THERMAL GAP FILLER Search Results

D149

Abstract: D150 D2240 D257 D412 E595 IPC-TM650
Contextual Info: T-flex 600 Series Thermal Gap Filler global solutions : local support ™ T-flexTM 600 Series Thermal Gap Filler Exceptionally soft, highly compressible gap filler T-flex™ 600 is an exceptionally soft, highly compressible gap filling interface pad with a thermal conductivity of 3 W/mK. These

D149

Abstract: D150 D2240 D257 D412 E595
Contextual Info: T-flex 600 Series Thermal Gap Filler global solutions : local support ™ T-flexTM 600 Series Thermal Gap Filler Exceptionally soft, highly compressible gap filler T-flex™ 600 is an exceptionally soft, highly compressible gap filling interface pad with a thermal conductivity of 3 W/mK. These

D2240

Abstract: D257 E595
Contextual Info: TflexTM 700 Series Thermal Gap Filler Innovative Technology for a Connected World HIGH THERMAL CONDUCTIVITY COMPLIANT GAP FILLER Tflex 700 is a 5 W/mK soft gap filler thermal interface material with great thermal performance and high compliancy. The soft interface pad conforms to component

D149

Abstract: D150 D2240 D257 D412 E595
Contextual Info: T-flex 200V0 Series Thermal Gap Filler global solutions : local support ™ T-flexTM 200V0 Series Thermal Gap Filler Soft, freestanding gap filler T-flex™ 200 V0 is a very soft, freestanding gap filler that is more compliant than most other gap fillers.

Contextual Info: TflexTM HR400 Series Thermal Gap Filler Innovative Technology for a Connected World MID-PERFORMANCE GAP FILLER WITH 1.8 W/MK Tflex HR400 is a cost-effective and compliant gap filler thermal interface material with excellent thermal performance and great handling for mass-production applications.

Contextual Info: TflexTM HR200 Series Thermal Gap Filler Innovative Technology for a Connected World PRELIMINARY MID-PERFORMANCE GAP FILLER WITH 1.6 W/MK Tflex HR200 is a cost-effective and compliant gap filler thermal interface material with excellent thermal performance and great handling for mass-production applications.

A15999-00

Abstract: D2240 ASTM D5470 ASTM-D-257 HR610FG D257 E595 HR600 HR6120 HR-60
Contextual Info: Tflex HR600 Series TM Thermal Gap Filler Innovative Technology for a Connected World Mid-Performance Gap Filler with 3 W/mK Tflex HR600 is a cost-effective and compliant gap filler thermal interface material with excellent thermal performance and great handling for mass-production applications.

Thermal Gap Filler

Abstract: D149 D2240 D257 D412 E595
Contextual Info: TflexTM 200 V0 Series Thermal Gap Filler Innovative Technology for a Connected World SOFT, FREESTANDING GAP FILLER Tflex 200 V0 is a very soft, freestanding gap filler that is more compliant than most other gap fillers. Combining good thermal conductivity of 1.1 W/mK with high conformability, this

D149

Abstract: D150 D2240 D257 D412 E595 Outgassing
Contextual Info: T-flex 300 Series Thermal Gap Filler global solutions : local support ™ T-flexTM 300 Series Thermal Gap Filler Features and Benefits: Unique silicone gel offers compliancy, thermal resistance • Extreme compliancy allows material to “totally blanket” component s

A16311

Abstract: XS460
Contextual Info: TflexTM XS400 Series Thermal Gap Filler Innovative Technology for a Connected World Compliant 2.0 W/mK Thermally Conductive Gap Filler Tflex XS400 is a compliant elastomer gap filler designed to provide moderate thermal performance. This soft interface pad conforms well with minimal pressure, resulting in little

ADHESIVE GAP PAD

Abstract: D575 D2240 D257 E595 low outgassing materials
Contextual Info: TflexTM 500 Series Thermal Gap Filler Innovative Technology for a Connected World Compliant 2.8 W/mK Thermally Conductive Gap Filler Tflex 500 is a compliant elastomer gap filler designed to provide excellent thermal performance while remaining cost effective. This soft interface pad conforms well with

D149

Abstract: D150 D2240 D257 D412 E595
Contextual Info: TflexTM 600 Series Thermal Gap Filler Innovative Technology for a Connected World Exceptionally soft, highly compressible gap filler Tflex 600 is an exceptionally soft, highly compressible gap filling interface pad with a thermal conductivity of 3 W/mK. These outstanding properties are the result of a

BERGQUIST

Abstract: 3000S30 conductivity
Contextual Info: Gap Pad 3000S30 Thermally Conductive, Reinforced, Soft “S-Class” Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD 3000S30 PROPERTY Color • Thermal conductivity: 3.0 W/m-K • Low “S-Class” thermal resistance at very low pressures

SoftFlex

Contextual Info: DATASHEET SOFTFLEX GAP FILLER LIGHT FLEXIBLE THERMAL GAP FILLING PADS The Aavid SoftFlex series is our most flexible and diverse line of thermal conductive pads. The compressibility and adhesion features enable a dramatic reduction in thermal resistance when mounting. The unique flexibility of the SoftFlex base material provides

ASF600

Contextual Info: TflexTM SF600 DF Series Thermal Gap Filler Innovative Technology for a Connected World COMPLIANT SILICONE-FREE 2.8-3.0 W/mK THERMALLY CONDUCTIVE GAP FILLER Tflex SF600 DF is a high performance, silicone-free thermal gap filler with a conductivity of 2.8 - 3.0 W/mK. Tflex™ SF600 DF is designed for applications which are silicone sensitive.

Contextual Info: TflexTM 200T V0 Series Thermal Gap Filler Innovative Technology for a Connected World THIN THERMALLY CONDUCTIVITY ELASTOMERIC INTERFACE MATERIAL Tflex 200T V0 is a specially formulated thin gap filler thermal interface material designed for thin interfaces that require a combination good thermal performance with great reliability. The elastomeric property of Tflex™ 200T V0 provides good thermal performance in

D150

Abstract: D2240 D257 D412 E595 D149 TPLITM220
Contextual Info: T-pli 200 Series Gap Filler global solutions : local support ™ T-pliTM 200 Series Gap Filler Features and Benefits: Exceptionally soft, highly compressible gap filler • Thermal performance leader T-pli™ 200 is a premium gap filler. A unique blend of boron

Contextual Info: TputtyTM 506 Series Gap Filler Material Innovative Technology for a Connected World SOFT, SILICONE PUTTY Tputty 506 is a soft, single part, silicone putty thermal gap filler in which no cure is required. This gap filler is ideal for applications where large gap tolerances are present and in which traditional gap filler

CR200

Contextual Info: TflexTM CR200 Series Gap Filler Material Preliminary TWO-PART CURE IN PLACE GAP FILLER Tflex CR200 is a two-part, silicone-based thermal gap filler that has low viscosity prior to curing. Tflex™ CR200 is ideal for applications where large gap tolerances are present.

Contextual Info: Laird Technologies Web site: www.LairdTech.com Tflex 300 Series Gap Filler Material Ultra Compliant, Thermal Gap Filler for High-Speed Computing and Telecommunications Applications Tflex™ 300 is a silicone gel combined with a ceramic powder to offer an unique combination of compliancy, thermal

bergquist

Contextual Info: Gap Filler 1000 Two-Part Thermally Conductive, Liquid Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP FILLER 1000 PROPERTY Color / Part A • Thermal conductivity: 1.0 W/m-K • Ultra-conforming, designed for fragile and low-stress applications

Contextual Info: Gap Filler1000SR Two-Part Thermally Conductive, Liquid Gap Filler Material Features and Benefits • Thermal Conductivity: 1.0 W/m-K • Excellent slump resistance (stays in place) TYPICAL PROPERTIES OF GAP FILLER 1000SR PROPERTY Color / Part A IMPERIAL VALUE

Contextual Info: Gap Filler 1100SF Two-Part Thermally Conductive, Silicone-Free, Liquid Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP FILLER 1100SF PROPERTY Color / Part A • Thermal conductivity: 1.1 W/m-K • No silicone outgassing or extraction

Contextual Info: Gap Filler 1500 Two-Part Thermally Conductive Liquid Gap Filling Material Features and Benefits T YPICAL PROPERT IES OF GAP FILLER 1500 • Thermal conductivity:1.8 W/mK PROPERTY Color / Part A IMPERIAL VALUE Yellow • Optimized shear thinning characteristics for