TN55 Search Results

Contextual Info: Available as: RF AMPLIFIER MODEL TM5519 TM 5519, 4 Pin TO -8 T4 TN5519, 4 Pin Surface Mount (SM3) FP5519, 4 Pin Flatpack (FP4) BX5519, Connectorized Housing (H1) Features Typical Intermodulation Performance at 2 5 0 C • ■ ■ ■ Second Order Harmonic Intercept P oint

low noise

Abstract: TM5538
Contextual Info: RF AMPLIFIER MODEL TM5538 Available as: TM5538, 4 Pin TO-8 T4 TN5538, 4 Pin Surface Mount (SM3) FP5538, 4 Pin Flatpack (FP4) BX5538, Connectorized Housing (H1) Features Typical Intermodulation Performance at 25 º C ! ! ! ! Second Order Harmonic Intercept Point . +50 dBm (Typ.)

BX5519

Abstract: FP5519 TM5519 TN5519
Contextual Info: RF AMPLIFIER MODEL TM5519 Available as: TM5519, 4 Pin TO-8 T4 TN5519, 4 Pin Surface Mount (SM3) FP5519, 4 Pin Flatpack (FP4) BX5519, Connectorized Housing (H1) Features Typical Intermodulation Performance at 25 º C ! ! ! ! Second Order Harmonic Intercept Point . +43 dBm (Typ.)

Contextual Info: TN5544 / SN5544 Amplifier Performance Datasheet Cross Reference Guide TN5544 / SN5544* * Part number for additional environmental screening. Performance Data Package Drawing Frequency 10.0 - 500.0 MHz Gain 12.5 dB Typical 11.0 dB Min Noise Figure 2.5 dB Typical

SPDR

Abstract: ATMEGA168 SCA3000-D01 SCA3000-E01 SCA3000 TN55 fall detection
Contextual Info: C-code examples for SCA3000 TN55 C-CODE EXAMPLES FOR SCA3000 ACCELEROMETER 1 INTRODUCTION This technical note presents simple C-code examples for SPI communication between the SCA3000 sensor and a MCU. In these code examples • the X-axis acceleration is read from the SCA3000 sensor

BX5544

Abstract: FP5544 TM5544 TN5544
Contextual Info: Available as: RF AMPLIFIER MODEL TM5544, 4 Pin TO-8 T4 TN5544, 4 Pin Surface Mount (SM3) FP5544, 4 Pin Flatpack (FP4) BX5544, Connectorized Housing (H1) Features Typical Intermodulation Performance at 25 º C • ■ ■ Operating Temp. - 55 ºC to +85 ºC

Contextual Info: TN5519 / SN5519 Amplifier Performance Datasheet Cross Reference Guide TN5519 / SN5519* * Part number for additional environmental screening. Performance Data Package Drawing Frequency 5.0 - 500.0 MHz Gain 15.0 dB Typical 14.0 dB Min Noise Figure 2.2 dB Typical

SD17935

Contextual Info: MILTECH ENVELOPE DIMENSIONS TM MILTECH 340/340XL and MILTECH 480 MILTECH 340/340XL/EL MILTECH 480 “B” “B” “A” “A” Standard Replaceable Connectors COMMON FRONT ENDS Connector Type Part Weight Tool Number oz/g P/N ATNC Plug . SD48555 . 0.62/18 . TN550-625

BX5519

Abstract: FP5519 TM5519 TN5519
Contextual Info: Available as: RF AMPLIFIER MODEL TM5519, 4 Pin TO-8 T4 TN5519, 4 Pin Surface Mount (SM3) FP5519, 4 Pin Flatpack (FP4) BX5519, Connectorized Housing (H1) Features Typical Intermodulation Performance at 25 º C • ■ ■ Operating Temp. - 55 ºC to +85 ºC

low noise

Abstract: TM5544
Contextual Info: RF AMPLIFIER MODEL TM5544 Available as: TM5544, 4 Pin TO-8 T4 TN5544, 4 Pin Surface Mount (SM3) FP5544, 4 Pin Flatpack (FP4) BX5544, Connectorized Housing (H1) Features Typical Intermodulation Performance at 25 º C ! ! ! ! Second Order Harmonic Intercept Point . +38 dBm (Typ.)

MS-026

Abstract: MT55L256L32P MT55L256L36P MT55L256V32P MT55L256V36P MT55L512L18P MT55L512V18P
Contextual Info: 8Mb: 512K x 18, 256K x 32/36 PIPELINED ZBT SRAM 8Mb ZBT SRAM MT55L512L18P, MT55L512V18P, MT55L256L32P, MT55L256V32P, MT55L256L36P, MT55L256V36P 3.3V VDD, 3.3V or 2.5V I/O FEATURES • • • • • • • • • • • • • • • • • • •

MT55L256L18P1T-10A

Abstract: MS-026 MT55L128L32P1 MT55L128L36P1 MT55L128V32P1 MT55L128V36P1 MT55L256L18P1 MT55L256L18P1T-10 MT55L256V18P1 84 FBGA thermal
Contextual Info: PRELIMINARY 4Mb: 256K x 18, 128K x 32/36 PIPELINED ZBT SRAM 4Mb ZBT SRAM MT55L256L18P1, MT55L256V18P1, MT55L128L32P1, MT55L128V32P1, MT55L128L36P1, MT55L128V36P1 3.3V VDD, 3.3V or 2.5V I/O FEATURES • • • • • • • • • • • • • •

transistor cms 6BW

Abstract: g2v2 relay 4 digit 7 segment calculator lcd display pin BIT 31936 g2v2 transistor 5bw A7102A 6BW 87 automatic dialer sd 7402
Contextual Info: DEFINITY Enterprise Communications Server and System 75 and System 85 Terminals and Adjuncts Reference 555-015-201 Comcode 108603994 Issue 11 December 1999 Copyright  1999, Lucent Technologies All Rights Reserved Printed in USA Notice Every effort was made to ensure that the information in this book was

EL156

Contextual Info: RF AMPLIFIER MODEL TM5544 Available as: Features Typical Intermodulation Performance at 25 0 C • ■ ■ ■ Second Order Harmonic Intercept P oint +38 Typ. Second Order Two Tone Intercept P oint +33 (Typ.) Third Order Two Tone Intercept P oint. +27 (Typ.)

zbt sram 1994

Contextual Info: SRAM ADDENDUM Attention: Micron has discontinued its 119-pin BGA SRAM package. While we are currently working to update these data sheets, please note that this data sheet still shows the discontinued package. For further information please call 208-368-3900.

Contextual Info: ADVANCE 8Mb: 512K x 18, 256K x 32/36 FLOW-THROUGH ZBT SRAM MT55L512L18F, MT55L256L32F, MT55L256L36F; MT55L512V18F, MT55L256V32F, MT55L256V36F 8Mb ZBT SRAM 3.3V VDD, 3.3V or 2.5V I/O FEATURES • • • • • • • • • • • • • • • •

Contextual Info: PRELIMINARY 4Mb: 256K x 18, 128K x 32/36 FLOW-THROUGH ZBT SRAM 4Mb ZBT SRAM MT55L256L18F1, MT55L128L32F1, MT55L128L36F1; MT55L256V18F1, MT55L128V32F1, MT55L128V36F1 3.3V VDD, 3.3V or 2.5V I/O FEATURES • • • • • • • • • • • • • •

4c 8184

Abstract: BGA 2J marking code 18-SE
Contextual Info: ADVANCE‡ 18Mb: 1 MEG x 18, 512K x 32/36 FLOW-THROUGH ZBT SRAM 18Mb ZBT SRAM MT55L1MY18F, MT55V1MV18F, MT55L512Y32F, MT55V512V32F, MT55L512Y36F, MT55V512V36F 3.3V VDD, 3.3V or 2.5V I/O; 2.5V VDD 2.5V I/O FEATURES • • • • • • • • • •

Contextual Info: ADVANCE‡ 0.13µm Process 36Mb: 2 MEG x 18, 1 MEG x 32/36 PIPELINED ZBT SRAM 36Mb ZBT SRAM MT55L2MY18P, MT55V2MV18P, MT55L1MY32P, MT55V1MV32P, MT55L1MY36P, MT55V1MV36P 3.3V VDD, 3.3V or 2.5V I/O; 2.5V VDD, 2.5V I/O Features Figure 1: 100-Pin TQFP • High frequency and 100 percent bus utilization

Contextual Info: 2Mb: 128K x 18, 64K x 32/36 3.3V I/O, PIPELINED ZBT SRAM 2Mb ZBT SRAM MT55L128L18P1, MT55L64L32P1, MT55L64L36P1 3.3V VDD, 3.3V I/O FEATURES • • • • • • • • • • • • • • • • • • • High frequency and 100 percent bus utilization

Contextual Info: ADVANCE‡ 0.16µm Process 18Mb: 1 MEG x 18, 512K x 32/36 FLOW-THROUGH ZBT SRAM MT55L1MY18F, MT55V1MV18F, MT55L512Y32F, MT55V512V32F, MT55L512Y36F, MT55V512V36F 18Mb ZBT SRAM 3.3V VDD, 3.3V or 2.5V I/O; 2.5V VDD, 2.5V I/O FEATURES • • • • • •

Contextual Info: ADVANCE 16Mb: 1 MEG x 18, 512K x 32/36 PIPELINED ZBT SRAM 16Mb ZBT SRAM MT55L1MY18P, MT55V1MV18P, MT55L512Y32P, MT55V512V32P, MT55L512Y36P, MT55V512V36P 3.3V VDD, 3.3V or 2.5V I/O; 2.5V VDD 2.5V I/O FEATURES 100-Pin TQFP1 • High frequency and 100 percent bus utilization

Contextual Info: 18Mb: 1 MEG x 18, 512K x 32/36 PIPELINED ZBT SRAM 18Mb ZBT SRAM MT55L1MY18P, MT55V1MV18P, MT55L512Y32P, MT55V512V32P, MT55L512Y36P, MT55V512V36P 3.3V VDD, 3.3V or 2.5V I/O; 2.5V VDD, 2.5V I/O Features Figure 1: 100-Pin TQFP • High frequency and 100 percent bus utilization

Contextual Info: 2Mb: 128K x 18, 64K x 32/36 3.3V I/O, PIPELINED ZBT SRAM 2Mb ZBT SRAM MT55L128L18P1, MT55L64L32P1, MT55L64L36P1 3.3V VDD, 3.3V I/O FEATURES • • • • • • • • • • • • • • • • • • • High frequency and 100 percent bus utilization