TTL RS232 Level Converter
Abstract: maxim 1987 MAX3232CSE maxim max 1987 4000 Series Integrated Infrared Transceiver Cannon connectors CMOS RS232 Level Converter sub-d9 "Infrared TRANSCEIVER" DATASHEET capacitor Vishay VJ 1206
Contextual Info: TOIM4232 Vishay Semiconductors SIR Endec for IrDA Applications Integrated Interface Circuits ULC Technology: High-performance gate array package using multiple metal layer CMOS technology featuring sub-micron channel lengths 0.35 mm Description The TOIM4232 Endec IC provides proper pulse
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oim42324000-seriesrs232d-74025+1131-jul-02ttl rs232 level convertermaxim 1987max3232csemaxim max 19874000 series integrated infrared transceivercannon connectorscmos rs232 level convertersub-d9infrared transceiver" datasheetcapacitor vishay vj 1206
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16550 uart national and Application Not
Abstract: TFDS4100 CRCW maxim 1987 maxim max 1987 EIA232 MAX232 TFDS4000 TFDU4100 XT49M
Contextual Info: TOIM4232 Vishay Telefunken SIR Endec for IrDA Applications Integrated Interface Circuits ULC Technology: High-performance gate array package using multiple metal layer CMOS technology featuring sub-micron channel lengths 0.35 mm Description The TOIM4232 Endec IC provides proper pulse
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oim42324000-seriesrs232d-74025+1115-mar-0116550 uart national and application nottfds4100crcwmaxim 1987maxim max 1987eia232max232tfds4000tfdu4100xt49m
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TFDU4500
Abstract: TFDS4100 1N4148 1206 CRCW maxim 1987 maxim max 1987 EIA232 MAX232 TFDS4000 TFDU4100
Contextual Info: TOIM4232 Vishay Telefunken SIR Endec for IrDA Applications Integrated Interface Circuits ULC Technology: High-performance gate array package using multiple metal layer CMOS technology featuring sub-micron channel lengths 0.35 mm Description The TOIM4232 Endec IC provides proper pulse
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oim42324000-seriesrs232d-74025+1115-mar-01tfdu4500tfds41001n4148 1206crcwmaxim 1987maxim max 1987eia232max232tfds4000tfdu4100
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tfdu4500
Abstract: TFDS4500 TFDS6000
Contextual Info: VISHAY ▼ Package Qualification Vishay Telefunken Standard Module Solderability Test Description Preage 16 h at 155°C, Solder 215°C Preage 16 h at 155°C, Solder 235°C Device Type Duration TFDS3000 Failures Remarks 2s Sample Size 20 also a lot by lot test
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OCR Scan
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tfds3000tfds4500tfds6000tfdu4100+1tfdu4500
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