THOMAS SHEAR Search Results

thomas shear

Contextual Info: . I c c SEPTEMBER 29,1993 TEST REPORT #93387 QUALIFICATION TESTING 2.0 mm SOCKET MMS SERIES SAMTEC CORPORATION APPROVED BY: THOMAS PEEL TEST PROGRAM MANAGER CONTECH RESEARCH, INC. E SEPTEMBER 29,1993 TEST REPORT #93387 QUALIFICATION TESTING 2.0 mm SOCKET MMS SERIES

Revalpha

Abstract: Nitto* revalpha Nitto Denko Revalpha Revalpha NO.3195H etch uv tape and furukawa magnetron X-band microwave oven magnetron Mitsui chemicals X-band antenna
Contextual Info: Benefits and Challenges in Decreasing GaAs Through Substrate Via Size and Die Thickness Henry Hendriks, Allen Hanson, Thomas Lepkowski, Anthony Quaglietta, and Bharat Patel M/A-COM : Tyco Electronics, 100 Chelmsford Street, Lowell, MA 01851 USA Phone: 978 656-2562, Fax: (978) 656-2900, Email: hhendriks@tycoelectronics.com

thomas and betts FIBER OPTIC connector

Abstract: thomas betts 609 ACTIVE duplex connector 92800 thomas betts FIBER OPTIC 93802-500
Contextual Info: Fiber Optic Plastic Optical Fiber Interconnect D e s c r i p t i o n A p p l ic a t io n Thomas & Betts Active Duplex Rber Optic Connector integrates the benefits of light-wave communications with the advantages of electrical interconnection. It is designed to permit fast, reliable self­

535 mcm cable

Abstract: TBM15PF MCM 535 AWG cable mcm 535 IBG20-40 TBM15 53218 53223M copper bus bar torque 21940
Contextual Info: Color-Keyed Cast Copper Connectors Code Copper Cables ® I Beam Ground Clamp I-beam ground clamp for connecting ground cable to I-beam, or any 1" max. structural steel member without welding or drilling. Breakaway bolt head shears at predetermined torque to

TAG 8409

Abstract: ASTM d4066 ms3367 TC817 THOMAS BETTS TYZ528M TL075 MS3367-4-9 MS21266-2N MS3367-5-9 TYZ28M MS3367-6-0
Contextual Info: 412031.J01 TYRAP 3/12 3/14/03 11:15 AM Page 1 / Cable Fastening Systems Ty-Rap /Ty-Fast® Cable Tying System Overview .J2-J3 Ty-Rap® Cable Ties .J4-J8 Cable Ties for Special Environments .J9-J10

amerductor

Abstract: amerductor wire UL 467 tables for grounding UL467 IEEE837 UL 467 96 GP114 blackburn cast bronze conduit hub NEC250 IEEE-837 TBM15I
Contextual Info: 412031.F01 BB 3/6 3/14/03 8:31 AM Page 83 Grounding Product Overview . . . . . . . . . . . . . . . . . . . . . . . . . F84 E-Z Ground Grounding Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . F85 Grounding Connectors . . . . . . . . . . . . . . . . . . . . . F86

8 pin ic base socket round pin type lead

Abstract: idc 50 pin data ribbon connector THOMAS AND BETTS HEADER IDC CONNECTOR thomas & betts 622 series idc female solid insulation materials used in transmission line
Contextual Info: ThomasiBetts IDC Systems Reference Guide REFERENCE GUIDE I. T he M a ss T er m inatio n C o n c ep t Insulation Displacement Contact IDC m a s s t e r m in a t io n w ith f la t cable/connector systems, first pioneered in the 1960's, has evolved rapidly in recent years. Constantly

49055

Contextual Info: IDC Systems Reference Guide REFERENCE GUIDE I. THE MASS TERMINATION CONCEPT Insulation Displacement Contact IDC mass termination with flat cable/connector systems, first pioneered in the 1960’s, has evolved rapidly in recent years. Constantly pressed to meet increasing packaging

raychem JOINT procedure KIT 11kv cable shrinkable

Abstract: 11kv raychem termination kit raychem heat shrink boots raychem 11KV CABLE JOINT KIT STS221 raychem silicone grease HSFR12-6-4 raychem JOINT KIT Heat-shrinkable 11KV PANDUIT corporation tie wrap raychem heat shrinkable joint procedure
Contextual Info: 412031.N01 SHRINK 3/5 3/14/03 10:52 AM Page 1 Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . N2 Heavy Wall Heat Shrinkable Tubing . . . . . . . . . . . . . . . . . . . . . . . . . . . N3-N6 Heat Shrinkable End Caps . . . . . . . . . . . . . . . . N7

Contextual Info: 403030.05BB 3/11/02 3:42 PM Page 202 EZ Ground Compression Connectors MEETS IEEE 837 REQUIREMENTS I Beam Ground Clamp I-beam ground clamp for connecting ground cable to I-beam, or any 1" max. structural steel member without welding or drilling. Breakaway bolt head shears at predetermined torque to assure tight connection. Heavy duty compression lug provides excellent current carrying capabilities.

din 71550

Abstract: T3CG DIN 3021-3 DIN 3021-3 STANDARD 93051 5x4G transistor 5cw U80304 73021 ASTM d792
Contextual Info: 412031.QO1 TAYLOR 3/5 3/14/03 11:08 AM Page 1 Wiring Duct Wiring Duct and Accessories Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . Q2 Open Slot Flush Profile Duct . . . . . . . . . . . . . . . Q3 Vinyl Ducts Narrow Slot Flush Profile Duct . . . . . . . . . . . . Q4

NAF-0602

Abstract: WES-1334 MARKING CODE WM9 WD-26p WD-26P thomas and betts WCCP1-25S BP-0273 WC-125 D882 pm 75 WL185
Contextual Info: MEP S-2205/Technical Sec. M 28/09/99 15:44 Page 2 E-Z-Code Wire Marker System Applications for IS-SW 30 Software IS-SW 3.0 Windows Labeling System • • • • • The IS-SW 3.0 software offers the customer powerful technology allowing them to address their particular labeling needs quickly and efficiently. The

MIL-STD-750

Abstract: CK6001 UPS835LE3 1038A UPS1040E3 plaskon thomas shear UPS840e3 SEC77 qualify
Contextual Info: SCO TT SD ALE DI VI SIO N MSC POWERMITE 3 Qualification Data Completion Date: July 7, 2005 Purpose: To qualify 1 Mfg Location (PSI Technologies) (2) New Molding Compound (CK6001) (3) Matte Sn Lead Finish Reliability test Test Method Conditions SS Rejects

burndy Y35 crimping tool manual

Abstract: burndy Y35 operation manual burndy Y35 user manual burndy compression die index csa 26 burndy Y46 operation manual TBM14 TB cable lug catalogue FBC21-1 IEEE-837 15G126R
Contextual Info: Table of Contents Introduction Page 2-3 C-Taps* Page 4-5 Compression for Copper Ground Rod Tap Connectors Page 6 Compression Connectors for Steel Ground Rod Page 6 Structural Grounding Stud s - Type TBGS Page 7 Compression Ground Rod to Grid Connectors Page 8

Lodestone

Contextual Info: 11 Antique Tattoo Machine This is a soft-hit, long-stroke shader. Antique coil-style tattoo irons are still popular, and modern craftsmen create artistic and functional handmade machines. 1 Holcomb & Hoke Butter-Kist Popcorn Machine, 1919 All electric model with

TFM-125-02-S-D-LC

Contextual Info: This is to certify that the evaluation described herein was designed and executed by personnel of Contech Research, Inc. It was performed with the concurrence of Samtec Corporation who was the test sponsor. All equipment and measuring instruments used during testing were

SnPb36Ag2

Abstract: Lead Free reflow soldering profile BGA Infineon diffusion solder semiconductors cross reference philips pb-free products FeNi42 BGA Ball Crack VSO56 BGA and QFP Package freescale HTQFP100
Contextual Info: Lead-free packaging for semiconductor devices E4 presentation Infineon Technologies / ST Microelectronics / Philips Semiconductors / Freescale Semiconductor 24 March 2005 Content 1 2 3 4 5 6 7 8 9 Aim of this document Legislation Target / Status Standardisation

JFET siced

Abstract: SiC-JFET siced SiC jfet cascode SiC JFET cascode mosfet switching SiC-JFET* JFET siced SiC-JFET comparison modern power device concepts high normally off SiC-JFET cascode mosfet switching thermal perfomance SiC IGBT IGBT THEORY AND APPLICATIONS
Contextual Info: A comparison of modern power device concepts for high voltage applications: Field stop-IGBT, compensation devices and SiC devices G. Deboy, H. Hüsken, H. Mitlehner* and R. Rupp Infineon AG, P.O. Box 80 09 49, 81609 Munich, Germany *SICED Electronics Development, Paul-Gossenstr. 100, 91052 Erlangen, Germany

JESD-26

Abstract: RAI-5-039 mineral spirits bulk modulus Silicone mold release agent JESD-22 KITAGAWA MINERAL SPIRITS
Contextual Info: Package Reliability All products and packages offered by National Semiconductor Corporation meet the minimum reliability qualification requirements outlined in Table 1 and Table 2 for hermetic and plastic packages, respectively. These minimum requirements are applied to new packages as well as to existing

Copper Alloy C151

Abstract: C151 C194 BERG Electronics c151 c194 shear stress TO 92 leadframe abstract on mini ups system abstract on mini ups system circuit design et 455 PACKAGE THERMAL CHARACTERIZATION
Contextual Info: APPLICATIONS INFORMATION HIGH-PERFORMANCE POWER PACKAGE FOR POWER-INTEGRATED CIRCUIT DEVICES HIGH-PERFORMANCE POWER PACKAGE FOR POWER-INTEGRATED CIRCUIT DEVICES ABSTRACT A new, high-performance version of a Plastic Dual-In-Line package with improved reliability levels has been

"0.4mm" bga "ball collapse" height

Abstract: cga 624 ibm semi reflow temperature bga
Contextual Info: A High Performance, Low Stress, Laminate Ball Grid Array Flip Chip Carrier D. J. Alcoe, T. E. Kindl, J. S. Kresge, J. P. Libous, C. L. Tytran-Palomaki, R. J. Stutzman IBM Corporation Endicott, New York Biography Dr. David J. Alcoe joined IBM in 1982 and is the

Copper Alloy C151

Abstract: C151 C194 c194 shear stress leadframe materials c151 lead frame C151 C194 "leadframe material" DIP
Contextual Info: APPLICATIONS INFORMATION HIGH-PERFORMANCE POWER PACKAGE FOR POWER-INTEGRATED CIRCUIT DEVICES ABSTRACT A new, high-performance version of a Plastic Dual-In-Line package with improved reliability levels has been developed for high-power integrated circuit industrial and automotive

MS3367-2-9

Abstract: MS3367-5-9 MS3367-1-9 MS3367-4-9 Avery Dennison 08377 ms3367-2-0 SM4181 MS3367-7-9 ms3367-5-0 MS3368-5-9E
Contextual Info: F a s t e n e r D i v i s i o n Avery Dennison C able Tie Products F a s t e n e r D i v i s i o n Welcome to the Fastener Division of Avery Dennison, Ta b l e o f C o n t e n t s 4-5 Cable Tie Basics 6-7 Installation Tools a diversified Fortune 500 company. With sales offices in 24 countries and 200 manufacturing facilities, the company

AD8488

Contextual Info: Reliability Handbook UG-311 One Technology Way • P.O. Box 9106 • Norwood, MA 02062-9106, U.S.A. • Tel: 781.329.4700 • Fax: 781.461.3113 • www.analog.com Reliability Handbook INTRODUCTION Analog Devices, Inc., would like to thank its customers for making Analog Devices a leading supplier of high quality LSI, VLSI, and ULSI