TI PACKING LABEL Search Results

EIA and EIAJ standards 783

Abstract: JEDEC tray standard dimension abstract for water level indicator EIA-481-x EIA standards 783 EIA 783 JEDEC Matrix Tray outlines QFP Shipping Trays EIA-783 EIA 481 TSSOP
Contextual Info: Application Report SZZA021A – January 2000 Semiconductor Packing Methodology Cles Troxtell, Bobby O’Donley, Ray Purdom, and Edgar Zuniga Standard Linear and Logic ABSTRACT The Texas Instruments TI Semiconductor Group uses three packing methodologies to

transistor b941

Abstract: B941 transistor 39 77 marking zener diode, sot323 or sot89 B941 marking codes IC sot-223 marking sot223 GY CEN526 marking code maxim label transistor gy sot-23 transistor gy sot-223
Contextual Info: E n g in e e r in g S p e c if ic a t io n s Page Axial Lead Tape and Reel 228 TO-92 Tape and Reel 230 TO-92 Ammopack 233 DO-35 Radial Tape and Reel 236 DO-41 SP Radial Tape and Reel 239 Standard Packing Quantity 241 Package Labeling 243 Bar Code Labeling

ATMEL 740

Abstract: atmel 830 ATMEL Tape and Reel drawing LQFP-44 ATMEL shipping label atmel 0635 ATMEL Tape and Reel QFN-64 QFN-64 atmel 1030 pj 54 diode
Contextual Info: Packaging and Packing Information Packaging according to IEC 60286-3 for Tape and Reel, and IEC 60286-4 for tube packing. 1. Labels In general, on products coming out of Atmel ’s Heilbronn Germany location, two labels are on the inner cardboard: Atmel's standard bar code label and a customer

Contextual Info: Philips Semiconductors General Handling MOS devices ELECTROSTATIC CHARGES contents are sensitive to electrostatic discharge is shown by warning labels on both primary and secondary packing. Electrostatic charges can exist in many things; for example, man-made-fibre clothing, moving machinery, objects with air blowing

tk 19 209

Abstract: atmel 0635 IC MC 14017 B
Contextual Info: jflmëE W IR E L E S S * i/C Packaging and Packing Information Atmel Wireless & Microcontrollers Standard Bar-Code Labels The Atmel Wireless & Microcontrollers standard bar-code labels are printed at final packing areas. The labels are on each packing unit and contain Atmel Wireless & Microcontrollers’ specific data.

JEDEC Matrix Tray outlines

Abstract: ti packing label dck3 QFP Shipping Trays tray bga 64 EIA-468 label location EIA standards 783 EIA-481-x dbv4 EIA-783
Contextual Info: Application Report SZZA021C − September 2005 Semiconductor Packing Methodology Cles Troxtell, Bobby O’Donley, Ray Purdom, and Edgar Zuniga Standard Linear & Logic ABSTRACT The Texas Instruments Semiconductor Group uses three packing methodologies to prepare

EIA and EIAJ standards 783

Abstract: EIA standards 783 EIA 783 eia783 EIA-783 ic shipping tray tsop Shipping Trays SZZA021B tray matrix bga ti packing label
Contextual Info: Application Report SZZA021B – September 2001 Semiconductor Packing Methodology Cles Troxtell, Bobby O’Donley, Ray Purdom, and Edgar Zuniga Standard Linear & Logic ABSTRACT The Texas Instruments Semiconductor Group uses three packing methodologies to prepare

TI Wafermap format

Abstract: barcode reader circuit laser barcode reader circuit
Contextual Info: Tag-it HF-I Standard Transponder IC Reference Guide A TEXAS INSTRUMENTS TECHNOLOGY October 2007 SCBU047 11-09-21-064 Tag-it HF-I Standard Transponder IC Reference Guide A TEXAS INSTRUMENTS TECHNOLOGY Literature Number: SCBU047 (11-09-21-064) October 2007

TI Wafermap format

Abstract: laser barcode reader circuit tiris antenna TI Assembly Factory Code wafer map ISO15693 tiris rfid 15693 FSK RF-HDT-SJLE 0013e0
Contextual Info: Tag-it HF-I Standard Transponder IC Reference Guide A TEXAS INSTRUMENTS TECHNOLOGY October 2007 SCBU047 11-09-21-064 Tag-it HF-I Standard Transponder IC Reference Guide A TEXAS INSTRUMENTS TECHNOLOGY Literature Number: SCBU047 (11-09-21-064) October 2007

laser barcode reader circuit

Abstract: TI Wafermap format ti packing label tiris rfid 13.56 TI Assembly Factory Code ISO15693 TIRIS RFID systems map disco code marking ti map IC Lot Code Identification
Contextual Info: Tag-it HF-I Pro Transponder IC Reference Guide A TEXAS INSTRUMENTS TECHNOLOGY October 2007 SCBU045 11-09-21-065 Tag-it HF-I Pro Transponder IC Reference Guide A TEXAS INSTRUMENTS TECHNOLOGY Literature Number: SCBU045 (11-09-21-065) October 2007 Contents

TI Wafermap format

Contextual Info: Tag-it HF-I Pro Transponder IC Reference Guide A TEXAS INSTRUMENTS TECHNOLOGY October 2007 SCBU045 11-09-21-065 Tag-it HF-I Pro Transponder IC Reference Guide A TEXAS INSTRUMENTS TECHNOLOGY Literature Number: SCBU045 (11-09-21-065) October 2007 Contents

TI Wafermap format

Abstract: laser barcode reader circuit ISO15693 1 out of 4 inventory request texas instruments packing label TI Assembly Factory Code ISO15693 RF-HDT-SJLC automotive transponder silica Tiris barcode reader circuit
Contextual Info: Tag-it HF-I Plus Transponder IC Reference Guide A TEXAS INSTRUMENTS TECHNOLOGY October 2007 SCBU046 11-09-21-063 Tag-it HF-I Plus Transponder IC Reference Guide A TEXAS INSTRUMENTS TECHNOLOGY Literature Number: SCBU046 (11-09-21-063) October 2007 Contents

Ion Chromatography

Contextual Info: Application Report SZZA042 - November 2003 Use of Polystyrene for Bare-Die Carrier-Tape Shipping Applications Michael Hayden, Lee Lewis, and Lance Wright Standard Linear & Logic ABSTRACT The packing and shipping of bare-die product is relatively new, especially in the tape-and-reel

Contextual Info: Tag-it HF-I Pro Transponder Inlays Reference Guide Literature Number: SCBU009B December 2005 – Revised September 2011 2 SCBU009B – December 2005 – Revised September 2011 Submit Documentation Feedback Copyright 2005–2011, Texas Instruments Incorporated

56mm carrier tape

Abstract: 28 pin ic TM 1628
Contextual Info: u Chapter 13 Packing Methods and Labels CHAPTER 13 PACKING METHODS AND LABELS Introduction Quality Pack Program Packing for Tubes Packing for Trays Packing for Tape and Reels Packing for Jewel Boxes Box Labeling Packages and Packing Publication Revision A 3/1/03

MARKING AHW

Abstract: PEAK tray drawing ScansU9X28
Contextual Info: SHARP LHP V 5 6 2 S 1 Contents 1. General .*. 2 2. Features . . 2 3. Pin Configuration and Pin Description -. 3 .

Date Code wolfson

Abstract: WM8725ED MH1082 WOLFSON date code Date Code format wolfson EH11 MH10 WOLFSON MICROELECTRONICS WM8199SCDS ti packing label
Contextual Info: w WTN_0226 Inner Product and Outer Shipping Label Specifications INTRODUCTION This document specifies the dimensions, content, layout and placement of Wolfson Microelectronics labels used for inner packaging and outer shipping containers. These are target specifications –

"0.4mm" bga "ball collapse" height

Abstract: Modified Coffin-Manson Equation Calculations 65X65 nFBGA SN 29733 TEXAS INSTRUMENTS, Mold Compound, CSP 12x12 bga thermal resistance 385Z SPRAA99 72ZST
Contextual Info: Application Report SPRAA99 – March 2008 nFBGA Packaging Robert Furtaw . ABSTRACT This application report gives you technical background on nFBGA packages and

Contextual Info: LH53C32600N 32M Mask ROM Model No.: LHMC56xx Spec No.: EL097186 Issue Date: August 5, 1997 SHARP LH53C32600N # Handle this docuaent carefully for it contains aaterial protected by international copyright law. Any reproduction, full or in part, of this laterial is prohibited

Feeder 12/16 mm

Abstract: electronic assembly tape hitachi feeder
Contextual Info: 12-mm Tape-and-Reel Component-Delivery System SLZA001 August 1998 1 IMPORTANT NOTICE Texas Instruments and its subsidiaries TI reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest

TI lead finish

Contextual Info: SHARP 1 SPEC No. ISSUE: EL 0 8 I 0 7 2 A Slav. 24. 1996 T o ; S P EC I F I C A T I O N S Product 2 5 6k Type SRAM LH 5 2 2 5 6 C N - 8 5 L L Model No. { LH 5 2 5 C 8 N »This s p e c i f i c a t i o n s c on tains 1 6 pages including the cover and appendix.

Date Code wolfson

Abstract: MH1082 EH11 MH10 ti packing label INNER CARTON LABEL inner product
Contextual Info: w WTN_0226 Inner Product and Outer Shipping Label Specifications INTRODUCTION This document specifies the dimensions, content, layout and placement of Wolfson Microelectronics labels used for inner packaging and outer shipping containers. These are target specifications – differences may occur due to manufacturing route variations.

TM056KDH01

Abstract: TM056KDH TS056KAAAD01-01 nf lcd tv CIE1931 IEC60068-2-1 IEC60068-2-2 tianma lcd 20 pin
Contextual Info: MA AN TI NF ID EN CO TI AL SHANGHAI TIANMA MICRO-ELECTRONICS TM056KDH01 V2.2 Table of Contents Coversheet. 1 Table of Contents . 2

Marking ZB

Contextual Info: Module no:3011041 LabelId:3011041 Operator:Phoenix 18:56:18, Donnerstag, 28. Juni 2001 DLK 2,5-PE Terminal width 6.2 rigid IEC [mm ] solid DIN VDE 0611 0.2-4 2 flexible stranded AWG 0.2-2.5 24-12 I U [A] [V] 26 400 H CAg Description color Type Order No.