TO-208 PACKAGE Search Results

Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 208 PIN CERAMIC To Top / Package Lineup / Package Index FPT-208C-A01 208-pin ceramic QFP Lead pitch 0.50 mm Lead shape Gullwing Sealing method Metal seal FPT-208C-A01 208-pin ceramic QFP (FPT-208C-A01)

IS 208

Contextual Info: PIN GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 208 PIN CERAMIC To Top / Package Lineup / Package Index PGA-208C-A07 EIAJ code : HPGA208-C-S17D-3 208-pin ceramic PGA Lead pitch 100 mil Pin matrix 17 Sealing method Metal seal PGA-208C-A07 208-pin ceramic PGA

PGA-208C-A04

Contextual Info: PIN GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 208 PIN CERAMIC To Top / Package Lineup / Package Index PGA-208C-A04 EIAJ code : HPGA208-C-S17D-1 208-pin ceramic PGA Lead pitch 100 mil Pin matrix 17 Sealing method Metal seal PGA-208C-A04 208-pin ceramic PGA

Contextual Info: PIN GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 208 PIN CERAMIC To Top / Package Lineup / Package Index PGA-208C-A06 EIAJ code : HPGA208-C-S17D-2 208-pin ceramic PGA Lead pitch 100 mil Pin matrix 17 Sealing method Metal seal PGA-208C-A06 208-pin ceramic PGA

R208

Abstract: IS 208 PGA-208C-A03
Contextual Info: PIN GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 208 PIN CERAMIC To Top / Package Lineup / Package Index PGA-208C-A03 EIAJ code : HPGA208-C-S17D-2 208-pin ceramic PGA Lead pitch 100 mil Pin matrix 17 Sealing method Metal seal PGA-208C-A03 208-pin ceramic PGA

Contextual Info: PIN GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 208 PIN CERAMIC To Top / Package Lineup / Package Index PGA-208C-A05 208-pin ceramic PGA Lead pitch 100 mil Pin matrix 17 Sealing method Metal seal PGA-208C-A05 208-pin ceramic PGA (PGA-208C-A05) 2.54 ± 0.25

Contextual Info: APC207/208 Rail to Rail Output CMOS Single Operating Amplifier Features • Gereral Description The APC207/208 brings performance and enconomy with high gain, CMOS operating amplifier, combining rail to Operating Voltage Single Supply, 3V to 6V • • •

CL-208

Contextual Info: Infrared Emitting Diodes GaAlAs KODENSHI CL-208 DIMENSIONS (Unit : mm) The CL-208 is a high-power GaAlAs IRED mounted in durable, hermetically sealed TO-18 metal can package, providing years of reliable performance even under demanding conditions such as use outdoors.

Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 208 PIN CERAMIC To Top / Package Lineup / Package Index FPT-208C-C03 208-pin ceramic QFP Lead pitch 0.50 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.50 mm Base ceramic

208-PIN

Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 208 PIN CERAMIC To Top / Package Lineup / Package Index FPT-208C-C04 208-pin ceramic QFP Lead pitch 0.5 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.5 mm Base ceramic

FPT-208C-C02

Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 208 PIN CERAMIC To Top / Package Lineup / Package Index FPT-208C-C02 208-pin ceramic QFP Lead pitch 0.50 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.50 mm Base ceramic

PGA-208C-A02

Abstract: PGA209-C-S17U-1 PGA-208
Contextual Info: PIN GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 208 PIN CERAMIC To Top / Package Lineup / Package Index PGA-208C-A02 EIAJ code :∗PGA209-C-S17U-1 208-pin ceramic PGA Number of pins 209 pins includes extra index pin Lead pitch 100 mil Pin matrix

8600M

Abstract: IS 208
Contextual Info: QUAD TAPE CARRIER PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 208 PIN PLASTIC To Top / Package Lineup / Package Index QTP-208E-M01 208-pin plastic QTP Lead pitch 0.30 mm Package width x package length 20.00 × 20.00 mm Sealing method Resin seal QTP-208E-M01

QFP PACKAGE thermal resistance

Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 208 PIN PLASTIC To Top / Package Lineup / Package Index FPT-208P-M04 208-pin plastic QFP Lead pitch 0.50 mm Package width x package length 28 × 28 mm Lead shape Gullwing Sealing method Plastic mold

FPT-208P-M06

Abstract: lqfp 52 LQFP Package
Contextual Info: LOW PROFILE SHRINK QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 208 PIN PLASTIC To Top / Package Lineup / Package Index FPT-208P-M06 208-pin plastic LQFP Lead pitch 0.50 mm Package width x package length 28 × 28 mm Lead shape Gullwing Sealing method

QFP208-P-2828-2

Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 208 PIN PLASTIC To Top / Package Lineup / Package Index FPT-208P-M02 EIAJ code :∗QFP208-P-2828-2 208-pin plastic QFP Lead pitch 0.50 mm Package width x package length 28 × 28 mm Lead shape Gullwing

cqf915

Abstract: 877-550-JDSU JDSU laser diode
Contextual Info: Product Bulletin CQF915/208 Series 1550 nm WDM DFB Lasers for Direct Digital Modulation The CQF915/208 is a high-power, directly modulated laser source in a butterfly package for metro WDM systems up to 100 km. The laser is pigtailed with a single-mode fiber and shows

RQFP

Abstract: EPM9560RC208-15 CQFP 208 datasheet altera epm9560rc208-15 208 pin rqfp drawing CQFP 208 EPM9560WC208-20 EPM9560RC208-20 EPM9560 EPM9560RC208-15C
Contextual Info: PRODUCT DISCONTINUANCE NOTICE SELECTED MAX 9000 ORDERING CODES Altera will be discontinuing the EPM9560 in the 208-pin ceramic quad-flat pack package CQFP and substituting compatible power quad flat pack package (RQFP) alternatives. All EPM9560 devices in the 208-pin RQFP are form, fit and functionally equivalent* to the

sot-23-5 marking code

Abstract: diode RL 207 JESD for TCT SOT-23-5 A102 A108 APC207 APC208 APC308 B102
Contextual Info: APC206/207/208 Rail to Rail Output CMOS Single Operating Amplifier Features • • • • • • • • • • General Description The APC206/207/208 brings performance and enconomy with high gain, CMOS operating amplifier, combining rail Operating Voltage Single Supply, 3V to 6V

IC 4093 pin configuration

Abstract: K9F1216U0A IC 4093 K9F1208Q0A-DCB0 K9F1208Q0A-XXB0 K9F1208U0A-DCB0 K9F1208U0A-VCB0 K9F1208U0A-YCB0 K9F1216Q0A-DCB0 SAMSUNG 256Mb NAND Flash Qualification Report
Contextual Info: San 16 Banwol-Ri Taean-Eup Hwasung- City Kyungki Do, Korea Tel. 82 - 31 - 208 - 6463 Fax.) 82 - 31 -208 - 6799 ELECTRONICS March. 2003 512Mb/256Mb 1.8V NAND Flash Errata Description : Some of AC characteristics are not meeting the specification. > AC characteristics : Refer to Table

Contextual Info: San 16 Banwol-Ri Taean-Eup Hwasung- City Kyungki Do, Korea Tel. 82 - 31 - 208 - 6463 Fax.) 82 - 31 -208 - 6799 ELECTRONICS March. 2003 1Gb 1.8V NAND Flash Errata Description : Some of AC characteristics are not meeting the specification. > AC characteristics : Refer to Table

Contextual Info: San 16 Banwol-Ri Taean-Eup Hwasung- City Kyungki Do, Korea Tel. 82 - 31 - 208 - 6463 Fax.) 82 - 31 -208 - 6799 ELECTRONICS March. 2003 512Mb/256Mb 1.8V NAND Flash Errata Description : Some of AC characteristics are not meeting the specification. > AC characteristics : Refer to Table

K9K1208X0C

Abstract: SAMSUNG 256Mb NAND Flash Qualification Report Samsung NAND
Contextual Info: San 16 Banwol-Ri Taean-Eup Hwasung- City Kyungki Do, Korea Tel. 82 - 31 - 208 - 6463 Fax.) 82 - 31 -208 - 6799 ELECTRONICS March. 2003 512Mb/256Mb 1.8V NAND Flash Errata Description : Some of AC characteristics are not meeting the specification. > AC characteristics : Refer to Table

Contextual Info: San 16 Banwol-Ri Taean-Eup Hwasung- City Kyungki Do, Korea Tel. 82 - 31 - 208 - 6463 Fax.) 82 - 31 -208 - 6799 ELECTRONICS March. 2003 1Gb 1.8V NAND Flash Errata Description : Some of AC characteristics are not meeting the specification. > AC characteristics : Refer to Table