 2SK4145-S19 2sk4202 uPA2211 2sk3919
Contextual Info: PowerMOSFET Product Overview February 2010 Dear User, Shipment Style This overview contains our current PowerMOSFET portfolio: NEC uses various packing methods depending on the device:  Listed by configuration single/dual and polarity (N or P)  Sorted by voltage first, followed by resistance and current

0410 axial inductor

Abstract: TCALN0204 0410-3R3K 0510-3R3K 0307-100K TCALFB0307 size 0204 0410-4R7K 0410-270K 0307-1R5K
Contextual Info: TOKEN TCAL Through Hole Fixed Inductors Through Hole Fixed Inductors Token fixed inductors meet the needs of a variety of manufacturing methods TCAL Preview Token TCAL series fixed inductor utilizes the latest winding technology with special core material, sturdy

mb160808

Abstract: 100MHZ 200MHZ impedence electrodes MB-321611 Productwell Precision Elect
Contextual Info: MB SERIES MULTILAYER CHIP BEADS MECHANICALS l FEATURE 1. The small size chips generating high impedance. 2. Either flow or reflow soldering methods can be used due to electroplating of the terminal electrodes. 3. High reliability due to an entirely monolithic structure

X7R CAPACITORS color code

Abstract: IR P 648 H w2 p1 samwha capacitor HOW TO ORDER Samwha Ceramic Capacitors 104 capacitor orange Samwha cap Samwha CAPACITOR MLCC capacitor radial z5u
Contextual Info: Radial & Axial Multi Layer Ceramic Capacitors Radial & Axial Code Dimensions Tolerance Code Dimensions Tolerance Code Dimensions Tolerance D Ø 4 ±0.3 P1 3.85 ±0.7 F 64.8 -0, +2 H 16 ±0.5 P2 6.35 ±1.3 G This widely used ceramic capacitors includes both monolithic and multilayer types to provide a wide

NCP6131

Abstract: 6TPE150MAZB 6TPG100M SANYO 2R5TPE470M7 2TPE470M6 6TPE220MAZB 2TPLF470M4E 25TQC5R6M 2TPLF470M6 2TPE470M7
Contextual Info: Capacitors General Catalog 2010-7 Aluminum Solid Capacitors with Conductive Polymer Tantalum Solid Capacitors with Conductive Polymer www.edc.sanyo.com Feature Feature Solid electrolytic capacitors with conductive polymer to meet the needs of all electronic equipments in the world

water level ultrasound

Abstract: E41515 G6H-2F-12VDC reel relay relay miniature 110 vdc
Contextual Info: Surface Mount Relay G6H–2F Low Profile, Miniature, Surface Mount Relay Ultra low profile only 5.2mm. Can be soldered by VPS or IRS methods. Impulse withstand voltage meets FCC and CCITT rules. Low power consumption, 140mW. Available on tape for automatic insertion.

JEDEC TRAY DIMENSIONS

Abstract: HSSOP20 ic packages TRAY TSSOP20 14 X 35 SO16 package trays BGA304 HLQFP100 MSD504 LQFP64 reel size PLCC84 package
Contextual Info: CHAPTER 7 PACKING METHODS page Introduction 7-2 Glossary of terms 7-2 Drypack for moisture sensitive SMDs 7-3 Survey of IC packing methods 7-5 Packing methods in exploded view 7-6 Packing quantities, box dimensions and carrier shapes 7 - 13 Philips Semiconductors

AMD reflow soldering profile BGA

Abstract: ipc-SM-782 amd reflow profile 90 PATTERNS DUAL GRID BGA PROFILING
Contextual Info: u Chapter 3 Board Assembly CHAPTER 3 BOARD ASSEMBLY Introduction PCB Designs Board Assembly Methods Land Patterns Packages and Packing Publication Revision A 3/1/03 3-1 u Chapter 3 Board Assembly INTRODUCTION The electronics industry is continually challenged to

Samwha Ceramic Capacitors

Abstract: X7R CAPACITORS color code Z5U 50 30PPm samwha 1000uF 25V IR P 648 H w2 p1 101K capacitor ceramic SAMWHA RH capacitors samwha marking codes SAMWHA
Contextual Info: Radial & Axial Multi Layer Ceramic Capacitors Radial & Axial Code Dimensions Tolerance Code Dimensions Tolerance Code Dimensions Tolerance D Ø 4 ±0.3 P1 3.85 ±0.7 F 64.8 -0, +2 H 16 ±0.5 P2 6.35 ±1.3 G This widely used ceramic capacitors includes both monolithic and multilayer types to provide a wide

ELJPC100KF

Abstract: ELJPC100MF3 ELJPC120KF ELJPC150KF ELJPC220KF ELJPC330KF eljla4r7kf ELJLA6R8KF
Contextual Info: Fixed Inductors Chip Inductors 4. High Power Type PF, PE, PC, PA, PB, LC, LA • Features ● Low DCR and large current capability, suitable for power circuitry. ● Wire wound, resin molded chip inductor. (PC, PA, PB, LC, LA type) ● Unique Ceramic Core/Laser-cut technology (PF, PE type)

Contextual Info: *Customer : SPECIFICATION ITEM MODEL TOP LED DEVICE SSC-WRT801 [Contents] 1. Features - 2. Application - 3. Components Material -

Contextual Info: Fixed Inductors Chip Inductors 4. High Power Type PF, PE, PC, PA, PB, LC, LA • Features ● Low DCR and large current capability, suitable for power circuitry. ● Wire wound, resin molded chip inductor. (PC, PA, PB, LC, LA type) ● Unique Ceramic Core/Laser-cut technology (PF, PE type)

ELJLA220KF

Contextual Info: Fixed Inductors Chip Inductors 4. High Power Type PF, PE, PC, PA, PB, LC, LA • Features ● Low DCR and large current capability, suitable for power circuitry. ● Wire wound, resin molded chip inductor. (PC, PA, PB, LC, LA type) ● Unique Ceramic Core/Laser-cut technology (PF, PE type)

ANSI/EOS ESD S11.11-2001

Abstract: EIA-625 1x10E-8 EIA-541 SSTV16857 SSYA010 abstract for "metal detector" 1x10e9
Contextual Info: Application Report SZZA047 - July 2004 Semiconductor Packing Material Electrostatic Discharge ESD Protection Albert Escusa and Lance Wright Standard Linear and Logic ABSTRACT Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI)

SU03013-3001

Abstract: E62674 smd code Y1 bc 471 y2 smd code Y2 smd ECK S type ECK-TH ECKTHC471MB BC 633
Contextual Info: Ceramic Capacitors Safety Regulation SMD Ceramic Capacitors (Safety Regulations) For Surface Mounting Types Type HC (Sub-Class Y1) Type FC (Sub-Class Y2) Type BC (Sub-ClassY2 ) • Features ■ Recommended Application ● Resin molded SMD type for flow/reflow soldering (HC)

EN132 400

Abstract: ECKTFC222MF K60384-14 EN132 Y5U SMD ECC-TFC220JG
Contextual Info: Ceramic Capacitors Safety Regulation SMD Ceramic Capacitors (Safety Regulations) For Surface Mounting Types BC and FC • Features ● Resin molded SMD type for reflow soldering ● High reliability ● Safety requirement approved by UL, SEMKO, NEMKO, FIMKO, DEMKO and KTL (for Type FC)

EN132 400

Abstract: Diode smd 5H 2200 Pf diode smd 3H ecctfc330jg iec60384-14 smd 5H transistor EN132 K60384-14 ECC-TFC220JG
Contextual Info: Ceramic Capacitors Safety Regulation SMD Ceramic Capacitors (Safety Regulations) For Surface Mounting Types BC and FC • Features ● Resin molded SMD type for reflow soldering ● High reliability ● Safety requirement approved by UL, SEMKO, NEMKO, FIMKO, DEMKO and KTL (for Type FC)

4047N

Contextual Info: Fixed Inductors Chip Inductors 1. High Frequency Use (Non Magnetic Core) RF, RE, ND, NC, NA • Features ● High frequency capability due to its non magnetic core. ● Capable of being Re-flow or flow soldered. ● Wide line-up from 1005 to 3225 case sizes.

Contextual Info: *Customer: SPECIFICATION ITEM MODEL TOP LED DEVICE SSC-KWT722 [Contents] 1. Features - 2 2. Application - 2 3. Absolute Maximum Ratings - 2