THERMAL RESISTANCE CASE HEAT SINK Search Results

WESTINGHOUSE transistor

Abstract: Westinghouse CO 8 westinghouse relay westinghouse transistors westinghouse semiconductor westinghouse power transistor 2N2761 2N2771 2N2770 westinghouse
Contextual Info: Westinghouse Therm al Characteristics Thermal resistance, 0 jc , #C /w a tt, max. .0.5 Power dissipation, P j at T c = 7 5 °C w atts, max. 200 Typical thermal drop, case to heat sink, ° C /w a tt.0.3

sot23 theta jc value

Abstract: DS18S201-Wire Theta JB 8-Pin TSSOP theta jc value an3930 DS1621 DS1624 TSSOP173 DS1822 DS1825
Contextual Info: Maxim > App Notes > 1-Wire DEVICES GENERAL ENGINEERING TOPICS TEMPERATURE SENSORS and THERMAL MANAGEMENT MEASUREMENT CIRCUITS Keywords: Theta JA, Theta JC, theta-ja, theta-jc, self heating, thermal dissipation, heat dissipation, power dissipation, thermal resistance, junction to case, junction to ambient, temperature, sensor, temperature

Contextual Info: GBPC 12, 15, 25, 35 SERIES Bridge Rectifiers Glass Passivated Features • Integrally molded heat-sink provided very low thermal resistance for maximum heat dissipation. • Surge Overload Ratings from 300 A to 400 A. • Isolated voltage from case to lead over 2500 V.

Contextual Info: GBPC 12, 15, 25, 35 SERIES Bridge Rectifiers Glass Passivated Features • Integrally molded heat-sink provided very low thermal resistance for maximum heat dissipation. • Surge Overload Ratings from 300 A to 400 A. • Isolated voltage from case to lead over 2500 V.

2K40

Abstract: MIL-R-39009 TAH20
Contextual Info: FEATURES • 20 Watt Power Rating at 25°C Case Temperature • High Pulse Tolerant Design • Quick-snap Molded Package • Very Low Inductance Design • Resistor Package Electrically Isolated from Heat Sink • Low Thermal Resistance to Heat Sink @ RTH<6.25°C/W

Contextual Info: FEATURES • 20 Watt Power Rating at 25°C Case Temperature • High Pulse Tolerant Design • Quick-snap Molded Package • Very Low Inductance Design • Resistor Package Electrically Isolated from Heat Sink • Low Thermal Resistance to Heat Sink @ RTH<6.25°C/W

heat sink to220

Abstract: 680 ohms resistor 5 watt datasheet power resistor 0,25 ohms encapsulated 2K40 MIL-R-39009 TAH20
Contextual Info: FEATURES • 20 Watt Power Rating at 25°C Case Temperature • High Pulse Tolerant Design • Quick-snap Molded Package • Very Low Inductance Design • Resistor Package Electrically Isolated from Heat Sink • Low Thermal Resistance to Heat Sink @ RTH<6.25°C/W

Contextual Info: GBPC 12, 15, 25, 35 SERIES Bridge Rectifiers Glass Passivated Features • Integrally molded heat-sink provided very low thermal resistance for maximum heat dissipation. • Surge Overload Ratings from 300 A to 400 A. • Isolated voltage from case to lead over 2500 V.

TR35

Abstract: TR-35 2R20 MIL-R-39009 tr3502 TR35-02
Contextual Info: SYNTON-TECH CORPORATION POWER RESISTORS File No. : Version : Page : Date : TR35-02 A 1/7 2008.01.01 FEATURES z 35 Watt @25℃ Case Temperature Heat Sink Mounted. z TO-220 Style Power Package. z Single Screw Mounting to Heat Sink. z Low Thermal Resistance to Heat Sink @Rth<4.28 ℃/W.

FPIR

Abstract: MINIBRIDGE MPIR 4040 FPIR32 KPIR50 MPIR40 MPIR4040 MPIR 40100 KPIR5005
Contextual Info: FPIR32 MPIR40 KPIR50 MINIBRIDGE FAST RECOVERY, 32, 40 and 50 AMPERES INTEGRALLY MOLDED HEAT SINKS PROVIDE VERY LOW THERMAL RESISTANCE This mark indicates recognition under the component program of Underwriters Laboratories, inc. Our unique case construction enables the closer molding of integrated heat sink to the

SO10 package

Abstract: 573300D00010G 7106DG MO-184 7109DG 4040 footprint 573400D00010G heat sink 7106D 7109D
Contextual Info: SMT Surface mount heat sink for D-PAK TO-252 package semiconductors 80 20 60 15 40 10 Case Temp Rise Rise Above Ambient—°C 20 5 0.0 0.5 1.0 1.5 2.0 Heat Dissipated—Watts 8.00 (0.315) Thermal Resistance From MTG Surface to Ambient—°C/Watt 1000 25

Contextual Info: FEATURES SPECIFICATIONS • 85 Watt power rating at 25°C case temperature • Non-inductive performance • Low thermal resistance • RoHS compliant design • Two or three terminals versions available • Heat sink can be grounded through middle terminal P style

Contextual Info: FEATURES SPECIFICATIONS • 85 Watt power rating at 25°C case temperature • Non-inductive performance • Low thermal resistance • RoHS compliant design • Two or three terminals versions available • Heat sink can be grounded through middle terminal P style

Contextual Info: FEATURES SPECIFICATIONS • 70 Watt power rating at 25°C case temperature • Non-inductive performance • Low thermal resistance • RoHS compliant design • Two or three terminals versions available • Heat sink can be grounded through middle terminal P style

2N1016

Abstract: 1LQ1 2N1015 Westinghouse westinghouse transistors westinghouse semiconductor 2N1016E zru 2 2N1015C 2n1016b
Contextual Info: W e stin g h o u s e Therm al C h a ra cteristics •Thermal resistance, 0jc» ‘ C/w att, max. Derating factor, W a tts / 'C . *Typical thermal drop, case to heat sink, ° C /w a tt. T O 54-661 Page 1 -u I ru \

Thick Film

Contextual Info: Features Sp e c i f i c a t i o n s • 85 Watt power rating at 25°C case temperature • Non-inductive performance • Low thermal resistance • RoHS compliant design • Two or three terminals versions available • Heat sink can be grounded through middle terminal P style

10R2

Abstract: 400M
Contextual Info: Features Sp e c i f i c a t i o n s • 85 Watt power rating at 25°C case temperature • Non-inductive performance • Low thermal resistance • RoHS compliant design • Two or three terminals versions available • Heat sink can be grounded through middle terminal P style

Contextual Info: Features Sp e c i f i c a t i o n s • 85 Watt power rating at 25°C case temperature • Non-inductive performance • Low thermal resistance • RoHS compliant design • Two or three terminals versions available • Heat sink can be grounded through middle terminal P style

TEH70 Series

Abstract: Thick Film
Contextual Info: TEH70 Series 70 Watt TO247 Package Thick Film Power F e a t u r es • 70 Watt power rating at 25°C case temperature • Non-inductive performance • Low thermal resistance • RoHS compliant design • Two or three terminal versions available • Heat sink can be grounded through middle terminal P style

TMS320

Abstract: TX75243
Contextual Info: TMS320 DSP Number 91 DESIGNER’S NOTEBOOK TMS320C6x Thermal Design Considerations Contributed by David Bell April 29, 1998 Design Problem Thermal analysis and heat sink selection for the TMS320C6x. Solution Like most high-performance processors, the ‘C6x dissipates some thermal energy during

lineal

Abstract: 6299B thermalloy to-3
Contextual Info: Thermal Management JSA A Thermal Primer Thermal resistance, heat sink to ambient free air Ambient temperature Micrel low dropout (LDO) regulators are very easy to use. Only one external filter capacitor is nec­ essary for operation, so the electrical design effort is

In-Sil-8

Abstract: 658-25AB 658-35AB
Contextual Info: Using Heat Sinks with Larger CPLDs Introduction Increasing operating frequencies and decreasing sizes of semiconductor devices have made heat dissipation and thermal management an important issue. Both the life expectancy and reliability of a device are inversely proportional to its operating temperature. Therefore, it is essential that the operating temperature of a device is kept within the limits set by the

32-PIN

Abstract: ADS-117 HS-24 TCA 290
Contextual Info: Application Note AN-8 ® Heat Sinks for Data Converters Design engineers constantly look for ways to reduce the effects of high operating temperatures in hybrid data converters Heat sinks provide a proven solution By Joe Coupal, DATEL, Inc. Electrical performance of high precision electronic components, such as hybrid type Data Converters, is very temperature sensitive. These devices generally operate much more

Contextual Info: SSR Thermal Considerations One of the major considerations when using a SSR, which cannot be stressed too strongly, is that an effective method of removing heat from the SSR package must be employed. The most common method is to employ a heat sink. SSR’s have a relatively high