TITANIUM OXIDE Search Results

Thermistor 44007

Abstract: 44031
Contextual Info: OMEGA’s Precision Interchangeable Thermistors Construction - Thermistors are manufactured from oxides of nickel, manganese, iron, cobalt, magnesium, titanium and other metals. All are available epoxy encapsulated and color coded, with two 3" leads. 1.2 12

E10 varistor

Abstract: A170300 A0200-4 SrTiO3 oxide
Contextual Info: STRONTIUM TITANATE RING VARISTOR FEATURES Conductor ceramic is made of titanium oxide and strontium. Used in the range of low voltage E10=1.5~60V. E 10 =1.5~60V Wide capacitance ,absorb the noise in a wide frequency range. Excellent non-linearity voltage;

03787

Contextual Info: MATERIAL DECLARATION SHEET Material # CMF-SDP Product Line PTC resistors Date 1/6/2009 Version A/0 RoHS Compliant Yes No. 1 Construction element Substrate Material group Ceramic Material weight [g] Materials CAS if applicable Barium oxide 1304-28-5 50 Titanium

carbon monoxide detector

Abstract: electrochemical sensor CO gas sensor CO "Co Sensor" carbon monoxide sensor carbon monoxide sensor electrochemical NGL07 D3162 Capteur Sensors NGL07 electrochemical gas sensors datasheet
Contextual Info: General information on the Capteur NGL07 Carbon Monoxide sensors Principle of Operation The Capteur ‘G’ series sensor is a Mixed Metal Oxide semiconductor based on Chromium Titanium Oxide. When heated to a high temperature the material behaves towards reducing gases as a p-type semiconductor and increases in

Contextual Info: リングバリスタ RING VARISTORS OPERATING TEMP. K25VJ120C 特長 FEATURES YConductor ceramic is made of titanium oxide and strontium. YLarge net voltage non-linear coefficient α of 3 to 7, and large electrostatic capacitance of 10 to 150 nF. Noise can thus be absorbed over a wide

Contextual Info: Isoplanar-Z Junction Fuse Principles and Programming Conventional fu sib le link bipolar PROM s and program ­ m able logic devices are based upon tw o dim ensional m atrices o f e le ctrica lly conductive thin film fusible elem ents of m aterials such as nichrom e, titanium

Titanium dioxide

Abstract: copper wire datasheet cas number epoxy resin datasheet IMDS copper wire composition 31.5 1344-28-1 7631-86-9 49R9
Contextual Info: IMDS Declaration Film Resistors MFR4 (1R0-49R9) Pb free terminations Component Name Ceramic Rod Mullite Weight Constituent (g) 0.036 Aluminium oxide Silicon dioxide Other oxides End Caps Steel 0.030 Iron Other metals 7439-89-6 99 1 Plating 0.001 Copper Tin

bottle filling circuit diagram

Abstract: ARALDITE standard epoxy adhesive 503-357 araldite RS Cyanoacrylate activator ARALDITE rapid neoprene primer bottle filling circuit diagram free Polydimethylsiloxane TOUGHENED
Contextual Info: Data Pack K Data Sheet The use of adhesives in industry today covers a very broad range of applications. When engineers are contemplating the use of adhesives for a specific project, they have to consider which type is most appropriate, then they have to ensure that

d 9329

Abstract: MARKING Scw SOT23 gus-ss cel-9220 cel9220 scw marking code sot 23 PFC-W0805LF SCW-SC3LF WCA0804 PWC2512L
Contextual Info: Surface Mount QSOP Resistor Networks IRC Advanced Film Division QSOP Series • Reliable, no internal cavity • High resistor density - .025” lead spacing • Standard JEDEC 16, 20, and 24 pin packages • Ultra-stable TaNSil resistors on silicon substrates

ptc thermistor level sensors

Abstract: ptc thermistor level sensor circuit schematic level water PTC Thermistor siemens PTC thermistor Petrol pump oil metering SENSING CIRCUIT air flow thermistors PTC sensor liquid level sensor circuit thermistor siemens thermistor
Contextual Info: PTC thermistors as level sensors Rugged and reliable Author: Philipp Roth, Dipl.-Phys., Dipl.-Ing. Ceramic PTC thermistors are a way of measuring the level of fluids. Their resistance depends very much on the thermal conductance of the medium surrounding them, like air or oil,

Contextual Info: The MiniNet Manufacturing Process To define an electrical pattern on each silicon wafer, a series of steps must be taken. At each step, the work must be rigorously tested to ensure quality and cleanliness since the smallest impurity can lead to electronic leakage. The Bourns

Contextual Info: Model BPC5 *J Weight 1.2843 gms Breakdown of component e.g. Material Name. chassis, transformer, lead (e.g. Sn alloy frame, encapsulation, etc. ) Substance Name (e.g. Copper (Cu) Alumina Substrate Aluminum Oxide Alumina Silica Magnesium Oxide Calcium Oxide

744020

Contextual Info: MATERIAL DECLARATION SHEET Material # Product Line Date RoHS Compliant 3260 series Trimmer 6/17/2004 Yes No. Construction element Material group 1 Contact Spring Pd/Ag 2 Housing Thermoset Material weight [g] 0.0029 0.0025 0.001 trace 0.174 0.0086 0.0039 0.0058

diode marking 226

Contextual Info: MATERIAL DECLARATION SHEET Material # CMF-RQ Product Line PTC resistors Date 01/13/2009 Version A/0 RoHS Compliant Yes No. 1 Construction element Substrate Material group Ceramic Material weight [g] Materials CAS if applicable Average mass [%] Barium oxide

it1338

Abstract: Solder Paste Dupont
Contextual Info: ASIC Flip Chips: Manufacture and Use fôv H . i r b t i r a I . i i h s o n , A p p l i c a t i o n s F n i» i iu 't * i Introduction plastic encapsulated device: wire bonds and wire damage during assembly, are avoided. By attaching directly to the substrate without being mounted on a lead frame or

encoder 9985

Abstract: 9985 encoder 112945-52-5 adhesive fr 309 92278 9985, encoder
Contextual Info: MATERIAL DECLARATION SHEET Material Number EMS22 – Dual Ball Bearing Product Line Magnetic Encoder Compliance Date Since inception RoHS Compliant Yes No. 1 Construction Element subpart C-Clip MSL Homogeneous Material Stainless Steel N/A Material weight

Contextual Info: Wondermask WS MATERIAL SAFETY DATA SHEET Finished Product Date-Issued: MSDS Ref. No: Date-Revised: Revision No: 01/10/2003 2207-G/5G 01/10/2003 New MSDS Wondermask WS 1. PRODUCT AND COMPANY IDENTIFICATION PRODUCT NAME: Wondermask WS PRODUCT DESCRIPTION: Wave solder process masking agent

Flip Chip Substrate

Abstract: Dupont 9476
Contextual Info: ASIC Flip Chips: Manufacture and Use ! ir i v i t : ì I>mmi . Introduction Application specific integrated circuits ASICs have been available and widely used for almost two decades. On the other hand, the surface mount technology known as "Flip Chip” has been available, but not widely known outside of

Contextual Info: ASV,ASVK,ASL Ceramic Type List of main material declaration Item Weight(mg) 183.7 INFORMATION Material Package Base Process Name of the part Package Base Ceramic SMD Material Ceramics Item Name Lead Free Material Au / Ni Material Weight(mg) 156 Die Bonding

Dupont 9476

Contextual Info: ASIC FLIP CHIPS Application Note ASIC Flip Chips: Manufacture and Use By Barbara L. Gibson, Applications Engineer plastic encapsulated device: wire bonds and wire damage during assembly, are avoided. By attaching directly to the substrate without being mounted on a lead frame or

ABB TB556

Abstract: TB557 water ph sensor TB557 TB556 TB551 4TB5205-0119 4TB9515-0223 4TB5205-0174 TBX556 4TB5023-0088
Contextual Info: Data Sheet SS/TBX5_3 pH/Redox ORP Sensors for Process Monitoring TB(X)5 Series  Next Step Solid State reference – eliminates poisoning, pumping and plugging  Advantage™ Series with solution ground rod – permits continuous sensor diagnostics

4 tinned copper wire

Abstract: 11314
Contextual Info: MATERIAL DECLARATION SHEET Material # CMF-RL BIG Product Line PTC resistors Date 1/6/2009 Version A/1 RoHS Compliant Yes No. 1 Construction element Substrate Material group Ceramic Material weight [g] 0.8691 Materials CAS if applicable Average mass [%] Barium oxide

diode marking 226

Abstract: BA9513 epoxy resin
Contextual Info: MATERIAL DECLARATION SHEET Material # CMF-SD Big Product Line PTC resistors Date 08/15/2008 Version A/1 RoHS Compliant Yes No. 1 Construction element Substrate Material group Ceramic Material weight [g] Materials CAS if applicable Average mass [%] Barium oxide

Contextual Info: BSR1 100 GE Weight 0.044771 gms Breakdown of component e.g. chassis, transformer, lead frame, encapsulation, etc. Material Substance Name (e.g. Name. Copper (Cu) (e.g. Sn alloy) Alumina Substrate Alumina Thick Film Conductor Thick Film Resistor Thick Film