THERMALCOTE Search Results

Contextual Info: FICHE SIGNALÉTIQUE SECTION 1 - PRODUIT ET IDENTIFICATION DE LA COMPAGNIE Nom / Identificateur du Produit: THERMALCOTE I I Usage du Produit: Le composé du transfert de chaleur Description du Produit: pâte bleu, l'odeur caractéristique tempérée Nom du Fabricant

DCVF-5 Hoja de Datos

Contextual Info: HOJA DE DATOS DE SEGURIDAD DE LOS MATERIALES SECCIÓN 1 - IDENTIFICACIÓN DEL PRODUCTO Y DE LA EMPRESA NOMBRE DEL PRODUCTO: THERMALCOTE I USO GENERAL: Compuesto de transferencia de calor DESCRIPCIÓN DEL PRODUCTO: Pasta blanca de leve olor característico

Contextual Info: MATERIAL SAFETY DATA SHEET THERMALCOTE II SECTION 1 - PRODUCT AND COMPANY IDENTIFICATION PRODUCT NAME: THERMALCOTE II PRODUCT DESCRIPTION: Blue paste, mild characteristic odor GENERAL USE: Heat transfer compound MANUFACTURER'S NAME Aavid Thermalloy, LLC. DATE PREPARED: July 12, 2010

Contextual Info: Siete 1 von 4 MATERIALSICHERHEITSDATENBLATT ABSCHNITT 1 - PRODUKT - UND HERSTELLERIDENTIFIZIERUNG PRODUKTNAME: TEILENUMMER: THERMALCOTE I ALLGEMEINE VERWENDUNG: Wärmeübertragungmittel PRODUKTBESCHREIBUNG: Weiße Paste, Schwacher Geruch NAME D. HERSTELLERS:

thermalcote

Contextual Info: FICHE SIGNALÉTIQUE SECTION 1 - PRODUIT ET IDENTIFICATION DE LA COMPAGNIE Nom / Identificateur du Produit: THERMALCOTE I Usage du Produit: Le composé du transfert de chaleur Description du Produit: pâte blanche, l'odeur caractéristique tempérée Nom du Fabricant

Contextual Info: Page 1/9 Safety Data Sheet according to 1907/2006/EC REACH , 1272/2008/EC (CLP), and GHS Printing date 11.04.2012 Revision: 03.04.2012 1 Identification of the substance/mixture and of the company/undertaking • 1.1 Product identifier · Trade name: Thermalcote I

Contextual Info: HOJA DE DATOS DE MATERIALES DE SEGURIDAD SECTION 1 - PRODUCTO / IDENTIFICACION DE COMPANIA NOMBRE DEL PRODUCTO: THERMALCOTE II USO GENERAL: Compuesto transporta caliente DESCRIPCION DEL PRODUCTO: Pasta azul, odor caracteristico suave NOMBRE DEL FABRICANTE

ppga package

Abstract: CPGA large cavity ceramic pin grid array package wire bond PLASTIC PIN GRID ARRAY PACKAGING
Contextual Info: Plastic Pin Grid Array PPGA Packaging 13.1 13 Introduction As Intel microprocessors become faster, more complex and more powerful, the demand on package performance increases. Improvements in microprocessor speed and functionality drive package design improvements in electrical, thermal and mechanical performance. Package electrical and

Aavid 251G

Abstract: MAX02NG MAX03-HNG MAX03H heat staking MAX01HNG Thermalcote THE 249 780101F00000
Contextual Info: 796-2012:QuarkCatalogTempNew 9/4/12 7:14 PM Page 796 POWER HEAT SINKS INTERCONNECT TEST & MEASUREMENT 7 IN-SIL-8 Pads, Extruded Heat Sinks, Epoxy and Adhesives Max Clip System™ Thermal Compound and Adhesives ᭤ Reduces Assembly and Labor Costs ᭤ Provides Mounting for Discrete Power Devices

PQFP 132 PACKAGE DIMENSION intel

Abstract: intel DOC pin grid array conductive trace ppga package PpGA jc thermal resistance PLASTIC PIN GRID ARRAY PACKAGING
Contextual Info: B 13 An Introduction to Plastic Pin Grid Array PPGA Packaging 5/10/97 7:47 AM 97_13_1.doc INTEL CONFIDENTIAL (until publication date) B CHAPTER 13 AN INTRODUCTION TO PLASTIC PIN GRID ARRAY (PPGA) PACKAGING 13.1. INTRODUCTION As Intel microprocessors become faster, more complex and more powerful, the demand on

thermpath

Abstract: turpentine shelf life MINERAL SPIRITS THERMPATH 167 Thermal grease silicone grease turpentine 167-35ML SPECIFIC GRAVITY silicone
Contextual Info: HEATSINKS & MOUNTINGS HEATSINK ACCESSORIES HEATSINK COMPOUNDS Thermpath A silicone-based, metal oxide filled thermal interface grease offering high thermal conductivity characteristics. Designed to displace air and fill small imperfections between mating surfaces the grease is supplied in syringe form to give precise and economic

88 lead cpga

Abstract: JEDEC Matrix Tray outlines cpu Shipping Trays outline of the heat slug for JEDEC ceramic pin grid array package wire bond I 6506 PLASTIC PIN GRID ARRAY PACKAGING
Contextual Info: 2 13 An Introduction to Plastic Pin Grid Array PPGA Packaging 1/17/97 9:53 AM CH13WIP.DOC INTEL CONFIDENTIAL (until publication date) 2 CHAPTER 13 AN INTRODUCTION TO PLASTIC PIN GRID ARRAY (PPGA) PACKAGING 13.1. INTRODUCTION As Intel microprocessors become faster, more complex and more powerful, the demand on

D3PAK

Abstract: tunnel diode application to247 pcb footprint FR4 substrate height and thickness APT9503 APT4016SN "tunnel diode" chip assembly Thermalcote THE 249
Contextual Info: APPLICATION NOTE APT9503 By Kenneth W. Dierberger and Denis R. Grafham INNOVATIVE MOUNTING TECHNIQUES ENHANCE THERMAL PERFORMANCE OF THE SURFACE-MOUNT D3 PAK PACKAGE PRESENTED AT POWERSYSTEMS WORLD INTERNATIONAL CONFERENCE & EXHIBIT SEPTEMBER 12, 1995 Page 1

250G AAVID THERMALLOY

Abstract: Thermalcote THE 249 AAVID THERMALLOY 250G 101700F00000G AAVID THERMALLOY 102000F00000G AAVID 101700F00000G 101800F00000G thermalcote 100300F00000G 100500F00000
Contextual Info: Home | Contact Us | About Aavid | Sales Rep Log In Chinese -Useful Links- / Interface Materials Products 6 / Greases Thermal Greases Search by part # » Sil - Free RoHS Compliant silicone - free synthetic thermal grease Check distributor part inventory

cafs-220

Abstract: Seasonic ss series Seventeam power supply Thermotron ST-251HR SS-235PS teac fd 235hf testo anemometer teac FD 5.25 seasonic
Contextual Info: Thermal Considerations for the Pentium III processor at 550MHz Heatsinks & Airflow in ATX chassis May 1999 Order Number: 245184-001 Thermal Considerations for the Pentium® III processor Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any

tucker

Abstract: CPGA AP-577 intel DOC CPGA large cavity ppga package Robinson Nugent pga QUAD Video Processor 208 pin ap 296-Pin Socket1
Contextual Info: E AP-577 APPLICATION NOTE An Introduction to Plastic Pin Grid Array PPGA Packaging November 1996 Order Number: 243103-002 11/27/96 12:40 PM 24310302.DOC Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or

uc3854 3kw pfc

Abstract: uc3854 Application Note Power Factor Correction With the UC3854 2kw pfc uc3854 3kw PFC 3kw APT9901 UNITRODE Claudio de Sa e Silva 3.5kw pfc 3kw uc3854
Contextual Info: APPLICATION NOTE APT9901 By: Kenneth Dierberger Denis Grafham OPTIMIZING THE DESIGN OF 3.5kW SINGLE-MOSFET POWER FACTOR CORRECTORS 1 APT9901 Optimizing The Design of 3.5kW Single-MOSFET Power Factor Correctors Kenneth Dierberger, Technical Marketing Manager

uc3854 3kw pfc

Abstract: UNITRODE Claudio de Sa e Silva PFC 3kw Power Factor Correction with the UC3854 2kw pfc sc265 triac 2kw uc3854 3kw uc3854 UC3854 for PFC 3.5kw 3.5kw pfc
Contextual Info: APT9901 By Kenneth Dierberger and Denis Grafham OPTIMIZING THE DESIGN OF 3.5KW SINGLE-MOSFET POWER FACTOR CORRECTORS OPTIMIZING THE DESIGN OF 3.5KW SINGLE-MOSFET POWER FACTOR CORRECTORS Kenneth Dierberger, Manager Technical Marketing, Advanced PowerTechnology, 405 S.W. Columbia St., Bend, OR 97702, USA

APT5010LVR

Abstract: TO264 footprint APT5010B2VR 072K barco APT9902 094k SIL-PAD to-247 Orcus
Contextual Info: APPLICATION NOTE By: APT9902 Denis Grafham CUTTING-EDGE MOUNT DOWN METHODS BOOST POWER SEMICONDUCTOR PERFORMANCE 1 APT9902 Cutting-Edge Mount Down Methods Boost Power Semiconductor Performance and Cut System Costs Denis Grafham, European Applications Advanced Power Technology

transistor cross reference

Abstract: MPT3N40 Westinghouse SCR handbook LT 8224 ZENER DIODE sje389 N9602N npn transistor RCA 467 TFK 7 segment displays PUT 2N6027 delco 466
Contextual Info: C K TBD DOLLY LIST LOGO LIST SAFETY & RELIABLTY TEK PN SYSTEM II DIGITAL IC's MEMORIES. MOS. CM OS.ECL. TTL MICROPROCESSOR SPECIAL FUNCTION IC's DIGITAL / LINEAR ARRAYS LINEAR IC'S (PURCH) TEK-MADE IC’s 3 IC's INDEX (COLORED PGS) INCL PRGMD. SCRND.ETC

smd diode K10

Abstract: switching transformer 300w fuse 6.3A 250v IR1150 800V dc to dc boost converter 019-4119-00 C8100 10BQ040N SIL-PAD to-247 330uf 450v
Contextual Info: Computing & Communications SBU - AC-DC APPLICATIONS GROUP 101 N.Sepulveda Blvd., EL Segundo 90245 CALIFORNIA, USA IRAC1150-300W Demo Board User’s Guide Rev.2.2 3/29/2005 Rev. 2.2 3/29/2005 International Rectifier Page 1 of 17 Table of Contents 1

cafs-220

Abstract: Thermotron WP-499-THCM2-705 FD-235HF CAFS-220-5M TEAC FLOPPY ST39140A testo anemometer thermalcote ST39140
Contextual Info: Thermal Airflow Considerations SECC2 OLGA HEAT SINK COOLING IN AN ATX CHASSIS February 1999 Order Number: 245139-001 Thermal Airflow Considerations Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any

thermpath

Abstract: turpentine shelf life THERMPATH 167 thermstrate thermal conductivity Thermally conductive compounds MINERAL SPIRITS THERMALCOTE ACTIVATOR MESS
Contextual Info: PRODUCTION AIDS ADHESIVES/COMPOUNDS THERMALLY CONDUCTIVE ADHESIVE HEATSINK COMPOUNDS Output 315 Thermstrate ® TC A thermally conductive adhesive designed for bonding electronic components to heatsinks or PCBs, eliminating the need for mechanical retention. The high thermal conductivity ensures excellent heat transfer.

TT 2222 Horizontal Output Transistor pins out dia

Abstract: bgs2 7130D MS35649-264 TRANSISTOR REPLACEMENT GUIDE d882 D882 TRANSISTOR circuit example ASTM D2520 PF434 6032B-TT 579103C
Contextual Info: General information How to use this standard part catalog. 2