TO-208 PACKAGE Search Results

E5346-68701

Abstract: Mictor pinout 2-767004-2 MC33269 QL5032 QL5130 QL5232 QS5925 QV-PCI32RDK-208 SG8002JA
Contextual Info: QV-PCI32RDK-208 Data Sheet Development Kit for the 32-Bit PCI Devices in 208 PQFP Packages last updated 12/15/99 PCI32RDK - 208 FEATURES Features PCI32RDK - 208 High-Speed 32-bit PCI Add-In Card • 5V PCI Card ■ Programmable Local Clock Speeds 28 MHz to 114 MHz

Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 208 PIN CERAMIC To Top / Package Lineup / Package Index FPT-208C-A01 208-pin ceramic QFP Lead pitch 0.50 mm Lead shape Gullwing Sealing method Metal seal FPT-208C-A01 208-pin ceramic QFP (FPT-208C-A01)

IS 208

Contextual Info: PIN GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 208 PIN CERAMIC To Top / Package Lineup / Package Index PGA-208C-A07 EIAJ code : HPGA208-C-S17D-3 208-pin ceramic PGA Lead pitch 100 mil Pin matrix 17 Sealing method Metal seal PGA-208C-A07 208-pin ceramic PGA

PGA-208C-A04

Contextual Info: PIN GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 208 PIN CERAMIC To Top / Package Lineup / Package Index PGA-208C-A04 EIAJ code : HPGA208-C-S17D-1 208-pin ceramic PGA Lead pitch 100 mil Pin matrix 17 Sealing method Metal seal PGA-208C-A04 208-pin ceramic PGA

Contextual Info: PIN GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 208 PIN CERAMIC To Top / Package Lineup / Package Index PGA-208C-A06 EIAJ code : HPGA208-C-S17D-2 208-pin ceramic PGA Lead pitch 100 mil Pin matrix 17 Sealing method Metal seal PGA-208C-A06 208-pin ceramic PGA

R208

Abstract: IS 208 PGA-208C-A03
Contextual Info: PIN GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 208 PIN CERAMIC To Top / Package Lineup / Package Index PGA-208C-A03 EIAJ code : HPGA208-C-S17D-2 208-pin ceramic PGA Lead pitch 100 mil Pin matrix 17 Sealing method Metal seal PGA-208C-A03 208-pin ceramic PGA

Contextual Info: PIN GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 208 PIN CERAMIC To Top / Package Lineup / Package Index PGA-208C-A05 208-pin ceramic PGA Lead pitch 100 mil Pin matrix 17 Sealing method Metal seal PGA-208C-A05 208-pin ceramic PGA (PGA-208C-A05) 2.54 ± 0.25

Contextual Info: APC207/208 Rail to Rail Output CMOS Single Operating Amplifier Features • Gereral Description The APC207/208 brings performance and enconomy with high gain, CMOS operating amplifier, combining rail to Operating Voltage Single Supply, 3V to 6V • • •

CL-208

Contextual Info: Infrared Emitting Diodes GaAlAs KODENSHI CL-208 DIMENSIONS (Unit : mm) The CL-208 is a high-power GaAlAs IRED mounted in durable, hermetically sealed TO-18 metal can package, providing years of reliable performance even under demanding conditions such as use outdoors.

RSG d3

Abstract: diode db2 RSG D3-0505N
Contextual Info: May 1997 TB 208 Testboard for SLIC PBL 38620-50 The testboard TB 208 offers a simple method to become familiar with Ericsson PBL 38620-50 family SLICs in 28-pin PLCC package. As an option to TB208 we offer two daughter boards: TB210 with the Ring-Trip Network and

Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 208 PIN CERAMIC To Top / Package Lineup / Package Index FPT-208C-C03 208-pin ceramic QFP Lead pitch 0.50 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.50 mm Base ceramic

208-PIN

Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 208 PIN CERAMIC To Top / Package Lineup / Package Index FPT-208C-C04 208-pin ceramic QFP Lead pitch 0.5 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.5 mm Base ceramic

FPT-208C-C02

Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 208 PIN CERAMIC To Top / Package Lineup / Package Index FPT-208C-C02 208-pin ceramic QFP Lead pitch 0.50 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.50 mm Base ceramic

PGA-208C-A02

Abstract: PGA209-C-S17U-1 PGA-208
Contextual Info: PIN GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 208 PIN CERAMIC To Top / Package Lineup / Package Index PGA-208C-A02 EIAJ code :∗PGA209-C-S17U-1 208-pin ceramic PGA Number of pins 209 pins includes extra index pin Lead pitch 100 mil Pin matrix

8600M

Abstract: IS 208
Contextual Info: QUAD TAPE CARRIER PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 208 PIN PLASTIC To Top / Package Lineup / Package Index QTP-208E-M01 208-pin plastic QTP Lead pitch 0.30 mm Package width x package length 20.00 × 20.00 mm Sealing method Resin seal QTP-208E-M01

QFP PACKAGE thermal resistance

Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 208 PIN PLASTIC To Top / Package Lineup / Package Index FPT-208P-M04 208-pin plastic QFP Lead pitch 0.50 mm Package width x package length 28 × 28 mm Lead shape Gullwing Sealing method Plastic mold

QFP208-P-2828-1

Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 208 PIN PLASTIC To Top / Package Lineup / Package Index FPT-208P-M01 EIAJ code :∗QFP208-P-2828-1 208-pin plastic QFP Lead pitch 0.50 mm Package width x package length 28 × 28 mm Lead shape Gullwing

hitachi mold cel

Abstract: texas instruments assembly year A112 CEL-9000
Contextual Info: TEXAS INSTRUMENTS Notification for the Manufacture of 208 PinPDV Package at the Sherman Assembly/Test Facility September 18, 1996 Abstract Texas Instruments Advanced System Logic Products ASL has qualified the Sherman Assembly/Test Facility to manufacture 208 pin PDV package. This qualification will allow for improved

FPT-208P-M06

Abstract: lqfp 52 LQFP Package
Contextual Info: LOW PROFILE SHRINK QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 208 PIN PLASTIC To Top / Package Lineup / Package Index FPT-208P-M06 208-pin plastic LQFP Lead pitch 0.50 mm Package width x package length 28 × 28 mm Lead shape Gullwing Sealing method

QFP208-P-2828-2

Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 208 PIN PLASTIC To Top / Package Lineup / Package Index FPT-208P-M02 EIAJ code :∗QFP208-P-2828-2 208-pin plastic QFP Lead pitch 0.50 mm Package width x package length 28 × 28 mm Lead shape Gullwing

CEL-9000

Abstract: hitachi mold cel cel hitachi A112 TEXAS INSTRUMENTS, Mold Compound EN-4065 SQFP208 en4065
Contextual Info: TEXAS INSTRUMENTS Notification of the Manufacture of 208 Pin PPM Package at the Sherman Assembly/Test Facility September 11, 1996 Abstract Texas Instruments Advanced System Logic Products ASL has qualified the Sherman Assembly/Test Facility to manufacture the 208 pin PPM package. This qualification will allow for

cqf915

Abstract: 877-550-JDSU JDSU laser diode
Contextual Info: Product Bulletin CQF915/208 Series 1550 nm WDM DFB Lasers for Direct Digital Modulation The CQF915/208 is a high-power, directly modulated laser source in a butterfly package for metro WDM systems up to 100 km. The laser is pigtailed with a single-mode fiber and shows

18820

Abstract: CQF915/408-19330
Contextual Info: Product Bulletin 1550 nm WDM DFB Lasers for Direct Digital Modulation CQF915/208 Series The CQF915/208 is a high-power, directly modulated laser source in a butterfly package for metro WDM systems up to 100 km. The laser is pigtailed with a single-mode fiber and shows

RQFP

Abstract: EPM9560RC208-15 CQFP 208 datasheet altera epm9560rc208-15 208 pin rqfp drawing CQFP 208 EPM9560WC208-20 EPM9560RC208-20 EPM9560 EPM9560RC208-15C
Contextual Info: PRODUCT DISCONTINUANCE NOTICE SELECTED MAX 9000 ORDERING CODES Altera will be discontinuing the EPM9560 in the 208-pin ceramic quad-flat pack package CQFP and substituting compatible power quad flat pack package (RQFP) alternatives. All EPM9560 devices in the 208-pin RQFP are form, fit and functionally equivalent* to the